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21.发明授权公开(公告)号：US08283191B2
公开(公告)日：2012-10-09
申请号：US12990243
申请日：2009-06-09
申请人： Patrick Rode , Martin Strassburg , Karl Engl , Lutz Höppel
发明人： Patrick Rode , Martin Strassburg , Karl Engl , Lutz Höppel
CPC分类号： H01L33/382 , H01L33/007 , H01L33/0079 , H01L33/14 , H01L33/22 , H01L33/62 , H01L2224/48
摘要： In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence.
摘要翻译： 在制造光电子部件的方法中，提供具有第一热膨胀系数的生长衬底。 向其施加多层缓冲层序列。 随后沉积具有不同于第一热膨胀系数的第二热膨胀系数的层序列。 它还包括用于发射电磁辐射的有源层。 随后将载体衬底施加在外延沉积层序列上。 去除生长衬底，并且构造多层缓冲层序列以增加电磁辐射的耦合。 最后，用外延沉积层序列进行接触。
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公开(公告)号：US20110049555A1
公开(公告)日：2011-03-03
申请号：US12921379
申请日：2009-03-13
申请人： Karl Engl , Lutz Hoeppel , Patrick Rode , Matthias Sabathil
发明人： Karl Engl , Lutz Hoeppel , Patrick Rode , Matthias Sabathil
CPC分类号： H01L33/382 , H01L33/10 , H01L33/40 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor chip has a semiconductor layer sequence having an active layer that generates radiation between a layer of a first conductivity type and a layer of a second conductivity type. The layer of the first conductivity type is adjacent to a front side of the semiconductor layer sequence. The semiconductor layer sequence contains at least one cutout extending from a rear side, lying opposite the front side, of the semiconductor layer sequence through the active layer to the layer of the first conductivity type. The layer of the first conductivity type is electrically connected through the cutout by means of a first electrical connection layer which covers the rear side of the semiconductor layer sequence at least in places.
摘要翻译： 光电子半导体芯片具有半导体层序列，该半导体层序列具有在第一导电类型的层和第二导电类型的层之间产生辐射的有源层。 第一导电类型的层与半导体层序列的正面相邻。 半导体层序列包含从半导体层序列通过有源层延伸到第一导电类型的层的从前侧的与背面相对的至少一个切口。 第一导电类型的层通过第一电连接层通过切口电连接，第一电连接层至少在某些地方覆盖半导体层序列的后侧。
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公开(公告)号：US20100230698A1
公开(公告)日：2010-09-16
申请号：US12678259
申请日：2008-08-27
申请人： Patrick Rode , Karl Engl , Martin Strassburg , Lutz Hoeppel , Matthias Sabathil
发明人： Patrick Rode , Karl Engl , Martin Strassburg , Lutz Hoeppel , Matthias Sabathil
CPC分类号： H01L33/405 , H01L33/007 , H01L33/40 , H01L33/58 , H01L2933/0091
摘要： An optoelectronic semiconductor body includes a substrate with a front side for emitting electromagnetic radiation. The optoelectronic semiconductor body has a semiconductor layer sequence that is arranged on a rear side of the substrate and has an active layer suitable for generating the electromagnetic radiation. The optoelectronic semiconductor body also includes first and second electrical connection layers that are arranged on a first surface of the semiconductor body that faces away from the substrate.
摘要翻译： 光电子半导体本体包括具有用于发射电磁辐射的前侧的衬底。 光电半导体本体具有布置在衬底的后侧上的半导体层序列，并且具有适于产生电磁辐射的有源层。 光电子半导体本体还包括布置在半导体本体的远离衬底的第一表面上的第一和第二电连接层。
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公开(公告)号：US08928052B2
公开(公告)日：2015-01-06
申请号：US12921379
申请日：2009-03-13
申请人： Karl Engl , Lutz Hoeppel , Patrick Rode , Matthias Sabathil
发明人： Karl Engl , Lutz Hoeppel , Patrick Rode , Matthias Sabathil
IPC分类号： H01L31/062 , H01L31/113 , H01L33/38 , H01L33/40 , H01L33/46 , H01L33/62
CPC分类号： H01L33/382 , H01L33/10 , H01L33/40 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor chip has a semiconductor layer sequence having an active layer that generates radiation between a layer of a first conductivity type and a layer of a second conductivity type. The layer of the first conductivity type is adjacent to a front side of the semiconductor layer sequence. The semiconductor layer sequence contains at least one cutout extending from a rear side, lying opposite the front side, of the semiconductor layer sequence through the active layer to the layer of the first conductivity type. The layer of the first conductivity type is electrically connected through the cutout by means of a first electrical connection layer which covers the rear side of the semiconductor layer sequence at least in places.
摘要翻译： 光电子半导体芯片具有半导体层序列，该半导体层序列具有在第一导电类型的层和第二导电类型的层之间产生辐射的有源层。 第一导电类型的层与半导体层序列的正面相邻。 半导体层序列包含从半导体层序列通过有源层延伸到第一导电类型的层的从前侧的与背面相对的至少一个切口。 第一导电类型的层通过第一电连接层通过切口电连接，第一电连接层至少在某些地方覆盖半导体层序列的后侧。
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公开(公告)号：US08362506B2
公开(公告)日：2013-01-29
申请号：US12678259
申请日：2008-08-27
申请人： Patrick Rode , Karl Engl , Martin Strassburg , Lutz Hoeppel , Matthias Sabathil
发明人： Patrick Rode , Karl Engl , Martin Strassburg , Lutz Hoeppel , Matthias Sabathil
CPC分类号： H01L33/405 , H01L33/007 , H01L33/40 , H01L33/58 , H01L2933/0091
摘要： An optoelectronic semiconductor body includes a substrate with a front side for emitting electromagnetic radiation. The optoelectronic semiconductor body has a semiconductor layer sequence that is arranged on a rear side of the substrate and has an active layer suitable for generating the electromagnetic radiation. The optoelectronic semiconductor body also includes first and second electrical connection layers that are arranged on a first surface of the semiconductor body that faces away from the substrate.
摘要翻译： 光电子半导体本体包括具有用于发射电磁辐射的前侧的衬底。 光电半导体本体具有布置在衬底的后侧上的半导体层序列，并且具有适于产生电磁辐射的有源层。 光电子半导体本体还包括布置在半导体本体的远离衬底的第一表面上的第一和第二电连接层。
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26.发明申请公开(公告)号：US20110104836A1
公开(公告)日：2011-05-05
申请号：US12990243
申请日：2009-06-09
申请人： Patrick Rode , Martin Strassburg , Karl Engl , Lutz Höppel
发明人： Patrick Rode , Martin Strassburg , Karl Engl , Lutz Höppel
IPC分类号： H01L33/00
CPC分类号： H01L33/382 , H01L33/007 , H01L33/0079 , H01L33/14 , H01L33/22 , H01L33/62 , H01L2224/48
摘要： In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A layer sequence having a second coefficient of thermal expansion—different than the first coefficient of thermal expansion—is subsequently deposited epitaxially. It furthermore comprises an active layer for emitting electromagnetic radiation. A carrier substrate is subsequently applied on the epitaxially deposited layer sequence. The growth substrate is removed and the multilayered buffer layer sequence is structured in order to increase a coupling-out of electromagnetic radiation. Finally, contact is made with the epitaxially deposited layer sequence.
摘要翻译： 在制造光电子部件的方法中，提供具有第一热膨胀系数的生长衬底。 向其施加多层缓冲层序列。 随后沉积具有不同于第一热膨胀系数的第二热膨胀系数的层序列。 它还包括用于发射电磁辐射的有源层。 随后将载体衬底施加在外延沉积层序列上。 去除生长衬底，并且构造多层缓冲层序列以增加电磁辐射的耦合。 最后，用外延沉积层序列进行接触。
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公开(公告)号：US08823037B2
公开(公告)日：2014-09-02
申请号：US13376006
申请日：2010-05-21
申请人： Markus Maute , Karl Engl
发明人： Markus Maute , Karl Engl
CPC分类号： H01L33/382 , H01L33/20 , H01L33/44
摘要： An optoelectronic semiconductor body has a front face provided for the emission and/or reception of electromagnetic radiation, a rear face which lies opposite the front face and is provided for application onto a support plate, and an active semiconductor layer sequence which in the direction from the rear face to the front face includes a layer of a first conductivity type, an active layer and a layer of a second conductivity type in this sequence.
摘要翻译： 光电子半导体本体具有用于发射和/或接收电磁辐射的前表面，与前表面相对设置的后表面，用于施加到支撑板上，并且有源半导体层序列沿着从 该前表面的后表面包括第一导电类型，有源层和第二导电类型的层。
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公开(公告)号：US08526476B2
公开(公告)日：2013-09-03
申请号：US12598747
申请日：2008-04-24
IPC分类号： H01S5/00
CPC分类号： H01L33/405 , H01L33/0079 , H01L33/387 , H01L33/46 , H01L2924/0002 , H01L2933/0016 , H01S5/0217 , H01S5/0224 , H01S5/0425 , H01S5/105 , H01S5/18308 , H01S5/18347 , H01S5/1835 , H01S5/18369 , H01S5/18391 , H01S5/3095 , H01L2924/00
摘要： A semiconductor chip with a semiconductor body has a semiconductor layer sequence with an active region provided for generating radiation. A mirror structure that includes a mirror layer and a dielectric layer that is arranged at least in regions between the mirror layer and semiconductor body is arranged on the semiconductor body.
摘要翻译： 具有半导体本体的半导体芯片具有提供用于产生辐射的有源区的半导体层序列。 至少在镜面层和半导体本体之间的区域中配置有镜面层和电介质层的镜面结构配置在半导体本体上。
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29.发明申请公开(公告)号：US20120168809A1
公开(公告)日：2012-07-05
申请号：US13376006
申请日：2011-05-21
申请人： Markus Maute , Karl Engl
发明人： Markus Maute , Karl Engl
CPC分类号： H01L33/382 , H01L33/20 , H01L33/44
摘要： An optoelectronic semiconductor body has a front face provided for the emission and/or reception of electromagnetic radiation, a rear face which lies opposite the front face and is provided for application onto a support plate, and an active semiconductor layer sequence which in the direction from the rear face to the front face includes a layer of a first conductivity type, an active layer and a layer of a second conductivity type in this sequence.
摘要翻译： 光电子半导体本体具有用于发射和/或接收电磁辐射的前表面，与前表面相对设置的后表面，用于施加到支撑板上，并且有源半导体层序列沿着从 该前表面的后表面包括第一导电类型，有源层和第二导电类型的层。
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公开(公告)号：US09620680B2
公开(公告)日：2017-04-11
申请号：US13123713
申请日：2009-09-30
申请人： Karl Engl , Matthias Sabathil
发明人： Karl Engl , Matthias Sabathil
CPC分类号： H01L33/382 , H01L33/22 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor body for emitting electromagnetic radiation from the front side with a semiconductor layer sequence and a first electrical contact layer, wherein the semiconductor layer sequence comprises at least one opening that penetrates fully through the semiconductor layer sequence in the direction from the front side to the rear side that is opposite the front side, the first electrical contact layer is arranged at the rear of the semiconductor body, a section of the first electrical contact layer extends from the rear side through the opening to the front side and covers a first sub-region of a front-side main face of the semiconductor layer sequence, and a second sub-region of the front-side main face is not covered by the first electrical contact layer.
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