摘要:
A one-time programmable read-only memory (OTP-ROM) including a substrate, a first doped region, a second doped region, a gate dielectric layer, a first gate and a second gate. The substrate is of a first conductive type. The first doped region and the second doped region are of a second conductive type and are separately disposed in the substrate. The gate dielectric layer is disposed on the substrate between the first doped region and the second doped region. The first gate and the second gate are disposed on the gate dielectric layer, respectively. The first gate is adjacent to the first doped region, while the second gate is adjacent to the second doped region. Here, the first gate is electrically coupled grounded, and the OTP-ROM is programmed through a breakdown effect.
摘要:
A one-time programmable read-only memory (OTP-ROM) including a substrate, a first doped region, a second doped region, a third doped region, a first dielectric layer, a select gate, a second dielectric layer, a first channel, a second channel and a silicide layer is provided. The first doped region, the second doped region and the third doped region are disposed apart in a substrate. The first dielectric layer is disposed on the substrate between the first doped region and the second doped region. The select gate is disposed on the first dielectric layer. The second dielectric layer is disposed on the substrate between the second doped region and the third doped region. The silicide layer is disposed on the first doped region, the second doped region and the third doped region. The OTP-ROM stores data by a punch-through effect occurring between the second doped region and the third doped region.
摘要:
A modified nitride spacer and making of the same are disclosed. The modified nitride spacer is formed adjacent a high-temperature oxide (HTO) layer which in turn is formed adjacent the sidewalls of a gate electrode. It is shown that the placement of an intervening oxide layer between the sidewalls of the gate electrode and the nitride spacer, in that order only, provides a significant improvement in charge retention in floating gate memory cells. Also, forming of the spacer from pure, undoped oxide only yields the same favorable results.
摘要:
The present invention provides method to fabricate a snap-back flash EEPROMS device. The method begins by forming a gate structure 22 24 28 26 on a substrate. The gate structure comprises: a tunnel oxide layer 22, a floating gate 24, integrate dielectric layer 28, and a control gate 26. A drain 14 is formed adjacent to the gate structure by an masking 51 and ion implant process. Next, a source side doped region 18 is formed adjacent to and under a portion of the gate structure 22 24 28 26 by an masking and ion implant process. Spacers 32 are now formed on the sidewalls of the gate structure. A source 20 is formed overlapping portion of the side source doped region 18 and adjacent to the spacers 32. The side source doped region has a lower dopant concentration than the source 20. This method forms a snap-back memory cell wherein the side source doped region 18 is used to apply a high voltage to operate the EEPROM cell in a snap-back erase mode.
摘要:
A method to erase data from a flash EEPROM cell while electrical charges trapped in the tunnel oxide of a flash EEPROM cell are eliminated to maintain proper separation of the programmed threshold voltage and the erased threshold voltage after extended programming and erasing cycles. The method to erase a flash EEPROM cell begins by first applying a first relatively high positive voltage pulse to the source of the flash EEPROM cell. Simultaneously a ground reference voltage is applied to the control gate and to the semiconductor substrate. At this same time the drain is floating. The flash EEPROM cell is then detrapped by floating the source and drain and applying a second relatively high positive voltage pulse to the semiconductor substrate. At the same time a relatively large negative voltage pulse is applied to the control gate.
摘要:
A method to erase data from a flash EEPROM while electrical charges trapped in the tunneling oxide of a flash EEPROM are eliminated to maintain proper separation of the programmed threshold voltage and the erased threshold voltage after extended programming and erasing cycles, while preventing damage due to high field stress in the tunneling oxide. The method to erase a flash EEPROM cell begins by applying a relatively high positive voltage pulse to the source of the EEPROM cell. Simultaneously a ground reference voltage is applied to the drain and to the semiconductor substrate. At the same time a relatively large negative voltage pulse is applied to the control gate. This will cause a parasitic bipolar transistor to conduct and go into a snap back condition reducing the voltage field in the tunneling oxide.
摘要:
A method to erase data from a flash EEPROM while electrical charges trapped in the tunneling oxide of a flash EEPROM are eliminated to maintain proper separation of the programmed threshold voltage and the erased threshold voltage after extended programming and erasing cycles. The method to erase a flash EEPROM cell begins by channel erasing to detrap the tunneling oxide of the flash EEPROM cell. The channel erasing consists floating the drain and the second diffusion well and concurrently applying the ground reference potential to the semiconductor substrate and the first diffusion well. Concurrently a first relatively large negative voltage pulse is applied to the control gate, as a first moderately large positive voltage pulse is applied to said source. The method to erase then proceeds with the source erasing to remove charges from the floating gate of the flash EEPROM cell. The source erasing consists of applying a second relatively large negative voltage pulse to the control gate of said EEPROM cell and concurrently applying a second moderately large positive voltage pulse to a first diffusion well. At the same time the ground reference potential continues to be applied to the semiconductor substrate, while the drain and a second diffusion well is allowed to float.
摘要:
A method to erase data from a flash EEPROM is disclosed. Electrical charges trapped in the tunneling oxide of a flash EEPROM are eliminated to maintain proper separation of the programmed threshold voltage and the erased threshold voltage after extended programming and erasing cycles. The method to erase a flash EEPROM cell begins by erasing the flash EEPROM cell by first applying a high positive voltage pulse to the source of the EEPROM cell. Simultaneously, a ground reference potential is applied to the semiconductor substrate and the control gate. At this same time the drain is floating. Floating the source and drain and applying the ground reference potential to the semiconductor substrate then detraps the flash EEPROM cell. At the same time, a relatively large negative voltage pulse is applied to the control gate.
摘要:
The present invention provides method to erase and program flash EEPROMS devices using a clipped sine waveform (Vg). The clipped sine waveform reduces the tunneling oxide electric field between the floating gate and the source or drain region thereby reducing electron trapping. The method for the erase cycle comprises: applying a positive voltage to a source region; grounding a well region; floating the drain region; and simultaneously applying a negative clipped sine waveform voltage to a control gate during the erase cycle. The program cycle of the invention comprises: applying a voltage to a drain region; grounding a well region; floating a source region; and simultaneously applying a clipped sine waveform voltage to the control gate whereby the clipped sine waveforms reduce the electric field in a tunnel oxide layer which reduces the electron trapping.
摘要:
A method for fabricating a single polysilicon, non-volatile memory device, has been developed. The method features the use of a metal structure, comprised to contact an underlying control gate region, located in the semiconductor structure, in addition to providing the upper electrode, for a capacitor structure. The capacitor structure, in addition to the metal structure used as the upper electrode, is also comprised of an underlying capacitor dielectric layer, and an underlying polysilicon floating gate structure, used as the lower electrode of the capacitor structure. The creation of the capacitor structure results in performance increases realized via the additional control gate coupling capacitance, obtained via the novel configuration described in this invention.