公开(公告)号：US11705024B2

公开(公告)日：2023-07-18

申请号：US17847567

申请日：2022-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunyong Choi ,  Jisu Kim ,  Hunsung Kim ,  Boum-Sik Kim ,  Seungjae Kim ,  Chul-Yong Cho ,  Tae-Hun Kim

IPC: G06F1/16 ,  G09F9/30

CPC classification number: G09F9/301 ,  G06F1/1652 ,  G06F1/1658

Abstract: A display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. The mobile device is configured to be paired with the display module. The mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. The mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.

公开(公告)号：US10660471B2

公开(公告)日：2020-05-26

申请号：US15858806

申请日：2017-12-29

Applicant: Samsung Electronics Co., Ltd

Inventor： Tae-Hun Kim ,  Jong-Hoon Lee ,  Kun-Woo Choi ,  Seo Kang Kim ,  Woo Joo Kim ,  In Ki Jeon ,  Seong Joo Cho

IPC: F24C15/00 ,  F24C15/02 ,  F24C15/08 ,  F24C15/32 ,  F24C15/20 ,  A21B1/24 ,  A21B1/26 ,  A21B1/28 ,  A47J27/12 ,  A47J37/06 ,  H05B1/02 ,  H05B6/64

Abstract: Disclosed herein is a cooking appliance having an improved cooling mechanism. The cooking appliance includes a first cavity forming a first cooking chamber and a second cavity forming a second cooking chamber, and has a cooling mechanism for cooling both the first cavity and the second cavity. A separate third cooling channel is formed to exhaust air from the first cooking chamber. A vent for the first and second cavities may be formed at a lower portion of the second cavity such that air may be exhausted via the vent.

公开(公告)号：US08970025B2

公开(公告)日：2015-03-03

申请号：US14279776

申请日：2014-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Hun Kim ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

IPC: H01L23/02 ,  H01L21/00 ,  H01L23/522 ,  H01L25/10 ,  H01L25/16 ,  H01L21/78 ,  H01L23/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5226 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/14 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00012

Abstract: Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.

Abstract translation: 提供了一种形成封装封装的方法。 使用晶片级成型工艺形成覆盖晶片的封装。 晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。 密封剂可以具有与TSV对准的开口。 密封剂和半导体芯片被分割以形成多个半导体封装。 另一个半导体封装堆叠在从半导体封装中选择的一个上。 另一个半导体封装电连接到TSV。

公开(公告)号：USD720614S1

公开(公告)日：2015-01-06

申请号：US29468889

申请日：2013-10-04

Applicant: Samsung Electronics Co., Ltd.

Designer： Yu-Sun Kim ,  Tae-Hun Kim

公开(公告)号：USD694310S1

公开(公告)日：2013-11-26

申请号：US29451136

申请日：2013-03-28

Applicant: Samsung Electronics Co., Ltd.

Designer： Ju-Won Cho ,  Dan-Bi Kang ,  Tae-Hun Kim