利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

25 条记录 (耗时 0.019 秒)

    Motor-operated valve assembly
    21.
    发明授权
    Motor-operated valve assembly 有权
    电动阀门总成

    公开(公告)号：US07318577B2

    公开(公告)日：2008-01-15

    申请号：US11397642

    申请日：2006-04-05

    申请人： Takahiro Kouzu ,  Tadashi Komiyama

    发明人： Takahiro Kouzu ,  Tadashi Komiyama

    IPC分类号： F16K31/02

    CPC分类号： F16K31/047

    摘要： A motor-operated valve assembly has a housing, a motor, a driving force transmission means and a valve member. The housing has a fluid passage therein. The motor is installed in the housing. The driving force transmission means has an output rotor rotatably supported by the housing and transmits a driving force of the motor to the output rotor. The valve member is supported by the housing between the motor and the output rotor to be slidable in an axial direction thereof and engaged with the output rotor so that the output rotor slides the valve member to open and close the fluid passage.

    摘要翻译： 电动阀组件具有壳体，马达，驱动力传递装置和阀构件。 外壳在其中具有流体通道。 电机安装在外壳中。 驱动力传递装置具有由壳体可旋转地支撑的输出转子，并将马达的驱动力传递到输出转子。 阀构件由电动机和输出转子之间的壳体支撑以能够在其轴向方向上滑动并与输出转子接合，使得输出转子滑动阀构件以打开和关闭流体通道。

    Pressure detecting apparatus having solenoid valve and pressure sensor
    22.
    发明授权
    Pressure detecting apparatus having solenoid valve and pressure sensor 失效
    具有电磁阀和压力传感器的压力检测装置

    公开(公告)号：US07178330B2

    公开(公告)日：2007-02-20

    申请号：US11075762

    申请日：2005-03-10

    申请人： Takahiro Kouzu ,  Tadashi Komiyama

    发明人： Takahiro Kouzu ,  Tadashi Komiyama

    IPC分类号： F01N3/00

    CPC分类号： F01N3/222 ,  F01N3/22 ,  F01N3/32 ,  F01N2550/14 ,  F01N2560/08 ,  Y02T10/20 ,  Y10T137/5762

    摘要： A secondary air pressure detecting apparatus includes a solenoid valve and a pressure sensor. The solenoid valve defines a secondary air passage that introduces secondary air from the air pump into the exhaust system of an engine. The solenoid valve opens and closes the secondary air passage. The pressure sensor is integrally mounted to the solenoid valve to detect pressure of secondary air in the solenoid valve. The solenoid valve includes a coil assembly and magnetic members. The coil assembly includes a solenoid coil that generates magnetic force when the solenoid coil is energized. The magnetic members construct a magnetic circuit with the solenoid coil. The magnetic circuit is arranged outside of the secondary air passage. The pressure sensor is arranged on an opposite side of the secondary air passage with respect to the magnetic circuit.

    摘要翻译： 二次气压检测装置包括电磁阀和压力传感器。 电磁阀限定了二次空气通道，其将二次空气从空气泵引入发动机的排气系统。 电磁阀打开和关闭二次空气通道。 压力传感器一体地安装在电磁阀上，以检测电磁阀中二次空气的压力。 电磁阀包括线圈组件和磁性构件。 线圈组件包括螺线管线圈，其在螺线管线圈通电时产生磁力。 磁性构件与螺线管线圈构成磁路。 磁路布置在二次空气通道的外侧。 压力传感器相对于磁路布置在二次空气通道的相对侧上。

    Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices
    23.
    发明授权
    Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices 有权
    半导体芯片的制造方法，半导体装置的制造方法，半导体芯片，半导体装置，连接基板以及电子装置

    公开(公告)号：US06900076B2

    公开(公告)日：2005-05-31

    申请号：US09776528

    申请日：2001-02-04

    申请人： Tadashi Komiyama ,  Akitoshi Hara ,  Eiichi Sato

    发明人： Tadashi Komiyama ,  Akitoshi Hara ,  Eiichi Sato

    IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L21/48

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/10158 ,  H01L2924/00

    摘要： Certain embodiments of the present invention relate to a method for manufacturing a semiconductor chip, a method for manufacturing a semiconductor device, a semiconductor chip, a semiconductor device, a connection substrate and an electronic apparatus, in which semiconductor chips stacked in layers are electrically connected to one another without using wires. In one embodiment, after an electrode 18 is formed on a surface 16 of a first semiconductor chip 12, a hole 26 is formed from an opposite surface 24 thereof until a tungsten layer 20 of the electrode 18 is exposed. A protrusion 30 is formed by etching on a surface 31 of a second semiconductor chip 14 and thereafter an abutting electrode 32 is formed on an apex section of the protrusion 30. The first semiconductor chip 12 and the second semiconductor chip 14 are stacked on top of the other such that the abutting electrode 32 contacts the electrode 18. As a result, the path between the electrodes becomes shorter and therefore signal delays are inhibited or prevented. Also, there are no restrictions on the area of semiconductor chips to be stacked. As a result, semiconductor chips having the same area can be stacked in layers, and thus the size of the semiconductor device 10 can be reduced.

    摘要翻译： 本发明的某些实施例涉及半导体芯片的制造方法，制造半导体器件的方法，半导体芯片，半导体器件，连接基板和电子设备，其中层叠的半导体芯片电连接 彼此不用电线。 在一个实施例中，在第一半导体芯片12的表面16上形成电极18之后，从其相对表面24形成孔26直到电极18的钨层20露出。 通过蚀刻在第二半导体芯片14的表面31上形成突起30，然后在突起30的顶点上形成邻接电极32.第一半导体芯片12和第二半导体芯片14堆叠在 另一个使得邻接电极32接触电极18.结果，电极之间的路径变短，因此抑制或防止信号延迟。 此外，对于要堆叠的半导体芯片的面积没有限制。 结果，可以层叠具有相同面积的半导体芯片，因此可以减小半导体器件10的尺寸。