公开(公告)号：US11362105B2

公开(公告)日：2022-06-14

申请号：US16902489

申请日：2020-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin Song ,  Kangmin Kim ,  Joongshik Shin ,  Geunwon Lim

IPC: H01L27/11565 ,  H01L27/11582 ,  H01L27/1157

Abstract: A vertical memory device includes gate electrode structures, channels, first to third division patterns, and a first support layer. The gate electrode structure includes gate electrodes stacked in a first direction, and extends in a second direction. The gate electrode structures are spaced apart from one another in a third direction. The first division pattern extends in the second direction between the gate electrode structures. The second and third division patterns are alternately disposed in the second direction between the gate electrode structures. The first support layer is on the gate electrode structures at substantially the same height as upper portions of the first and second division patterns, and contacts the upper portions of the first and second division patterns. The upper portions of the first and second division patterns are arranged in a zigzag pattern in the second direction in a plan view.

公开(公告)号：US20190165157A1

公开(公告)日：2019-05-30

申请号：US16011785

申请日：2018-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junggil Yang ,  Seungmin Song ,  Geumjong Bae ,  DONG IL BAE

IPC: H01L29/78 ,  H01L29/423 ,  H01L29/417 ,  H01L29/66

Abstract: A semiconductor device includes a channel pattern including a first semiconductor pattern and a second semiconductor pattern, which are sequentially stacked on a substrate, and a gate electrode that extends in a first direction and crosses the channel pattern. The gate electrode includes a first portion interposed between the substrate and the first semiconductor pattern and a second portion interposed between the first and second semiconductor patterns. A maximum width in a second direction of the first portion is greater than a maximum width in the second direction of the second portion, and a maximum length in the second direction of the second semiconductor pattern is less than a maximum length in the second direction of the first semiconductor pattern.

公开(公告)号：US12300751B2

公开(公告)日：2025-05-13

申请号：US18124339

申请日：2023-03-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junggil Yang ,  Seungmin Song ,  Geumjong Bae ,  Dong Il Bae

IPC: H01L29/78 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/786

Abstract: A semiconductor device includes a channel pattern including a first semiconductor pattern and a second semiconductor pattern, which are sequentially stacked on a substrate, and a gate electrode that extends in a first direction and crosses the channel pattern. The gate electrode includes a first portion interposed between the substrate and the first semiconductor pattern and a second portion interposed between the first and second semiconductor patterns. A maximum width in a second direction of the first portion is greater than a maximum width in the second direction of the second portion, and a maximum length in the second direction of the second semiconductor pattern is less than a maximum length in the second direction of the first semiconductor pattern.

公开(公告)号：US12289888B2

公开(公告)日：2025-04-29

申请号：US17878304

申请日：2022-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin Song ,  Beyounghyun Koh ,  Yongjin Kwon ,  Kangmin Kim ,  Jaehoon Shin ,  Joongshik Shin ,  Sungsoo Ahn ,  Seunghwan Lee

IPC: H10B43/27 ,  H10B43/10 ,  H10B43/35 ,  H10B43/40

Abstract: A memory device includes a substrate; a stacked structure including a plurality of gate layers and a plurality of interlayer insulating layers that are alternately stacked on the substrate in a vertical direction, the stacked structure including a row of cutouts, each of the cutouts extending in a first horizontal direction and being configured to cut the plurality of gate layers, the cutouts being apart from each other and arranged in a cell region of the stacked structure in the first horizontal direction; and a row of channel structures, the channel structures being arranged in the cell region in the first horizontal direction, each of the channel structures extending in the vertical direction to penetrate the plurality of gate layers.

公开(公告)号：US12219760B2

公开(公告)日：2025-02-04

申请号：US17338823

申请日：2021-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kangmin Kim ,  Seungmin Song ,  Dongseog Eun ,  Seokhwa Jung

IPC: H10B43/27 ,  H10B41/27 ,  H10B41/41 ,  H10B43/40

Abstract: A semiconductor chip includes a substrate, a source structure disposed on the substrate, and a support pattern disposed on the source structure. Each of the source structure and the support pattern includes polysilicon. The semiconductor chip further includes an electrode structure disposed on the support pattern, and a plurality of vertical structures extending vertically through the electrode structure. The electrode structure includes a lower electrode structure disposed on the support pattern and including a plurality of lower gate electrodes and a plurality of first insulating films, a second insulating film disposed on the lower electrode structure, and an upper electrode structure disposed on the second insulating film and including a plurality of upper gate electrodes and a plurality of third insulating films. The vertical structures contact the source structure above the source structure.

公开(公告)号：US12107172B2

公开(公告)日：2024-10-01

申请号：US18478410

申请日：2023-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungmin Song ,  Taeyong Kwon ,  Jaehyeoung Ma ,  Namhyun Lee

IPC: H01L29/786 ,  H01L21/02 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66

CPC classification number: H01L29/78696 ,  H01L21/0259 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L21/823871 ,  H01L27/092 ,  H01L29/0665 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/66742 ,  H01L29/78618

Abstract: A semiconductor device including a substrate including a division region extending in a first direction, first and second active patterns on the substrate with the division region interposed therebetween, the first and the second active patterns being spaced apart from each other in a second direction perpendicular to the first direction, gate electrodes extending in the first direction and crossing the first and second active patterns, a first channel pattern on the first active pattern, and a second channel pattern on the second active pattern may be provided. The smallest width of the first active pattern may be smaller than the smallest width of the second active pattern, in the first direction. An end portion of the first channel pattern adjacent to the division region may include a protruding portion extending in the first direction, and the protruding portion may have a triangle shape in a plan view.

公开(公告)号：US11961914B2

公开(公告)日：2024-04-16

申请号：US18321962

申请日：2023-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungmin Song ,  Junbeom Park ,  Bongseok Suh ,  Junggil Yang

IPC: H01L29/78 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/423 ,  H01L29/66

CPC classification number: H01L29/785 ,  H01L21/823431 ,  H01L27/0886 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66795

Abstract: Integrated circuit devices including a fin shaped active region and methods of forming the same are provided. The devices may include a fin shaped active region, a plurality of semiconductor patterns on the fin shaped active region, a gate electrode on the plurality of semiconductor patterns, and source/drain regions on opposing sides of the gate electrode, respectively. The gate electrode may include a main gate portion extending on an uppermost semiconductor pattern and a sub-gate portion extending between two adjacent ones of the plurality of semiconductor patterns. The sub-gate portion may include a sub-gate center portion and sub-gate edge portions. In a horizontal cross-sectional view, a first width of the sub-gate center portion in a first direction may be less than a second width of one of the sub-gate edge portions in the first direction.

公开(公告)号：US20240072048A1

公开(公告)日：2024-02-29

申请号：US18184901

申请日：2023-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungchan Yun ,  Seungmin Song ,  Myunghoon Jung ,  Keumseok Park ,  Kang-ill Seo

IPC: H01L27/088 ,  H01L21/8234 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L27/088 ,  H01L21/823412 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/775 ,  H01L29/78696

Abstract: An integrated circuit device may comprise an upper transistor that is on a substrate. The upper transistor may comprise an upper channel region. The integrated circuit device may further comprise a lower transistor that is between the substrate and the upper transistor. The lower transistor may comprise a lower channel region. The integrated circuit device may further include an integrated insulator that is between the lower channel region and the upper channel region. The integrated insulator may comprise an outer layer and an inner layer in the outer layer, wherein the inner layer and the outer layer comprise different materials.

公开(公告)号：US11894463B2

公开(公告)日：2024-02-06

申请号：US18093877

申请日：2023-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin Song ,  Bongseok Suh ,  Junggil Yang ,  Soojin Jeong

IPC: H01L29/78 ,  H01L29/06 ,  H01L29/08 ,  H01L29/423

CPC classification number: H01L29/7853 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/42392

Abstract: An integrated circuit includes a fin active region protruding from a substrate, a plurality of semiconductor patterns on an upper surface of the fin active region, a gate electrode that surrounds the plurality of semiconductor patterns and includes a main gate part on an uppermost one of the plurality of semiconductor patterns and sub gate parts between the plurality of semiconductor patterns, a spacer structure on a sidewall of the main gate part, and a source/drain region at a side of the gate electrode. The source/drain region is connected to the plurality of semiconductor patterns and contacts a bottom surface of the spacer structure. A top portion of the uppermost semiconductor pattern has a first width. A bottom portion of the uppermost semiconductor pattern has a second width smaller than the first width.

公开(公告)号：US11784256B2

公开(公告)日：2023-10-10

申请号：US17556001

申请日：2021-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soojin Jeong ,  Dong Il Bae ,  Geumjong Bae ,  Seungmin Song ,  Junggil Yang

IPC: H01L29/78 ,  H01L29/06 ,  H01L29/423 ,  H01L27/092 ,  H01L29/08 ,  H01L29/786 ,  H01L29/66 ,  H01L21/8238 ,  H01L27/06

CPC classification number: H01L29/785 ,  H01L21/823807 ,  H01L27/0688 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/42356 ,  H01L29/42392 ,  H01L29/66772 ,  H01L29/78618 ,  H01L29/78654 ,  H01L2029/7858

Abstract: A semiconductor device may include first and second channel patterns on a substrate, first and second source/drain patterns in contact respectively with the first and second channel patterns, and first and second gate electrodes respectively overlapping the first and second channel patterns. The first gate electrode may include a first segment between first and second semiconductor patterns of the first channel pattern. The first segment may include a first convex portion protruding toward the first source/drain pattern. The second gate electrode may include a second segment between third and fourth semiconductor patterns of the second channel pattern. The second segment may include a concave portion recessed toward a center of the second segment.