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    COIL COMPONENT
    23.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20250029777A1

    公开(公告)日：2025-01-23

    申请号：US18650754

    申请日：2024-04-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Dong Hwan Lee ,  Dong Jin Lee ,  Soon Kwang Kwon ,  Boum Seock Kim

    IPC: H01F27/29 ,  H01F27/32

    Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface connecting the first surface to the second surface; a coil disposed in the body and including a lead-out portion led out to the first surface or the second surface; and an external electrode disposed on the body and connected to the lead-out portion and including a first metal layer and a second metal layer. The first metal layer includes a first side surface facing the body and a second side surface opposing the first side surface, and the second metal layer is disposed on each of the first side surface and the second side surface of the first metal layer.

    COIL ELECTRONIC COMPONENT
    24.
    发明申请
    COIL ELECTRONIC COMPONENT 有权

    公开(公告)号：US20250014809A1

    公开(公告)日：2025-01-09

    申请号：US18634409

    申请日：2024-04-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Donghwan Lee ,  Daeki Lim ,  Boumseock KIM

    IPC: H01F27/30 ,  H01F27/28 ,  H01F27/29

    Abstract: A coil electronic component includes: a first coil; a second coil spaced apart from the first coil; an intermediate layer disposed to extend from a first region between a first core (hollow space) of the first coil and a second core of the second coil to a second region between the first coil and the second coil; and a magnetic body surrounding the first coil, the second coil, and the intermediate layer, wherein the intermediate layer has a smaller permeability than that of the magnetic body.

    Micro electro mechanical systems sensor module package and method of manufacturing the same
    26.
    发明授权
    Micro electro mechanical systems sensor module package and method of manufacturing the same 有权
    微机电系统传感器模块封装及其制造方法相同

    公开(公告)号：US09236286B2

    公开(公告)日：2016-01-12

    申请号：US14188161

    申请日：2014-02-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Heung Woo Park

    IPC: G01R33/02 ,  H01L21/70 ,  G01P15/08 ,  G01C19/5769

    CPC classification number: H01L21/70 ,  G01C19/5769 ,  G01P15/0802 ,  G01R33/02 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

    Abstract translation: 这里公开了一种MEMS传感器模块封装。 根据本发明的优选实施例的MEMS传感器模块封装包括：印刷电路板（PCB）; 堆叠在PCB上的专用集成电路（ASIC），ASIC的一侧被引线键合到PCB; 堆叠在ASIC上的MEMS传感器; 以及用树脂封装MEMS传感器和ASIC的模制件。 因此，MEMS传感器和ASIC之间的电连接距离缩短，从而可以提高电特性。 此外，传感器模块封装可以以ASIC尺寸实现，使得可以实现尺寸减小以满足移动设备的要求。

    Unit power module and power module package comprising the same
    28.
    发明授权
    Unit power module and power module package comprising the same 有权
    单元电源模块和电源模块封装组成

    公开(公告)号：US09123683B2

    公开(公告)日：2015-09-01

    申请号：US13782859

    申请日：2013-03-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Bum Seok Suh ,  Do Jae Yoo ,  Kwang Soo Kim

    IPC: H01L23/00

    CPC classification number: H01L24/34 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

    Abstract translation: 这里公开了一种单位功率模块，包括：第一半导体芯片，其具有一个表面，其上形成有与第1-1电极间隔开的第1-1电极和第1-2电极，另一个表面在 形成有第1-3电极的第二半导体芯片，形成有第2-1电极的一个表面的第二半导体芯片和形成有第2-2电极的另一表面，第一金属板接触 第一半导体芯片的第1-1电极和第二半导体芯片的第2-1电极，与第一半导体芯片的第1-2电极接触并与第一半导体芯片间隔开的第二金属板 与第一半导体芯片的第1-3电极和第二半导体芯片的第2-2电极接触的第三金属板和形成为围绕第一金属板，第二金属板， 和第三金属板。

    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    29.
    发明申请
    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    微电子机械系统传感器模块包装及其制造方法

    公开(公告)号：US20150153372A1

    公开(公告)日：2015-06-04

    申请号：US14188161

    申请日：2014-02-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Heung Woo Park

    IPC: G01P3/42 ,  H01L21/70

    CPC classification number: H01L21/70 ,  G01C19/5769 ,  G01P15/0802 ,  G01R33/02 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

    Abstract translation: 这里公开了一种MEMS传感器模块封装。 根据本发明的优选实施例的MEMS传感器模块封装包括：印刷电路板（PCB）; 堆叠在PCB上的专用集成电路（ASIC），ASIC的一侧被引线键合到PCB; 堆叠在ASIC上的MEMS传感器; 以及用树脂封装MEMS传感器和ASIC的模制件。 因此，MEMS传感器和ASIC之间的电连接距离缩短，从而可以提高电特性。 此外，传感器模块封装可以以ASIC尺寸实现，使得可以实现尺寸减小以满足移动设备的要求。

    POWER MODULE PACKAGE
    30.
    发明申请
    POWER MODULE PACKAGE 有权
    电源模块封装

    公开(公告)号：US20140167239A1

    公开(公告)日：2014-06-19

    申请号：US14106107

    申请日：2013-12-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Do Jae Yoo ,  Bum Seok Suh

    IPC: H01L23/495

    CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities.

    Abstract translation: 本文公开了一种功率模块封装，包括：基板，包括金属层，形成在金属层上的第一绝缘层，形成在第一绝缘层上的第一电路图案，并且包括第一焊盘和与第一绝缘层间隔开的第二焊盘 衬垫，形成在所述第一绝缘层上以覆盖所述第一电路图案的第二绝缘层，以及形成在所述第二绝缘层上并包括形成在与所述第一焊盘相对应的位置的第三焊盘和间隔开的第四焊盘的第二焊盘图案 从第三垫; 安装在第二电路图案上的半导体芯片; 一端电连接到半导体芯片，另一端从外部突出，其中第一焊盘和第三焊盘以及第二焊盘和第四焊盘具有不同的极性。

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