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公开(公告)号：US20240081097A1
公开(公告)日：2024-03-07
申请号：US18273805
申请日：2022-01-25
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shingo EGUCHI , Kenichi OKAZAKI , Hiroki ADACHI
IPC: H10K59/12 , H10K50/13 , H10K59/124
CPC classification number: H10K59/1201 , H10K50/13 , H10K59/124
Abstract: A display device with high display quality is provided. A highly reliable display device is provided. A display device with low power consumption is provided. A display device that can easily achieve higher resolution is provided. A display device with both high display quality and high resolution is provided. A display device with high contrast is provided. The display device includes a first conductive layer, a first insulating layer over the first conductive layer, a second conductive layer including a first region over the first insulating layer and a second region in an opening provided in the first insulating layer, a second insulating layer over the first insulating layer, a third insulating layer over the second region, an EL layer including a third region over the first region, a fourth region over the second insulating layer, and a fifth region over the third insulating layer, and a third conductive layer over the EL layer. The opening is provided in the first insulating layer so as to reach a top surface of the first conductive layer. A top surface of the first region, a top surface of the second insulating layer, and a top surface of the third insulating layer are substantially level with each other.
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公开(公告)号：US20240057464A1
公开(公告)日：2024-02-15
申请号：US18260841
申请日：2022-01-07
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shingo EGUCHI , Hiroki ADACHI , Kenichi OKAZAKI , Yasumasa YAMANE , Naoto KUSUMOTO , Kensuke YOSHIZUMI , Shunpei YAMAZAKI
CPC classification number: H10K71/811 , H01L21/67167 , H01L21/67184 , C23C14/566 , C23C16/54 , G03F7/0005 , H01L21/68707
Abstract: Manufacturing equipment of a light-emitting device with which steps from formation to sealing of a light-emitting element can be successively performed can be provided. In the manufacturing equipment of a light-emitting device, a deposition step, a lithography step, an etching step, and a sealing step by forming a protective layer for forming an organic EL element can be successively performed, whereby a downscaled organic EL element achieving high luminance and high reliability can be formed. Moreover, the manufacturing equipment can have an in-line system where apparatuses are arranged in the order of process steps for the light-emitting device, resulting in high throughput manufacturing.
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公开(公告)号：US20230251515A1
公开(公告)日：2023-08-10
申请号：US18134206
申请日：2023-04-13
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shingo EGUCHI , Hideaki KUWABARA , Kazune YOKOMIZO
IPC: G02F1/1333 , G09F9/30 , G09F9/46 , H01L29/786 , H05B33/02 , H10K59/50 , H10K50/11
CPC classification number: G02F1/133308 , G02F1/1333 , G09F9/30 , G09F9/301 , G09F9/46 , H01L29/786 , H05B33/02 , H10K59/50 , H10K50/11 , H01L29/78603 , H10K2102/311
Abstract: A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer side. The first substrate and part of the second resin layer are bonded to each other with the adhesive layer.
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公开(公告)号：US20220255045A1
公开(公告)日：2022-08-11
申请号：US17624593
申请日：2020-06-29
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei YAMAZAKI , Daiki NAKAMURA , Ryo HATSUMI , Rai SATO , Shingo EGUCHI , Koji KUSUNOKI
Abstract: A novel functional panel that is highly convenient, useful, or reliable is provided. The functional panel includes a base material and a pair of pixels, and the base material covers the pair of pixels and has a light-transmitting property. The pair of pixels includes one pixel and another pixel, and the one pixel includes a light-emitting device and a first microlens. The light-emitting device emits light toward the base material, and the first microlens is interposed between the base material and the light emission and converges light. The first microlens includes a first surface and a second surface; the second surface is closer to the light-emitting device than the first surface is; and the second surface has a smaller radius of curvature than the first surface. The other pixel includes a photoelectric conversion device and a second microlens. The second microlens is interposed between the base material and the photoelectric conversion and converges external light incident from the base material side. The second microlens includes a third surface and a fourth surface; the third surface is closer to the photoelectric conversion device than the fourth surface is; and the fourth surface has a smaller radius of curvature than the third surface.
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25.发明申请公开(公告)号：US20190339800A1
公开(公告)日：2019-11-07
申请号：US16517806
申请日：2019-07-22
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Yasuhiro JINBO , Shingo EGUCHI , Hisao IKEDA , Tetsuji ISHITANI , Taisuke KAMADA
Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.
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Patent Agency Ranking
公开(公告)号：US20180190533A1
公开(公告)日：2018-07-05
申请号：US15909173
申请日：2018-03-01
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Seiji YASUMOTO , Masataka SATO , Shingo EGUCHI , Kunihiko SUZUKI
IPC: H01L21/683
CPC classification number: H01L21/6836 , B32B38/10 , H01L21/67132 , H01L21/6835 , H01L51/003 , H01L51/0097 , H01L51/50 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , Y10T156/1712
Abstract: To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.
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公开(公告)号：US20170154902A1
公开(公告)日：2017-06-01
申请号：US15428285
申请日：2017-02-09
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
CPC classification number: H01L27/1266 , B32B43/006 , G02F1/1303 , G02F1/13306 , G06K19/0772 , H01L21/67132 , H01L21/6835 , H01L27/1214 , H01L27/1218 , H01L27/156 , H01L31/1892 , H01L31/206 , H01L33/005 , H01L51/003 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , H01L2221/68395 , H01L2227/326 , H01L2251/5338 , H01L2924/19041 , H01L2924/30105 , Y10T29/41
Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
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公开(公告)号：US20160314999A1
公开(公告)日：2016-10-27
申请号：US15204091
申请日：2016-07-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
IPC: H01L21/67 , H01L21/683 , B32B43/00 , H01L27/12
CPC classification number: H01L27/1266 , B32B43/006 , G02F1/1303 , G02F1/13306 , G06K19/0772 , H01L21/67132 , H01L21/6835 , H01L27/1214 , H01L27/1218 , H01L27/156 , H01L31/1892 , H01L31/206 , H01L33/005 , H01L51/003 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , H01L2221/68395 , H01L2227/326 , H01L2251/5338 , H01L2924/19041 , H01L2924/30105 , Y10T29/41
Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
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公开(公告)号：US20150017751A1
公开(公告)日：2015-01-15
申请号：US14339867
申请日：2014-07-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
CPC classification number: H01L21/67132 , H01L21/02244 , H01L21/02252 , H01L21/67092 , H01L21/707 , H01L27/1266
Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.
Abstract translation: 当从衬底剥离包括半导体元件的元件形成层时，目的是抑制由剥离产生的静电产生的放电。 在衬底上形成释放层和元件形成层。 可以将后面剥离的支撑基材固定在元件形成层的上表面。 元件形成层通过支撑基材转变，并且在元件形成层和剥离层之间的界面产生剥离。 在供给液体时进行剥离，使得通过剥离顺序出现的元素形成层和剥离层用诸如纯水的液体润湿。 在元件形成层和剥离层的表面上产生的电荷可以被液体扩散，并且可以消除通过剥离带电的放电。
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公开(公告)号：US20130153877A1
公开(公告)日：2013-06-20
申请号：US13767250
申请日：2013-02-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shingo EGUCHI , Yoshiaki OIKAWA , Kenichi OKAZAKI , Hotaka MARUYAMA
IPC: H01L51/50
CPC classification number: H01L51/5012 , H01L27/12 , H01L27/1225 , H01L27/124 , H01L27/3262 , H01L27/3272 , H01L27/3276 , H01L29/78678 , H01L29/7869 , H01L51/0097
Abstract: An object of the invention is to improve the reliability of a light-emitting device. Another object of the invention is to provide flexibility to a light-emitting device having a thin film transistor using an oxide semiconductor film. A light-emitting device has, over one flexible substrate, a driving circuit portion including a thin film transistor for a driving circuit and a pixel portion including a thin film transistor for a pixel. The thin film transistor for a driving circuit and the thin film transistor for a pixel are inverted staggered thin film transistors including an oxide semiconductor layer which is in contact with a part of an oxide insulating layer.
Abstract translation: 本发明的目的是提高发光装置的可靠性。 本发明的另一个目的是为具有使用氧化物半导体膜的薄膜晶体管的发光器件提供灵活性。 发光器件在一个柔性基板上具有包括用于驱动电路的薄膜晶体管和包括用于像素的薄膜晶体管的像素部分的驱动电路部分。 用于驱动电路的薄膜晶体管和用于像素的薄膜晶体管是包括与氧化物绝缘层的一部分接触的氧化物半导体层的倒置交错薄膜晶体管。
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