公开(公告)号：US20160243647A1

公开(公告)日：2016-08-25

申请号：US15145260

申请日：2016-05-03

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: B23K26/0622 ,  B23K26/06 ,  B23K26/08 ,  B23K26/04

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20150351168A1

公开(公告)日：2015-12-03

申请号：US14725071

申请日：2015-05-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Seiji YASUMOTO ,  Masataka SATO ,  Saki OBANA ,  Junpei YANAKA ,  Koichi TAKESHIMA ,  Minato ITO ,  Kohei YOKOYAMA

IPC: H05B33/04 ,  H05B33/12 ,  B32B17/06

CPC classification number: H05B33/04 ,  B32B7/12 ,  B32B17/06 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/308 ,  B32B27/32 ,  B32B27/365 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2457/00 ,  B32B2457/206 ,  H01L27/322 ,  H01L27/323 ,  H01L27/3276 ,  H01L51/525 ,  H01L51/5253 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/55 ,  H05B33/12 ,  Y10T428/24975

Abstract: A highly reliable light-emitting device is provided. A light-emitting device with high resistance to repeated bending is provided. A light-emitting device in which cracks are less likely to occur even in a high-temperature and high-humidity environment is provided. The light-emitting device includes a light-emitting element between a pair of insulating layers. The pair of insulating layers is sandwiched between a pair of bonding layers. The pair of bonding layers is sandwiched between a pair of flexible substrates. At least one of the insulating layers has compressive stress. At least one of the bonding layers has a glass transition temperature higher than or equal to 60° C. At least one of the substrates has a coefficient of linear expansion less than or equal to 60 ppm/K.

Abstract translation: 提供了高度可靠的发光装置。 提供了具有高抗重复弯曲性的发光装置。 提供即使在高温高湿环境下也难以发生裂纹的发光装置。 发光装置包括在一对绝缘层之间的发光元件。 一对绝缘层夹在一对接合层之间。 一对接合层夹在一对柔性基板之间。 至少一个绝缘层具有压应力。 至少一个接合层的玻璃化转变温度高于或等于60℃。至少一个基板具有小于或等于60ppm / K的线性膨胀系数。

公开(公告)号：US20150151531A1

公开(公告)日：2015-06-04

申请号：US14553227

申请日：2014-11-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: B32B43/00 ,  B32B38/10

CPC classification number: B32B43/006 ,  B32B37/0053 ,  B32B37/025 ,  B32B37/12 ,  B32B37/1207 ,  B32B38/10 ,  B32B2037/1253 ,  B32B2037/268 ,  B32B2457/20 ,  B32B2457/208 ,  H01L27/322 ,  H01L27/323 ,  H01L27/3262 ,  H01L51/0013 ,  H01L51/003 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5315 ,  H01L2251/5338 ,  Y10T156/1111 ,  Y10T156/1174 ,  Y10T156/1928 ,  Y10T156/195

Abstract: The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface. The stage can hold a second member of the process member. The radius of curvature of the convex surface is less than the radius of curvature of the supporting surface. The linear velocity of the convex surface is greater than or equal to the speed of a rotation center of the structure body passing the stage. The first member is wound along the convex surface to be separated from the second member.

Abstract translation: 剥离过程的产率提高。 剥离装置包括具有凸面的结构体和具有与凸面对置的支撑面的台。 结构体可以在凸表面和支撑表面之间保持处理构件的第一构件。 舞台可以容纳进程成员的第二个成员。 凸面的曲率半径小于支撑面的曲率半径。 凸面的线速度大于或等于通过平台的结构体的旋转中心的速度。 第一构件沿凸形表面缠绕以与第二构件分离。