公开(公告)号：US10578505B2

公开(公告)日：2020-03-03

申请号：US15958461

申请日：2018-04-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo Baldo ,  Sarah Zerbini ,  Enri Duqi

IPC: G01L9/00 ,  B81B3/00 ,  B81C1/00 ,  B81B7/00

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

公开(公告)号：US10427933B2

公开(公告)日：2019-10-01

申请号：US15880332

申请日：2018-01-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Sebastiano Conti

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00

Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.

公开(公告)号：US20190011694A1

公开(公告)日：2019-01-10

申请号：US16130765

申请日：2018-09-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Carminati ,  Enri Duqi ,  Sebastiano Conti

IPC: G02B26/08 ,  H04N9/31 ,  H02M3/335 ,  G05F3/26 ,  H02M1/12 ,  H02M1/15 ,  H02M1/42 ,  B81B3/00 ,  H02M1/00

Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

公开(公告)号：US20180031822A1

公开(公告)日：2018-02-01

申请号：US15465019

申请日：2017-03-21

Applicant: STMicroelectronics S.r.l.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Roberto Carminati ,  Flavio Francesco Villa

IPC: G02B26/08 ,  G02B26/10 ,  H04N9/31 ,  B81C1/00 ,  B81B7/02

Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.

公开(公告)号：US20180003950A1

公开(公告)日：2018-01-04

申请号：US15368184

申请日：2016-12-02

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Carminati ,  Enri Duqi ,  Sebastiano Conti

IPC: G02B26/08 ,  B81B3/00 ,  H04N9/31

CPC classification number: G02B26/0833 ,  B81B3/0045 ,  B81B2201/042 ,  B81B2203/0315 ,  B81B2203/056 ,  G05F3/26 ,  H02M1/12 ,  H02M1/15 ,  H02M1/42 ,  H02M1/4225 ,  H02M1/4258 ,  H02M3/33507 ,  H02M2001/0025 ,  H02M2001/0032 ,  H04N9/3155 ,  H04N9/3173 ,  Y02B70/126 ,  Y02B70/16

Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

公开(公告)号：US09688531B2

公开(公告)日：2017-06-27

申请号：US15191160

申请日：2016-06-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo Baldo ,  Enri Duqi ,  Flavio Francesco Villa

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0045 ,  B81B3/0072 ,  B81B2201/0228 ,  B81B2201/025 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00182 ,  B81C1/00325 ,  B81C2201/0116 ,  B81C2201/0173 ,  B81C2203/0785 ,  G02B26/0858

Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.

公开(公告)号：US12242051B2

公开(公告)日：2025-03-04

申请号：US17745186

申请日：2022-05-16

Applicant: STMicroelectronics S.r.l.

Inventor： Nicolo′ Boni ,  Gianluca Mendicino ,  Enri Duqi ,  Roberto Carminati ,  Massimiliano Merli

IPC: G02B26/08 ,  G01L1/18 ,  H02K11/21

Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.

公开(公告)号：US12117608B2

公开(公告)日：2024-10-15

申请号：US17369145

申请日：2021-07-07

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Carminati ,  Nicolo' Boni ,  Massimiliano Merli ,  Enri Duqi

IPC: G02B26/08 ,  G02B1/00 ,  G02B26/10 ,  G02B27/42

CPC classification number: G02B26/101 ,  G02B1/002 ,  G02B26/0833 ,  G02B27/4233

Abstract: A MEMS micromirror device is formed in a package including a containment body and a lid transparent to a light radiation. The package forms a cavity housing a tiltable platform having a reflecting surface. A metastructure is formed on the lid and/or on the reflecting surface and includes a plurality of diffractive optical elements.

公开(公告)号：US12024422B2

公开(公告)日：2024-07-02

申请号：US17161367

申请日：2021-01-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Domenico Giusti

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00238 ,  B81B7/0051 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0133 ,  B81C2203/032 ,  B81C2203/035 ,  B81C2203/0792

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

公开(公告)号：US11294168B2

公开(公告)日：2022-04-05

申请号：US16985818

申请日：2020-08-05

Applicant: STMicroelectronics S.r.l.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Roberto Carminati ,  Flavio Francesco Villa

IPC: G02B26/08 ,  B81C1/00 ,  B81B7/02 ,  G02B26/10 ,  H04N9/31

Abstract: A MEMS micromirror device includes a monolithic body of semiconductor material having a first main surface and a second main surface, with the monolithic body having an opening extending from the second main surface and including a suspended membrane of monocrystalline semiconductor material extending between the opening and the first main surface of the monolithic body. The suspended membrane includes a supporting frame and a mobile mass carried by the supporting frame and rotatable about an axis parallel to the first main surface, with the mobile mass having a width less than a width of the opening. A reflecting region extends over the mobile mass.