Abstract:
A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
Abstract:
A vertical conduction integrated electronic device including: a semiconductor body; a trench that extends through part of the semiconductor body and delimits a portion of the semiconductor body, which forms a first conduction region having a first type of conductivity and a body region having a second type of conductivity, which overlies the first conduction region; a gate region of conductive material, which extends within the trench; an insulation region of dielectric material, which extends within the trench and is arranged between the gate region and the body region; and a second conduction region, which overlies the body region. The second conduction region is formed by a conductor.
Abstract:
An integrated electronic device includes an electronic component and a temperature transducer. The temperature transducer is electrically arranged between a control terminal and a conduction terminal of the electronic component and includes a first diode. The first diode has a bulk resistance of at least 1Ω.
Abstract:
An electrical protection device including an input line, an output terminal, and a power transistor coupled between the input line and the output terminal A sensing transistor is connected between the input line and the output terminal and has a body terminal. A control stage is coupled to respective control terminals of the power transistor and of the sensing transistor and is configured to limit a first current of the power transistor to a protection value. A body-driving stage is coupled to the body terminal and is configured to bias the body terminal of the sensing transistor as a function of an operating condition of the power transistor.
Abstract:
An IGBT transistor includes a drift region, at least one body region housed in the drift region and having a first type of conductivity, and a conduction region, which crosses the body region in a direction perpendicular to a surface of the drift region and has the first type of conductivity and a lower resistance than the body region. The conduction region includes a plurality of implant regions, arranged at respective depths from the surface of the drift region.
Abstract:
A semiconductor detector of gravitational waves of a first frequency may include an oscillator having a metal coated oscillating member over a metal coated semiconductor substrate to be subjected to a Casimir attraction force towards the semiconductor substrate. The oscillator may be configured to exert a force to counterbalance the Casimir attraction force causing the oscillating member oscillates with a main harmonic resonance frequency equal to the first frequency. A displacement sensor may be coupled to the substrate and oscillating member and configured to sense oscillations and to generate corresponding sense signals. A pass-band filter may be tuned to the main harmonic resonance frequency and configured to generate band-pass replica signals of the sense signals, and an airtight package may be configured to keep a vacuum between the oscillating member and the semiconductor substrate. An array of semiconductor detectors and a method of detecting gravitational waves are also disclosed.
Abstract:
A VTMOS transistor in semiconductor material of a first type of conductivity includes a body region of a second type of conductivity and a source region of the first type of conductivity. A gate region extends into the main surface through the body region and is insulated from the semiconductor material. A region of the gate region extends onto the main surface is insulated from the rest of the gate region. An anode region of the first type of conductivity is formed into said insulated region, and a cathode region of the second type of conductivity is formed into said insulated region in contact with the anode region; the anode region and the cathode region define a thermal diode electrically insulated from the chip.
Abstract:
A vertical conduction electronic power device includes a body delimited by a first and a second surface and having an epitaxial layer of semiconductor material, and a substrate. The epitaxial layer is delimited by the first surface of the body and the substrate is delimited by the second surface of the body. The epitaxial layer houses at least a first and a second conduction region having a first type of doping and a plurality of insulated-gate regions, which extend within the epitaxial layer. The substrate has at least one silicide region, which extends starting from the second surface of the body towards the epitaxial layer.
Abstract:
A field effect transistor has a semiconductor layer with a top surface extending in a horizontal plane, and an active area defined in which are trench gate regions, which extend in depth with respect to the top surface and have an insulating coating layer and a conductive inner layer, and source regions, adjacent to the trench gate regions so as to form a conductive channel extending vertically. The trench gate regions have a plurality of first gate regions, which extend in length in the form of stripes through the active area along a first direction of the horizontal plane, and moreover a plurality of second gate regions, which extend in length in the form of stripes through the same active area along a second direction of the horizontal plane, orthogonal to, and crossing, the first gate regions. In particular, the first gate regions and second gate regions cross in the active area, joining with a non-zero curvature radius.
Abstract:
In various embodiments, the present disclosure provides capacitors and methods of forming capacitors. In one embodiment, a capacitor includes a substrate, a first electrode on the substrate, a second electrode, and a first dielectric layer. A portion of the first electrode is exposed in a contact region. The first dielectric layer includes a first dielectric region between the first electrode and the second electrode, and a second dielectric region between the first dielectric region and the contact region. The second dielectric region is contiguous to the first dielectric region, and a surface of the second dielectric region defines a surface path between the first electrode and the contact region. The second dielectric region has a plurality of grooves that increase a spatial extension of said surface path.