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公开(公告)号：US20220400565A1
公开(公告)日：2022-12-15
申请号：US17851518
申请日：2022-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wonho SHIN , Junghoon PARK , Joongkyung PARK
Abstract: A hinge apparatus according to various embodiments may include: a bracket including a first coupling part formed in a first direction with respect to a middle of the bracket and a second coupling part formed in a second direction opposite to the first direction with respect to the middle of the bracket, a first body part including a first plate, a first rotation part coupled with the first plate fastened to the first coupling part of the bracket and configured to rotate about the bracket, and a first cam formed in the first rotation part, a second body part including a second plate, a second rotation part coupled with the second plate fastened to the second coupling part of the bracket and configured to rotate about the bracket, and a second cam formed in the second rotation part, and a torque provision unit, including a first follower including a first cam part engaged with the first cam structure and disposed in the bracket, a second follower including a second cam part engaged with the second cam structure and disposed in the bracket, and a pressurizing part disposed in the bracket between the first follower and the second follower and configured to provide an elastic force to the first follower and the second follower in opposite directions.
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公开(公告)号：US20200161179A1
公开(公告)日：2020-05-21
申请号：US16751744
申请日：2020-01-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyun LEE , Youngwoo PARK , Junghoon PARK , Jaeduk LEE
IPC: H01L21/768 , H01L23/532 , H01L23/522 , H01L27/11582 , H01L27/1157 , H01L27/11575 , H01L27/11573
Abstract: A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a peripheral interconnection structure between the semiconductor pattern and the semiconductor substrate. The peripheral interconnection structure includes an upper interconnection structure on a lower interconnection structure. The upper interconnection structure includes an upper interconnection and an upper barrier layer. The lower interconnection structure includes a lower interconnection and a lower barrier layer. The upper barrier layer is under a bottom surface of the upper interconnection and does not cover side surfaces of the upper interconnection. The lower barrier layer is under a bottom surface of the lower interconnection and covers side surfaces of the lower interconnection.
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公开(公告)号：US20160379716A1
公开(公告)日：2016-12-29
申请号：US15259765
申请日：2016-09-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-Wan NAM , Kang-Bin LEE , Junghoon PARK
CPC classification number: G11C16/26 , G11C16/0483 , G11C16/12 , G11C16/16 , G11C16/34 , G11C16/3459 , H01L27/1157 , H01L27/11582
Abstract: An operating method of a nonvolatile memory, which includes a plurality of cell strings, each cell string having a plurality of memory cells and a string selection transistor stacked on a substrate, includes detecting threshold voltages of the string selection transistors of the plurality of cell strings; adjusting voltages to be supplied to the string selection transistors according to the detected threshold voltages; and applying the adjusted voltages to the string selection transistors to select or unselect the plurality of cell strings during a programming operation.
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24.发明申请METHOD FOR CONTROLLING POWER SUPPLY AND ELECTRONIC DEVICE IMPLEMENTING THE SAME 审中-公开用于控制电源的电子设备的方法和实现该电源的电子设备公开(公告)号：US20160342143A1
公开(公告)日：2016-11-24
申请号：US15156962
申请日：2016-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Jinwoo KIM
CPC classification number: H02H5/083 , G05B19/0428 , Y02B70/3241 , Y04S20/227
Abstract: An electronic device for controlling a power supply is provided. The electronic device includes a power unit configured to supply power, a power management unit configured to receive a supply of power from the power unit and to distribute the supplied power, a flood sensing unit connected to the power unit and located in a part of the electronic device most subject to flooding or fluid penetration, and a power control switch configured to, if a voltage level of the flood sensing unit is a first level indicating no detected flooding or fluid penetration, electrically connect the power unit and the power management unit to each other, and if the voltage level of the flood sensing unit is a second level indicating a detected flooding or fluid penetration, interrupt an electrical connection between the power unit and the power management unit.
Abstract translation: 提供了一种用于控制电源的电子设备。 电子设备包括被配置为提供电力的电力单元，被配置为从电力单元接收电力供应并且分配供电的电力管理单元，连接到电力单元并位于电力单元的一部分中的洪水感测单元 电子设备，其最受淹没或液体渗透的影响;以及功率控制开关，其被配置为：如果所述淹水检测单元的电压水平是表示没有检测到的淹没或液体渗透的第一水平，则将所述功率单元和所述电力管理单元电连接到 并且如果洪水感测单元的电压电平是指示检测到的溢流或流体穿透的第二电平，则中断电力单元和电力管理单元之间的电连接。
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公开(公告)号：US20230271047A1
公开(公告)日：2023-08-31
申请号：US18187987
申请日：2023-03-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghoon PARK , Jaehong KIM , Minhyung LEE , Seungyong HYUNG
IPC: A63B21/00
CPC classification number: A63B21/00043 , A63B21/4001 , A63B21/4025 , A63B21/4043
Abstract: A wearable exercise apparatus may include one or more of: a torso support including an abdominal frame, a chest frame, a shoulder frame, a back frame, an arm frame, a first guide, a wrist frame, a second guide, a glove, a dial rotatably connected to the chest frame, a string connected to the dial, at least partially wound around the dial, and passing through an inner space of each of the torso support and the first guide, and an elastic band having one end connected to the string and the other end connected to the wrist frame or the glove, passing through an inner space of each of the arm frame and the second guide, and extending or contracting by a tension of the string.
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Patent Agency Ranking
公开(公告)号：US20220400572A1
公开(公告)日：2022-12-15
申请号：US17893739
申请日：2022-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Seungbo SHIM , Yongjin WOO , Junhee HAN , Dongil SON
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.
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公开(公告)号：US20210285444A1
公开(公告)日：2021-09-16
申请号：US17199267
申请日：2021-03-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunghea CHO , Junghoon PARK , Jongcheun SEO , Namkyu CHO , Dohyun KIM , Junguk JUN
Abstract: Provided is a scroll compressor with enhanced sealing structure of a back pressure chamber. The scroll compressor includes a housing, a fixed scroll fixed to inside of the housing and including a fixed wrap, an orbit scroll including an orbit wrap which forms a compression chamber together with the fixed wrap, a back pressure chamber formed at a frame supporting the orbit scroll, and accommodating refrigerant for pressurizing the orbit scroll to a direction of the fixed scroll, and a sealing ring arranged between the fixed scroll and the orbit scroll to prevent the refrigerant in the back pressure chamber from flowing in or out through a gap between the fixed scroll and the orbit scroll, wherein the sealing ring includes a cut portion cut for the sealing ring to be deformable in a circumferential direction.
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公开(公告)号：US20210251079A1
公开(公告)日：2021-08-12
申请号：US17172351
申请日：2021-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Younggirl Yun , Sunggeun Kang , Myungsub Ko , Jaeyeon Ra , Seungbo Shim , Yongjin Woo , Junhee Han
Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
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公开(公告)号：US20210144856A1
公开(公告)日：2021-05-13
申请号：US17091349
申请日：2020-11-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Seungbo SHIM , Seunggoo KANG , Seockkeun HAN , Dongil SON
Abstract: Provided is an electronic device. The electronic device may include a housing; a first printed circuit board (PCB) disposed in an internal space of the housing and including a plurality of first conductive terminals; a second PCB arranged parallel to the first PCB in the internal space, and including a plurality of second conductive terminals; and an interposer disposed between the first PCB and the second PCB to electrically connect the first PCB and the second PCB, the interposer including: a dielectric substrate including a first substrate surface facing the first PCB, a second substrate surface facing the second PCB, and a substrate side surface surrounding a space between the first substrate surface and the second substrate surface; a plurality of conductive vias formed to penetrate from the first substrate surface of the dielectric substrate to the second substrate surface, and electrically connecting the plurality of first conductive terminals to the plurality of second conductive terminals; and a first conductive pattern formed from at least a portion of the substrate side surface to the first PCB, wherein the first conductive pattern may be electrically connected to a first conductive pad formed on the first PCB and electrically connected to the at least one first electrical element.
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公开(公告)号：US20210044686A1
公开(公告)日：2021-02-11
申请号：US16966797
申请日：2019-01-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Yonghwa KIM , Hyangbok LEE , Dongil SON
Abstract: Disclosed is an electronic device that includes a first printed circuit board including at least one electronic part, a first header mounted on the first printed circuit board, a first module that includes, on a first surface thereof, a first socket for engagement with the first header and includes a second header on a second surface opposite to the first surface and that performs a first function, a second module that includes, on one surface thereof, a second socket for engagement with the second header and that performs a second function, and a processor electrically connected with the first header, wherein the processor is configured to transfer at least one first signal for control of the first module or at least one second signal for control of the second module to the first header. Besides, it may be permissible to prepare various other embodiments speculated through the specification.
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