公开(公告)号：US20250155525A1

公开(公告)日：2025-05-15

申请号：US18849562

申请日：2024-03-18

Applicant: SOUTHEAST UNIVERSITY

Inventor： Long ZHANG ,  Weifeng SUN ,  Siyang LIU ,  Guiqiang ZHENG ,  Yichen LI ,  Xueqi LI ,  Longxing SHI

IPC: G01R33/00 ,  G01R33/07 ,  H01L21/762 ,  H10N52/01 ,  H10N52/80

Abstract: A horizontal Hall device includes a substrate layer and a BOX layer arranged on the substrate layer, where an epitaxial layer is arranged on the BOX layer, a well layer is arranged on the epitaxial layer, an STI layer is arranged on the well layer, a pair of induction electrodes and a pair of bias electrodes are arranged on the STI layer, ground electrodes are arranged on the epitaxial layer, and current barrier layers are arranged between the induction electrodes and the adjacent bias electrodes.

公开(公告)号：US20240266943A1

公开(公告)日：2024-08-08

申请号：US18641384

申请日：2024-04-21

Applicant: SOUTHEAST UNIVERSITY

Inventor： Shen XU ,  Haiqing ZHANG ,  Yujie LIU ,  Ruizhi WANG ,  Yuan GAO ,  Yongjia LI ,  Weifeng SUN ,  Longxing SHI

IPC: H02M1/08 ,  H02M1/00 ,  H02M3/158

CPC classification number: H02M1/082 ,  H02M1/0025 ,  H02M3/1586

Abstract: A multi-phase high-precision current sharing control method applied to constant on-time control is provided, wherein a current difference between continuously sampled current of each line and mean current is processed by a PI compensation module and a low-pass filter module to obtain on-time regulation data. A high bit of the regulation data controls the value of counter reference Vref in an on-time control module, and a low bit controls the length of an enabled delay line in a delay line module. The counter timing control of the on-time control module is combined with the delay line timing control of the delay line module to improve the control precision of a DPWM. The method takes COT control of a Buck converter as a typical application. Compared with a multi-phase COT controller without a current-sharing mechanism, the method can improve the stability and reliability of the system.

公开(公告)号：US20240222473A1

公开(公告)日：2024-07-04

申请号：US18684175

申请日：2022-12-20

Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD. ,  SOUTHEAST UNIVERSITY

Inventor： Feng LIN ,  Chaoqi XU ,  Shuxian CHEN ,  Chunxu LI ,  Li LU ,  Siyang LIU ,  Weifeng SUN

IPC: H01L29/66 ,  H01L21/225 ,  H01L29/06 ,  H01L29/417 ,  H01L29/78

CPC classification number: H01L29/66734 ,  H01L21/2251 ,  H01L29/0619 ,  H01L29/41741 ,  H01L29/7813

Abstract: The present disclosure provides a DMOS device with a junction field plate and its manufacturing method. A drain region is located on a surface of a semiconductor substrate. A source region is located in the semiconductor substrate at a bottom of a first trench. A gate electrode is located at the bottom of the first trench. The junction field plate improves an effect on reducing surface resistance. At the same time, a depth of trenches in the DMOS device may be reduced, and thereby a depth-to-width ratio of the device is reduced, improving the feasibility of increasing a voltage resistance level. Both the source region and the drain region in the DMOS device are led out on a same surface. A second doped polycrystalline silicon layer includes a first doped sublayer and a second doped sublayer with different conduction types.

公开(公告)号：US20220367722A1

公开(公告)日：2022-11-17

申请号：US17767333

申请日：2020-08-26

Applicant: SOUTHEAST UNIVERSITY ,  CSMC TECHNOLOGIES FAB2 CO., LTD.

Inventor： Wangran WU ,  Guangan YANG ,  Feng LIN ,  Guipeng SUN ,  Yaohui WANG ,  Weifeng SUN ,  Longxing SHI

IPC: H01L29/786 ,  H01L21/02 ,  H01L29/66

Abstract: An IGZO thin-film transistor and a method for manufacturing same. The method comprises: acquiring a substrate; forming an IGZO layer on the substrate by means of a solution process; doping V impurities on a surface of the IGZO layer by means of a spin doping process; forming a source electrode at one side of the IGZO layer, and forming a drain electrode at the other side thereof; forming a gate dielectric layer on the doped IGZO layer; and forming a gate electrode on the gate dielectric layer.

公开(公告)号：US20220367716A1

公开(公告)日：2022-11-17

申请号：US17762929

申请日：2021-01-20

Applicant: SOUTHEAST UNIVERSITY

Inventor： Siyang LIU ,  Weifeng SUN ,  Chi ZHANG ,  Shuxuan XIN ,  Shen LI ,  Le QIAN ,  Chen GE ,  Longxing SHI

IPC: H01L29/78 ,  H01L29/10 ,  H01L29/812 ,  H01L29/778

Abstract: The present invention discloses a high-threshold power semiconductor device and a manufacturing method thereof. The high-threshold power semiconductor device includes, in sequence from bottom to top: a metal drain electrode, a substrate, a buffer layer, and a drift region; further including: a composite column body which is jointly formed by a drift region protrusion, a columnar p-region and a columnar n-region on the drift region, a channel layer, a passivation layer, a dielectric layer, a heavily doped semiconductor layer, a metal gate electrode and a source metal electrode. The composite column body is formed by sequentially depositing a p-type semiconductor layer and an n-type semiconductor layer on the drift region and then etching same. The channel layer and the passivation layer are formed in sequence by deposition. Thus, the above devices are divided into a cell region and a terminal region. The dielectric layer, the heavily doped semiconductor layer, the metal gate electrode and the source metal electrode only exist in the cell region, and the passivation layer of the terminal region extends upwards and is wrapped outside the channel layer. This structure can increase a threshold voltage of the device, improve the blocking characteristics of the device and reduce the size of a gate capacitance.

公开(公告)号：US20220157975A1

公开(公告)日：2022-05-19

申请号：US17606216

申请日：2020-03-31

Applicant: SOUTHEAST UNIVERSITY

Inventor： Jing ZHU ,  Ankang LI ,  Long ZHANG ,  Weifeng SUN ,  Shengli LU ,  Longxing SHI

IPC: H01L29/739 ,  H01L29/10

Abstract: A lateral insulated gate bipolar transistor (IGBT) with a low turn-on overshoot current is provided to reduce a peak value of a current flowing through a device during turn-on of a second gate pulse while preventing a current capability and a withstand voltage capability from being degraded. The lateral IGBT includes: a buried oxygen arranged on a P-type substrate, an N-type drift region arranged on the buried oxygen, on which a P-type body region and an N-type buffer region are arranged, a P-type collector region arranged in the N-type buffer region, a field oxide layer arranged above the N-type drift region, a P-type well region arranged in the P-type body region, and a P-type emitter region and an emitter region arranged in the P-type well region, where inner boundaries of the foregoing 4 regions are synchronously recessed to form a pinch-off region. A gate oxide layer is arranged on a surface of the P-type body region, and a polysilicon gate is arranged on the gate oxide layer. The polysilicon gate includes a first gate located above the surface of the P-type body region and a second gate located above the pinch-off region and the N-type drift region. The first gate is connected to a first gate resistor, and the second gate is connected to a second gate resistor.

公开(公告)号：US20180234007A1

公开(公告)日：2018-08-16

申请号：US15751136

申请日：2016-01-29

Applicant: SOUTHEAST UNIVERSITY

Inventor： Shen XU ,  Chong WANG ,  Xianjun FAN ,  Weifeng SUN ,  Shengli LU ,  Longxing SHI

IPC: H02M1/08 ,  G05B19/042

CPC classification number: H02M1/08 ,  G05B19/042 ,  G05B2219/2639 ,  H02M3/335 ,  H02M2001/0048

Abstract: A control method for improving dynamic response of switch power is based on a closed-loop control system comprising a sampling module, a dynamic control module, an error calculation module, a PID module, a mode control module, and a PWM module. The sampling module samples an output voltage Vo, and the dynamic control module compares the output voltage Vo with a set maximum voltage Vomax, a set minimum voltage Vomin, and a reference voltage Vref, so as to determine whether to adopt a dynamic mode. In the dynamic mode, when the output voltage Vo changes greatly, the output voltage Vo is rapidly restored to a stable voltage by inputting large power or small power.

公开(公告)号：US20180174942A1

公开(公告)日：2018-06-21

申请号：US15576850

申请日：2016-01-29

Applicant: SOUTHEAST UNIVERSITY

Inventor： Siyang LIU ,  Ning WANG ,  Jiaxing WEI ,  Chao LIU ,  Weifeng SUN ,  Shengli LU ,  Longxing SHI

IPC: H01L23/367 ,  H01L25/18 ,  H01L23/31 ,  H01L23/495 ,  H01L25/16

CPC classification number: H01L23/3675 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48175 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/17738 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A power module of a square flat pin-free packaging structure for suppressing the power module from being excessively high in local temperature. The power module includes an insulating resin, a driving chip, a plurality of power chips, and a plurality of metal electrode contacts. The driving chip, the power chips, and the metal electrode contacts are electrically connected through a metal lead according to a predetermined circuit. A plurality of metal heat dissipating disks used for heat dissipation of the power chips and a driving chip lead frame are disposed at the bottom of the insulating resin. A plurality of metal power chip lead frames are disposed on the metal heat dissipating disks, the power chips are disposed on the power chip lead frames, and the drain electrodes of the power chips are electrically connected to the metal heat dissipating disks.