公开(公告)号：US11323088B2

公开(公告)日：2022-05-03

申请号：US16989129

申请日：2020-08-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung Lee ,  Tae Yoon Kim ,  Sang Kee Yoon ,  Chang Hyun Lim ,  Jong Woon Kim ,  Moon Chul Lee

IPC: H03H9/02 ,  H03H9/54 ,  H03H9/17 ,  H03H9/13 ,  H01L41/053 ,  H01L41/29 ,  H01L41/31 ,  H03H3/02

Abstract: An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Å≤ΔMg≤170 Å may be satisfied, ΔMg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.

公开(公告)号：US11057017B2

公开(公告)日：2021-07-06

申请号：US15996921

申请日：2018-06-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Yoon Kim ,  Won Han ,  Chang Hyun Lim

IPC: H03H9/17 ,  H03H3/02 ,  H03H9/05 ,  H03H9/02

Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode formed on the substrate, and at least a portion of the lower electrode is formed on a cavity; a piezoelectric layer formed on the lower electrode; an upper electrode formed on the piezoelectric layer; a membrane layer formed below the lower electrode and forming the cavity together with the substrate; and a protruding portion formed on the membrane layer and further formed in the cavity in a direction that extends away from the membrane layer.

公开(公告)号：US10992281B2

公开(公告)日：2021-04-27

申请号：US16400052

申请日：2019-05-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yong Suk Kim ,  Moon Chul Lee ,  Sung Jun Lee ,  Chang Hyun Lim ,  Jae Hyoung Gil ,  Sang Hyun Yi

IPC: H03H9/02 ,  H03H9/13 ,  H03H3/02 ,  H03H9/17 ,  H03H9/54 ,  H03H3/04

Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.

公开(公告)号：US10069475B2

公开(公告)日：2018-09-04

申请号：US15462110

申请日：2017-03-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung Lee ,  Yong Jin Kang ,  Moon Chul Lee ,  Jae Hyoung Gil ,  Chang Hyun Lim ,  Tae Yoon Kim

IPC: H03H9/54 ,  H01L41/08 ,  H03H3/02 ,  H03H9/60 ,  H01L41/047

Abstract: A bulk-acoustic wave filter device includes: a lower electrode layer disposed on the substrate; a bonding part disposed on the lower electrode layer, at an edge of the substrate; a ground part spaced apart from the bonding part; and a flow suppressing part disposed between the bonding part and the ground part, and offset with respect to the bonding part and the ground part.

公开(公告)号：US09857258B2

公开(公告)日：2018-01-02

申请号：US14933043

申请日：2015-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hun Lee ,  Chang Hyun Lim ,  June Kyoo Lee ,  Dae Hun Jeong

IPC: G01L9/06 ,  G01L9/00 ,  G01L19/06

CPC classification number: G01L9/0054 ,  G01L19/0618

Abstract: A pressure sensor includes a sensor, an elastic support portion, a membrane, and a pressure detector. The sensor is accommodated in a frame of a base substrate. The elastic support portion is elastically connecting the sensor to the frame. The membrane is disposed on a surface of the sensor. The pressure detector is disposed on the membrane and configured to detect a variation in pressure based on a movement of the membrane.

公开(公告)号：US09107313B2

公开(公告)日：2015-08-11

申请号：US14133157

申请日：2013-12-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hyun Lim ,  Jung Eun Kang ,  Heung Soo Park ,  Seog Moon Choi ,  Kwang Soo Kim ,  Joon Seok Chae ,  Sung Keun Park

IPC: H05K7/06 ,  H05K3/10 ,  H05K1/02 ,  H05K3/44 ,  H05K1/05

CPC classification number: H05K3/10 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/108 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/4913

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Abstract translation: 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。

公开(公告)号：US20150114111A1

公开(公告)日：2015-04-30

申请号：US14181869

申请日：2014-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Kyu Jeung ,  Chang Hyun Lim ,  Jung Won Lee ,  Jong Hyeong Song

IPC: G01P1/02 ,  G01P1/00

CPC classification number: G01P1/02 ,  B81B7/0048 ,  B81C2203/0785 ,  G01P1/006 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Disclosed herein is an MEMS sensor, including: a sensor unit; and a substrate connected to the sensor unit, in which the substrate may be provided with a flexible printed circuit board (FPCB) to correspond to an outer peripheral portion of the sensor unit.

Abstract translation: 这里公开了一种MEMS传感器，包括：传感器单元; 以及连接到传感器单元的基板，其中基板可以设置有与传感器单元的外周部分相对应的柔性印刷电路板（FPCB）。

公开(公告)号：US20140144236A1

公开(公告)日：2014-05-29

申请号：US13845094

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hyun Lim ,  Seung Hun Han ,  Jung Won Lee ,  Sung Jun Lee ,  Jeong Suong Yang

IPC: G01P15/18

CPC classification number: G01P15/18 ,  G01P15/123 ,  G01P2015/084

Abstract: Disclosed herein is an accelerator sensor, including: a mass body; a flexible beam that is provided with a piezoresistive element configured of an X-axis resistive element, a Y-axis resistive element, and a Z-axis resistive element having both ends connected with contact pads and is connected with the mass body; and a support portion that is connected with the flexible beam and supports the flexible beam so as to float the mass body, wherein the flexible beam has a slit provided between one-axis resistive element and the other axis resistive element adjacent to each other and the slit is extendedly formed from the contact pads connected with ends of the one axis resistive element and the other axis resistive element to the contact pads connected with the other ends thereof.

Abstract translation: 这里公开了一种加速器传感器，包括：质量体; 具有由X轴电阻元件，Y轴电阻元件和Z轴电阻元件构成的压阻元件的柔性梁，其两端与接触焊盘连接并与质量体连接; 以及支撑部，其与柔性梁连接并支撑柔性梁以使质量体浮起，其中柔性梁具有设置在彼此相邻的一个轴电阻元件和另一个轴电阻元件之间的狭缝， 狭缝从与单轴电阻元件的端部连接的接触焊盘和另一个轴电阻元件延伸地形成到与其另一端连接的接触焊盘。

公开(公告)号：US11437975B2

公开(公告)日：2022-09-06

申请号：US16939344

申请日：2020-07-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Hyun Lim ,  Tae Hun Lee ,  Yong Suk Kim ,  Moon Chul Lee ,  Sang Kee Yoon

IPC: H03H9/13 ,  H03H9/05 ,  H03H9/02 ,  H03H9/56 ,  H03H9/17 ,  H03H9/10

Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; and an insertion layer disposed below a partial region of the piezoelectric layer. A thickness of the first electrode in an active region in which the first electrode, the piezoelectric layer, and the second electrode overlap one another is less than a thickness of a region outside the active region. An angle of inclination of an internal side surface of the insertion layer is different from an angle of inclination of an external side surface of the insertion layer.

公开(公告)号：US11251767B2

公开(公告)日：2022-02-15

申请号：US16983209

申请日：2020-08-03

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung Lee ,  Tae Yoon Kim ,  Dae Ho Kim ,  Chang Hyun Lim ,  Tae Hun Lee ,  Sang Kee Yoon ,  Jong Woon Kim ,  Won Han ,  Moon Chul Lee

IPC: H03H9/02 ,  H03H9/56 ,  H03H9/17 ,  H03H9/60 ,  H03H9/54 ,  H03H3/02 ,  H01L41/047

Abstract: A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170 Å or less.