Abstract:
A power storage device that is less likely to be influenced by an ambient temperature is provided. The power storage device capable of being charged and discharged even in a low-temperature environment is provided. A first secondary battery capable of being charged and discharged even at low temperatures and a general second secondary battery are adjacent to each other in the power storage device. The power storage device having such a structure can use, as an internal heat source in a low-temperature environment, heat generated by charge and discharge of the secondary battery capable of being charged and discharged even at low temperatures. Specifically, the power storage device includes the first secondary battery and the second secondary battery adjacent to each other, the first secondary battery has flexibility, and a value of discharge capacity in discharge at −40° C. is higher than or equal to 50% of a value of discharge capacity in discharge at 25° C.
Abstract:
A battery in which a decrease in discharge capacity retention rate in charge and discharge cycle tests is inhibited is provided. The battery includes a positive electrode and a negative electrode. The positive electrode is used as a positive electrode of a test battery in which a negative electrode includes a lithium metal. When a test of 50 repetitions of a cycle of charge and discharge in which, after constant current charge is performed at a charge rate of 1 C (1 C=200 mA/g) until a voltage of 4.6 V is reached, constant voltage charge is performed at a voltage of 4.6 V until the charge rate reaches 0.1 C, and constant current discharge is then performed at a discharge rate of 1 C until a voltage of 2.5 V is reached is performed in a 25° C. environment or a 45° C. environment and discharge capacity is measured in each cycle, a discharge capacity value measured in a 50th cycle accounts for higher than or equal to 90% and lower than 100% of a maximum discharge capacity value in all 50 cycles.
Abstract:
A manufacturing method of a highly purified positive electrode active material is provided. Alternatively, a manufacturing method of a positive electrode active material whose crystal structure is not easily broken even when charging and discharging are repeated is provided. Provided is a manufacturing method of a positive electrode active material containing lithium and a transition metal. The manufacturing method includes a first step of forming a hydroxide containing the transition metal using a basic aqueous solution and an aqueous solution containing the transition metal, a second step of preparing a lithium compound, a third step of mixing the lithium compound and the hydroxide to form a mixture, and a fourth step of heating the mixture to form a composite oxide containing lithium and the transition metal. A material with a purity higher than or equal to 99.99% is prepared as the lithium compound in the second step, and the heating is performed in an oxygen-containing atmosphere with a dew point lower than or equal to −50° C. in the fourth step.
Abstract:
A semiconductor device having favorable electrical characteristics is provided. A metal oxide is formed over a substrate by the steps of: introducing a first precursor into a chamber in which the substrate is provided; introducing a first oxidizer after the introduction of the first precursor; introducing a second precursor after the introduction of the first oxidizer; and introducing a second oxidizer after the introduction of the second precursor.
Abstract:
A novel deposition method of a metal oxide is provided. The deposition method includes a first step of supplying a first precursor to a chamber; a second step of supplying a second precursor to the chamber; a third step of supplying a third precursor to the chamber; and a fourth step of introducing an oxidizer into the chamber after the first step, the second step, and the third step. The first to third precursors are different kinds of precursors, and a substrate placed in the chamber in the first to fourth steps is heated to a temperature higher than or equal to 300° C. and lower than or equal to decomposition temperatures of the first to third precursors.
Abstract:
An insulator is formed over a substrate, an opening is formed in the insulator, and an oxide semiconductor is formed in the opening. Then, part of the insulator is removed to expose a side surface of the oxide semiconductor.
Abstract:
An SOI substrate having an SOI layer that can be used in practical applications even when a substrate with low upper temperature limit, such as a glass substrate, is used, is provided. A semiconductor device using such an SOI substrate, is provided. In bonding a single-crystal semiconductor layer to a substrate having an insulating surface or an insulating substrate, a silicon oxide film formed using organic silane as a material on one or both surfaces that are to form a bond is used. According to the present invention, a substrate with an upper temperature limit of 700° C. or lower, such as a glass substrate, can be used, and an SOI layer that is strongly bonded to the substrate can be obtained. In other words, a single-crystal semiconductor layer can be formed over a large-area substrate that is longer than one meter on each side.
Abstract:
A manufacturing method of a semiconductor device includes the forming a first oxide over a substrate; depositing a first insulator over the first oxide; forming an opening reaching the first oxide in the first insulator; depositing a first oxide film in contact with the first oxide and the first insulator in the opening; depositing a first insulating film over the first oxide film by a PEALD method; depositing a first conductive film over the first insulating film; and removing part of the first oxide film, part of the first insulating film, and part of the first conductive film until a top surface of the first insulator is exposed to form a second oxide, a second insulator, and a first conductor. The deposition of the first insulating film is performed while the substrate is heated to higher than or equal to 300°.
Abstract:
Electrodes and a secondary battery having high capacity density and being excellent in terms of rapid charging and rapid discharging are provided. The battery includes a positive electrode and a negative electrode. The positive electrode includes a current collector, a first layer overlapping with the current collector, and a second layer overlapping with the first layer. The first layer contains a first active material with a first particle diameter and the second layer contains a second active material with a second particle diameter. The first particle diameter is smaller than the second particle diameter. It is preferable that the second active material include a surface portion and an inner portion, the surface portion be a region within a depth of 10 nm or less from a surface of the second active material to the inner portion, and that the surface portion and the inner portion be topotaxy.
Abstract:
An object of one embodiment of the present invention is to achieve a manufacturing method which can increase capacity density of a secondary battery. Another object is to provide a manufacturing method of a highly safe or reliable secondary battery. The manufacturing method of electrodes (a positive electrode and a negative electrode) of a secondary battery includes a vibration treatment step for supplying vibration to the electrode and a press step for applying pressure to the electrode to compress an active material layer in the electrode. The vibration treatment step is performed before the press step.