公开(公告)号：US20170145166A1

公开(公告)日：2017-05-25

申请号：US15356952

申请日：2016-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Hyunjeong JEON ,  Sang Soo JEE ,  Hongkyoon CHOI ,  Byunghee SOHN ,  Kyeong-Sik JU

IPC: C08G83/00

CPC classification number: C08G83/001 ,  C08K5/549 ,  C08L79/08 ,  C09D179/08 ,  H01L51/5253 ,  C08L83/04

Abstract: A composition for preparing an organic/inorganic hybrid poly(amide-imide) copolymer including a poly(amide-imide) copolymer, a poly(amide-amic acid) copolymer, or a poly(amide-imide/amic acid) copolymer including a structural unit represented by Chemical Formula 1; and a structural unit represented by Chemical Formula 2, a structural unit represented by Chemical Formula 3, or a combination thereof, and a polyhedral oligomeric silsesquioxane including a functional group capable of forming a hydrogen bond: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.

公开(公告)号：US20140016253A1

公开(公告)日：2014-01-16

申请号：US13941789

申请日：2013-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun Sung LEE ,  Se Yun KIM ,  Jin Man Park ,  Young Hwan KIM ,  Suk Jun KIM ,  Sang Soo JEE ,  Sang Mock LEE ,  In Taek HAN

IPC: H05K7/14 ,  H05K13/04 ,  B23K35/24

CPC classification number: H05K7/14 ,  B23K35/24 ,  G02F1/1339 ,  G02F2202/08 ,  H05K13/04

Abstract: A sealing material includes a metallic glass

Abstract translation: 密封材料包括金属玻璃

公开(公告)号：US20230357505A1

公开(公告)日：2023-11-09

申请号：US18222372

申请日：2023-07-14

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong JEON ,  Sang Soo JEE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C09D179/08 ,  C08J5/18 ,  C08G73/10 ,  C08G18/60 ,  C08G18/76 ,  C08G18/73 ,  C08G18/64 ,  C08G18/75 ,  G02F1/1333

CPC classification number: C08G73/14 ,  C09D179/08 ,  C08J5/18 ,  C08G73/1035 ,  C08G18/603 ,  C08G18/7621 ,  C08G18/73 ,  C08G18/6438 ,  C08G18/755 ,  G02F1/133308 ,  C08J2379/08 ,  C08G2150/00 ,  G02F1/133305 ,  G02F1/133331

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

公开(公告)号：US20180305545A1

公开(公告)日：2018-10-25

申请号：US15958549

申请日：2018-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Chanjae AHN ,  Jungha CHAE ,  Won Suk CHANG ,  A Ra JO ,  Sang Soo JEE ,  Sungwon CHOI

IPC: C08L79/08 ,  C08G73/10 ,  C08G73/14

CPC classification number: C08L79/08 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1078 ,  C08G73/14 ,  C08J5/18 ,  C08J2379/08 ,  C08L2203/16 ,  C08L2203/20

Abstract: A poly(amide-imide) copolymer including a reaction product of at least one tetracarboxylic acid dianhydride, at least one diamine, and at least one dicarboxylic acid derivative, wherein the at least one tetracarboxylic acid dianhydride includes a tetracarboxylic acid dianhydride represented by Chemical Formula 1, the at least one diamine includes a diamine represented by Chemical Formula 2, and the at least one dicarboxylic acid derivative includes a dicarboxylic acid derivative represented by Chemical Formula 3: wherein, R1 to R3, X1 and X2 are the same as defined in the specification.

公开(公告)号：US20180237589A1

公开(公告)日：2018-08-23

申请号：US15847063

申请日：2017-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong JEON ,  Sang Soo JEE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C09D179/08 ,  C08G73/10 ,  C08J5/18

CPC classification number: C08G73/14 ,  C08G18/603 ,  C08G18/6438 ,  C08G18/73 ,  C08G18/755 ,  C08G18/7621 ,  C08G73/1035 ,  C08G2150/00 ,  C08J5/18 ,  C08J2379/08 ,  C09D179/08 ,  G02F1/133305 ,  G02F1/133308 ,  G02F2001/133331

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

公开(公告)号：US20180112049A1

公开(公告)日：2018-04-26

申请号：US15714436

申请日：2017-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sun Jin SONG ,  Sang Soo JEE ,  Boreum JEONG ,  Hyunjeong JEON ,  Chanjae AHN

IPC: C08J7/04 ,  C08J5/18 ,  G02B1/04 ,  G02B1/14

Abstract: A stacked transparent film includes a polymer film including at least one of an amide structural unit and an imide structural unit, wherein the polymer film has a refractive index of about 1.65 to about 1.75 at a 550 nanometer wavelength and an elastic modulus of greater than or equal to about 5.5 gigapascals; and at least one of a first coating layer on a first side of the polymer film and a second coating layer on a side opposite the first side of the polymer film.

公开(公告)号：US20180022875A1

公开(公告)日：2018-01-25

申请号：US15720992

申请日：2017-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Sungwon CHOI ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Byunghee SOHN ,  Won Suk CHANG

IPC: C08G77/455 ,  C08L83/12 ,  C08G77/04 ,  C08G73/14

CPC classification number: C08G77/455 ,  C08G73/1007 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/14 ,  C08G77/04 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08L79/08 ,  C08L83/12 ,  C09D179/08 ,  C08L83/04

Abstract: A composition including a polyamideimide precursor modified with an alkoxysilane group and an oligosilica compound, wherein the oligosilica compound is a condensation reaction product of an organosilane diol and an alkoxysilane compound.

公开(公告)号：US20180019350A9

公开(公告)日：2018-01-18

申请号：US13673359

申请日：2012-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se Yun KIM ,  Suk Jun KIM ,  Eun Sung LEE ,  Sang Soo JEE ,  Jeong Na HEO

IPC: H01L31/0224 ,  B22F1/00 ,  C22C45/08 ,  B23K35/28 ,  B23K35/02 ,  H01B1/22 ,  C22C21/00 ,  C22C45/00 ,  H01L31/068 ,  H01L31/18 ,  B23K35/30 ,  B22F3/10

CPC classification number: H01L31/0224 ,  B22F1/0059 ,  B22F3/10 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0261 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  C22C21/00 ,  C22C45/00 ,  C22C45/08 ,  H01B1/22 ,  H01L31/022425 ,  H01L31/0682 ,  H01L31/18 ,  Y02E10/547

Abstract: A conductive paste includes a conductive powder, a metallic glass having a glass transition temperature of less than or equal to about 600° C. and a supercooled liquid region of greater than or equal to 0 K, and an organic vehicle, and an electronic device and a solar cell include an electrode formed using the conductive paste.

公开(公告)号：US20170101509A1

公开(公告)日：2017-04-13

申请号：US15291603

申请日：2016-10-12

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sang Soo JEE ,  Hyunjeong JEON ,  Sungwon CHOI ,  Byunghee SOHN ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08J5/18 ,  C08G73/10

CPC classification number: C08G73/14 ,  C08G73/1028 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C08J5/18 ,  C08J2379/08

Abstract: A poly(imide-amide) copolymer includes: an imide structural unit which is a reaction product of a first diamine and a dianhydride, and an amide structural unit which is a reaction product of a second diamine and a diacyl halide, wherein each of the first diamine and the second diamine includes 2,2′-bis-trifluoromethyl-4,4′-biphenyldiamine, and at least one of the first diamine and the second diamine further includes a compound represented by Chemical Formula 1, wherein the dianhydride includes 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-hexafluoroisopropylidene diphthalic anhydride, wherein the diacyl halide includes terephthaloyl chloride (TPCI), and wherein an amount of the compound represented by Chemical Formula 1 is less than or equal to about 10 mole percent based on the total amount of the first diamine and the second diamine: NH2-A-NH2  Chemical Formula 1 wherein in Chemical Formula 1, A is the same as described in the detailed description.

公开(公告)号：US20140345919A1

公开(公告)日：2014-11-27

申请号：US14095005

申请日：2013-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se Yun KIM ,  Eun Sung LEE ,  Keum Hwan PARK ,  Weon Ho SHIN ,  Suk Jun KIM ,  Jin Man PARK ,  Sang Soo JEE

IPC: H05K1/02 ,  H05K1/09 ,  H01B13/00 ,  H01B1/16 ,  H01B1/02

CPC classification number: H05K1/09 ,  H01B1/16 ,  H01L31/02167 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/101 ,  H05K3/1216 ,  H05K3/1275 ,  H05K2201/0108 ,  Y02E10/50

Abstract: A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture comprising the metallic glass; and firing the metallic glass or the mixture comprising the metallic glass at a predetermined temperature higher than a glass transition temperature of the metallic glass.

Abstract translation: 透明导体包括金属玻璃，并且制造透明导体的方法包括：制备金属玻璃或包含金属玻璃的混合物; 并且在高于金属玻璃的玻璃化转变温度的预定温度下烧制金属玻璃或包含金属玻璃的混合物。