公开(公告)号：US11462498B2

公开(公告)日：2022-10-04

申请号：US16554278

申请日：2019-08-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Jin Park ,  Sang Kyu Lee ,  Moon Il Kim ,  Myung Sam Kang ,  Jeong Ho Lee ,  Young Gwan Ko

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/532 ,  H01L23/498

Abstract: A semiconductor package includes a frame having a wiring structure and having a recess portion, a semiconductor chip having an active surface with a connection pad disposed thereon and disposed in the recess portion, an encapsulant sealing the semiconductor chip, and a redistribution layer having a first via connected to the connection and a second via connected to a portion of the wiring structure. The semiconductor chip includes a protective insulating film disposed on the active surface and having an opening exposing a region of the connection pad, and a redistribution capping layer connected to the region of the connection pad and extending onto the protective insulating film, and a surface of the redistribution capping layer is substantially the same level as a surface of the portion of the wiring structure, exposed from the first surface.

公开(公告)号：US11037880B2

公开(公告)日：2021-06-15

申请号：US16556816

申请日：2019-08-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myung Sam Kang ,  Yong Koon Lee ,  Young Gwan Ko ,  Young Chan Ko ,  Moon Il Kim

IPC: H01L23/538 ,  H01L23/367 ,  H01Q1/38 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/66

Abstract: A semiconductor package includes a frame having first and second through-portions, first and second semiconductor chips, respectively in the first and second through-portions, each having a first surface, on which a connection pad is disposed, a first encapsulant covering at least a portion of the first and second semiconductor chips, a first connection member on the first and second semiconductor chips including a first redistribution layer electrically connected to the connection pads of the first and second semiconductor chips and a heat dissipation pattern layer, at least one passive component above the first semiconductor chip on the first connection member, and at least one heat dissipation structure above the second semiconductor chip on the first connection member and connected to the heat dissipation pattern layer.

公开(公告)号：US11017936B2

公开(公告)日：2021-05-25

申请号：US15650309

申请日：2017-07-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ye Jeong Kim ,  Ki Seok Kim ,  Myung Sam Kang

IPC: H01F17/04 ,  H01F27/24 ,  H01F17/00 ,  H01F5/04 ,  H01F5/06 ,  H01F27/29 ,  H01F27/32 ,  H01F41/10 ,  H01F27/28

Abstract: A coil electronic component includes a plurality of coil layers including coil patterns and connection patterns. The coil patterns are disposed between the connection patterns. The connection patterns are at least partially exposed from the coil electronic component. The coil electronic component further includes connection electrodes connecting the connection patterns formed in different coil layers of the plurality of coil layers with each other, and external electrodes connected to the connection electrodes and at least partially enclosing the connection electrodes.

公开(公告)号：US10650958B2

公开(公告)日：2020-05-12

申请号：US15232325

申请日：2016-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hui Jo ,  Han Lee ,  Mi Sun Hwang ,  Jeong Min Cho ,  Myung Sam Kang ,  Seok Hwan Ahn ,  Tae Hoon Kim

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F41/04

Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.

公开(公告)号：US10356916B2

公开(公告)日：2019-07-16

申请号：US15142484

申请日：2016-04-29

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Han Kim ,  Sang Yul Ha ,  Sung Han Kim ,  Kyung Ho Lee ,  Seok Hwan Ahn ,  Myung Sam Kang

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/12

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.

公开(公告)号：US10304628B2

公开(公告)日：2019-05-28

申请号：US15481157

申请日：2017-04-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Sun Hwang ,  Myung Sam Kang ,  Dong Keun Lee

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.

公开(公告)号：US10217709B2

公开(公告)日：2019-02-26

申请号：US15668351

申请日：2017-08-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Ha Kang ,  Myung Sam Kang

IPC: H01L23/02 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10

Abstract: The present disclosure relates to a semiconductor package, and more particularly, to a fan-out semiconductor package in which connection terminals may extend outwardly of a region in which a semiconductor chip is disposed. In the fan-out semiconductor package, a circuit density of a redistribution layer may be increased even in a limited area.

公开(公告)号：US10109588B2

公开(公告)日：2018-10-23

申请号：US15151885

申请日：2016-05-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Won Jeong ,  Young Gwan Ko ,  Myung Sam Kang ,  Tae Hong Min

IPC: H01L23/538 ,  H01L23/16 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L23/13 ,  H01L23/36 ,  H01L21/56

Abstract: An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.

公开(公告)号：US10015877B2

公开(公告)日：2018-07-03

申请号：US14849880

申请日：2015-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong Min ,  Myung Sam Kang ,  Jin Hyuk Jang ,  Young Gwan Ko

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538

CPC classification number: H05K1/0204 ,  H01L21/4882 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/0323

Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.

公开(公告)号：US09839126B2

公开(公告)日：2017-12-05

申请号：US14824598

申请日：2015-08-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung Sam Kang ,  Young Kwan Lee ,  Seung Eun Lee ,  Seung Yeop Kook

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K1/117 ,  H05K3/403 ,  H05K3/421 ,  H05K3/429 ,  H05K2203/072

Abstract: There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board.