公开(公告)号：US20190172861A1

公开(公告)日：2019-06-06

申请号：US15831663

申请日：2017-12-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146 ,  H01L23/552 ,  H01L23/60 ,  H01L23/00

Abstract: Implementations of semiconductor packages may include: a substrate, a die electrically coupled to the substrate, and a wall coupled to the substrate wall. The wall may extend around a perimeter of the die. The wall may include a molding dam formed therein. The semiconductor package may also include a glass lid coupled to the wall and the molding dam. A mold compound may be coupled into the molding dam and across a thickness of the glass lid.

公开(公告)号：US20170345864A1

公开(公告)日：2017-11-30

申请号：US15168828

申请日：2016-05-31

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Larry KINSMAN ,  Yusheng LIN ,  Yu-Te HSIEH ,  Oswald SKEETE ,  Weng-Jin WU ,  Chi-Yao KUO

IPC: H01L27/146 ,  H01L21/56 ,  H01L23/498 ,  H04N5/374 ,  H01L21/48

CPC classification number: H01L27/14643 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/49816 ,  H01L23/49838 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/24 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H04N5/374 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

公开(公告)号：US20250160014A1

公开(公告)日：2025-05-15

申请号：US19022848

申请日：2025-01-15

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H10F39/00

Abstract: Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.

公开(公告)号：US20220223641A1

公开(公告)日：2022-07-14

申请号：US17248209

申请日：2021-01-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Larry Duane KINSMAN ,  Yu-Te HSIEH

IPC: H01L27/146 ,  H01L31/18

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, at least one conductor connected to the image sensor die and the substrate, and a light-transmitting member including a substrate member, a first leg member extending from a first edge portion of the substrate member, and a second leg member extending from a second edge portion of the substrate member, the first leg member being coupled to the substrate, the second leg member being coupled to the substrate.

公开(公告)号：US20220020800A1

公开(公告)日：2022-01-20

申请号：US16948792

申请日：2020-10-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146

Abstract: According to an aspect, a method for fabricating an image sensor package to define a gap height includes coupling an image sensor die to a substrate, forming a plurality of pillar members on the image sensor die, dispensing a bonding material on the image sensor die, contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member, and curing the bonding material to couple the transparent member to the image sensor die.

公开(公告)号：US20200058618A1

公开(公告)日：2020-02-20

申请号：US16103135

申请日：2018-08-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L25/065 ,  H01L23/28 ,  H01L23/488 ,  H01L23/00 ,  H01L27/146

Abstract: According to an aspect, a stack packaging structure includes a substrate, a semiconductor device coupled to a surface of the substrate, an image sensor device coupled to the semiconductor device such that the semiconductor device is disposed between the surface of the substrate and the image sensor device, at least one bond wire connected to the image sensor device and the surface of the substrate, a inner molding disposed between the surface of the substrate and the image sensor device, where the semiconductor device is encapsulated within the inner molding, and an outer molding disposed on the surface of the substrate, where the at least one bond wire is encapsulated within the outer molding.

公开(公告)号：US20170345862A1

公开(公告)日：2017-11-30

申请号：US15166007

申请日：2016-05-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Larry KINSMAN ,  Yu-Te HSIEH ,  Chi-Yao KUO

IPC: H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: Implementations of semiconductor packages may include: a first semiconductor die coupled to a first side of a substrate having one or more internal traces. One or more connectors coupled to the first semiconductor die and the first side of the substrate. A glass lid coupled to the first side of the substrate over the first semiconductor die. A mold compound that encapsulates at least a portion of the substrate. A second semiconductor die coupled to a second side of the substrate opposing the first side. The second semiconductor die is electrically coupled with the first semiconductor die through the one or more traces of the substrate.

公开(公告)号：US20170236761A1

公开(公告)日：2017-08-17

申请号：US15174450

申请日：2016-06-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/302 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/302 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/525 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L29/0657 ,  H01L2224/29021 ,  H01L2224/29022 ,  H01L2224/29034 ,  H01L2224/29099 ,  H01L2224/32013 ,  H01L2224/32111 ,  H01L2224/32112 ,  H01L2224/32237 ,  H01L2224/32238 ,  H01L2224/325 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/16235 ,  H01L2924/1632 ,  H01L2924/1659 ,  H01L2924/16788 ,  H01L2224/13099

Abstract: Implementations of semiconductor packages may include: a semiconductor wafer, a glass lid fixedly coupled to a first side of the semiconductor die by an adhesive, a redistribution layer coupled to a second side of the semiconductor die, and a plurality of ball mounts coupled to the redistribution layer on a side of the redistribution layer coupled to the semiconductor die. The adhesive may be located in a trench around a perimeter of the semiconductor die and located in a corresponding trench around a perimeter of the glass lid.

公开(公告)号：US20160268325A1

公开(公告)日：2016-09-15

申请号：US14644456

申请日：2015-03-11

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH ,  Weng-Jin WU

IPC: H01L27/146 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/16225 ,  H01L2224/26175 ,  H04N5/2253

Abstract: An image sensor package including a barrier structure to prevent image sensor die contamination is described. A barrier structure may surround an image sensor die that is attached on an image sensor carrier. The barrier structure may be attached to a transparent window structure as well as a package substrate. The barrier structure may extend through a hole in the package substrate. The image sensor carrier may be mounted to the package substrate using a thermal compression head that is able to apply independently varying compressive forces to corresponding regions of a surface at a given time. The thermal compression head may be used to cure the barrier structure and/or adhesives used in the image sensor package. Underfill adhesive may be deposited between discrete mounting structures used to mount the package substrate to the image sensor carrier, after the barrier structure has been applied.

Abstract translation: 描述了包括防止图像传感器裸片污染的阻挡结构的图像传感器封装。 屏障结构可以围绕附着在图像传感器载体上的图像传感器芯片。 阻挡结构可以附接到透明窗结构以及封装衬底。 阻挡结构可以延伸穿过封装衬底中的孔。 图像传感器载体可以使用热压头安装到封装基板，该热压头能够在给定时间内独立地对表面的相应区域施加变化的压缩力。 热压头可用于固化图像传感器封装中使用的阻挡结构和/或粘合剂。 在施加了阻挡结构之后，底部填充粘合剂可以沉积在用于将封装衬底安装到图像传感器载体的分立安装结构之间。