摘要:
A GaN layer is grown on a sapphire substrate, an SiO2 film is formed on the GaN layer, and a GaN semiconductor layer including an MQW active layer is then grown on the GaN layer and the SiO2 film using epitaxial lateral overgrowth. The GaN based semiconductor layer is removed by etching except in a region on the SiO2 film, and a p electrode is then formed on the top surface of the GaN based semiconductor layer on the SiO2 film, to join the p electrode on the GaN based semiconductor layer to an ohmic electrode on a GaAs substrate. An n electrode is formed on the top surface of the GaN based semiconductor layer.
摘要:
A GaN layer is grown on a sapphire substrate, an SiO2 film is formed on the GaN layer, and a GaN semiconductor layer including an MQW active layer is then grown on the GaN layer and the SiO2 film using epitaxial lateral overgrowth. The GaN based semiconductor layer is removed by etching except in a region on the SiO2 film, and a p electrode is then formed on the top surface of the GaN based semiconductor layer on the SiO2 film, to join the p electrode on the GaN based semiconductor layer to an ohmic electrode on a GaAs substrate. An n electrode is formed on the top surface of the GaN based semiconductor layer.
摘要:
A GaN layer is grown on a sapphire substrate, an SiO2 film is formed on the GaN layer, and a GaN semiconductor layer including an MQW active layer is then grown on the GaN layer and the SiO2 film using epitaxial lateral overgrowth. The GaN based semiconductor layer is removed by etching except in a region on the SiO2 film, and a p electrode is then formed on the top surface of the GaN based semiconductor layer on the SiO2 film, to join the p electrode on the GaN based semiconductor layer to an ohmic electrode on a GaAs substrate. An n electrode is formed on the top surface of the GaN based semiconductor layer.
摘要:
A GaN layer is grown on a sapphire substrate, an SiO2 film is formed on the GaN layer, and a GaN semiconductor layer including an MQW active layer is then grown on the GaN layer and the SiO2 film using epitaxial lateral overgrowth. The GaN based semiconductor layer is removed by etching except in a region on the SiO2 film, and a p electrode is then formed on the top surface of the GaN based semiconductor layer on the SiO2 film, to join the p electrode on the GaN based semiconductor layer to an ohmic electrode on a GaAs substrate. An n electrode is formed on the top surface of the GaN based semiconductor layer.
摘要:
An inner tubular portion (15) and an outer tubular portion (16) form an insertion space (14) of a plastic pipe (11) and are integrally formed on a joint main body (13). A cap (29) is connected to the outer tubular portion (16) by projection-recess engagement. A retainer mechanism (27) of the plastic pipe (11) is provided between the outer tubular portion (16) and the cap (29). A cutout portion (20) is formed in the outer tubular portion (16), and a bulging engagement portion (24) is arranged on the cutout portion (20). The outer periphery of the bulging engagement portion (24) is connected to the cap (29) by the projection-recess engagement. A restricting portion is provided between the cutout portion (20) and the bulging engagement portion (24). The restricting portion is composed of a first tapered surface (21) and a second tapered surface (25). The first tapered surface (21) is provided on the cutout portion (20) and decreases in width toward the outer end. The second tapered surface (25) is provided on the bulging engagement portion (24) and engaged with the first tapered surface (21).
摘要:
An inner tubular portion (15) and an outer tubular portion 16 for forming an insertion space for a plastic pipe (11) are formed integrally with a joint body (13). Two fitting grooves (17) are formed in the outer peripheral surface of the inner tubular portion 15. Two sealing members (18) for maintaining water-tightness in the gap between the plastic pipe (11) received in the insertion space and the inner tubular portion (15) are fitted in the corresponding fitting grooves 17. A pair of view windows (25) for visually checking the fitting grooves (17) and the sealing members (18), which are fitted in the fitting grooves (17), from the exterior are formed in the outer tubular portion (16). The view windows (25) are arranged at opposing positions.
摘要:
In the optical waveguide which comprises a core layer to be an optical transmission region and an upper clad layer and a lower clad layer covering the surrounding of the core layer and of which the upper clad layer is formed while being shrunk in the volume, a stress moderating layer formed a material with a smaller storage modulus than that of the upper clad layer is formed between the upper clad layer and the lower clad layer in at least a portion of a region where the upper clad layer and the lower clad layer are brought into contact with each other.
摘要:
Disclosed herein is an optical waveguide comprising a core layer to be an optical waveguide region, an upper clad layer covering the core layer and a lower clad layer, characterized in that an ultraviolet control region for preventing ultraviolet light from entering is provided at any one location of under the lower clad layer, on an interface of the lower clad layer and the upper clad layer, and on the upper clad layer. And a method of fabricating this optical waveguide is also disclosed.
摘要:
A nitride-based semiconductor element having superior mass productivity and excellent element characteristics is obtained. This nitride-based semiconductor element comprises a substrate comprising a surface having projection portions, a mask layer formed to be in contact with only the projection portions of the surface of the substrate, a first nitride-based semiconductor layer formed on recess portions of the substrate and the mask layer and a nitride-based semiconductor element layer, formed on the first nitride-based semiconductor layer, having an element region. Thus, the first nitride-based semiconductor layer having low dislocation density is readily formed on the projection portions of the substrate and the mask layer through the mask layer serving for selective growth. When the nitride-based semiconductor element layer having the element region is grown on the first nitride-based semiconductor layer having low dislocation density, a nitride-based semiconductor element having excellent element characteristics can be readily obtained. The first nitride-based semiconductor layer is formed through only single growth on the substrate, whereby a nitride-based semiconductor element having excellent mass productivity is obtained.
摘要:
Disclosed herein is an optical waveguide comprising a core layer to be an optical transmission region, an upper clad layer and a lower clad layer covering the core layer, in which the core layer, the upper clad layer and the lower clad layer are formed from resin materials, characterized in that a microlens made of a material having a higher refractive index than that of a material constituting said core layer is disposed in the vicinity of an end face of said core layer.