公开(公告)号：US6110770A

公开(公告)日：2000-08-29

申请号：US229306

申请日：1999-01-13

申请人： Hongyong Zhang ,  Hideki Uochi ,  Toru Takayama ,  Shunpei Yamazaki ,  Yasuhiko Takemura

发明人： Hongyong Zhang ,  Hideki Uochi ,  Toru Takayama ,  Shunpei Yamazaki ,  Yasuhiko Takemura

IPC分类号： H01L21/20 ,  H01L21/00 ,  H01L21/324 ,  H01L21/336 ,  H01L27/12 ,  H01L29/02 ,  H01L29/78 ,  H01L29/786 ,  H01L21/84

CPC分类号： H01L21/2022 ,  H01L27/1281 ,  H01L29/66757

摘要： A process for fabricating a semiconductor by crystallizing a silicon film in a substantially amorphous state by annealing it at a temperature not higher than the crystallization temperature of amorphous silicon, and it comprises forming selectively, on the surface or under an amorphous silicon film, a coating, particles, clusters, and the like containing nickel, iron, cobalt, platinum or palladium either as a pure metal or a compound thereof such as a silicide, a salt, and the like, shaped into island-like portions, linear portions, stripes, or dots; and then annealing the resulting structure at a temperature lower than the crystallization temperature of an amorphous silicon by 20 to 150.degree. C.

摘要翻译： 一种通过在不高于非晶硅的结晶温度的温度下进行退火将基本无定形态的硅膜结晶化的半导体制造方法，其包括在表面上或非晶硅膜下选择性地形成涂层 ，含有镍，铁，钴，铂或钯的颗粒，簇等作为纯金属或其化合物，例如硅化物，盐等，成形为岛状部分，线状部分，条纹 ，或点; 然后在低于非晶硅的结晶温度的温度下将所得结构退火20〜150℃。

公开(公告)号：US5956579A

公开(公告)日：1999-09-21

申请号：US893361

申请日：1997-07-15

申请人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

发明人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

IPC分类号： H01L29/78 ,  H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/786 ,  H01L21/00

CPC分类号： H01L29/78696 ,  H01L21/2022 ,  H01L21/2026 ,  H01L27/1277 ,  H01L29/66757 ,  H01L29/78618

摘要： Method of fabricating semiconductor devices such as thin-film transistors by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron, cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.

公开(公告)号：US5650338A

公开(公告)日：1997-07-22

申请号：US216277

申请日：1994-03-23

申请人： Shunpei Yamazaki ,  Hongyong Zhang ,  Hideki Uochi ,  Hiroki Adachi ,  Yasuhiko Takemura

发明人： Shunpei Yamazaki ,  Hongyong Zhang ,  Hideki Uochi ,  Hiroki Adachi ,  Yasuhiko Takemura

IPC分类号： H01L21/336 ,  H01L21/84

CPC分类号： H01L27/1214 ,  H01L29/66757

摘要： In film forming of thin film semiconductors (TFTs), a gate electrode having an anodic-oxidizable material is formed on a substrate, and the surface of the gate electrode is oxidized by anodic oxidation in an electrolytic solution so that the surface of the gate electrode is coated with an insulating film. The doping is performed using the gate electrode and the anodic oxide film as a mask, to form a source and a drain region. Then, when the laminate is again dipped in an electrolytic solution, and a voltage is applied to the gate electrode so that a current curing produces in the laminate. During the current curing, a positive voltage is preferably applied to the gate electrode for N-channel TFTs and a negative voltage is preferably to the gate electrode for P-channel TFTs. After the doping, the source and the drain region is activated by laser annealing or the like, prior to the current curing.

摘要翻译： 在薄膜半导体（TFT）的成膜中，在基板上形成具有阳极氧化材料的栅电极，并且通过电解液中的阳极氧化使栅电极的表面氧化，使得栅电极的表面 涂有绝缘膜。 使用栅电极和阳极氧化膜作为掩模进行掺杂，以形成源区和漏区。 然后，当层叠体再次浸渍在电解液中时，向栅电极施加电压，使得层压体产生电流固化。 在电流固化期间，优选对N沟道TFT的栅电极施加正电压，对P沟道TFT优选施加负电压。 在掺杂之后，在目前的固化之前，源极和漏极区域被激光退火等激活。

公开(公告)号：US06451638B1

公开(公告)日：2002-09-17

申请号：US09640078

申请日：2000-08-17

申请人： Hongyong Zhang ,  Hideki Uochi ,  Toru Takayama ,  Shunpei Yamazaki ,  Yasuhiko Takemura

发明人： Hongyong Zhang ,  Hideki Uochi ,  Toru Takayama ,  Shunpei Yamazaki ,  Yasuhiko Takemura

IPC分类号： H01L2184

CPC分类号： H01L21/02672 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/1281 ,  H01L29/66757

摘要： A process for fabricating a semiconductor by crystallizing a silicon film in a substantially amorphous state by annealing it at a temperature not higher than the crystallization temperature of amorphous silicon, and it comprises forming selectively, on the surface or under an amorphous silicon film, a coating, particles, clusters, and the like containing nickel, iron, cobalt, platinum or palladium either as a pure metal or a compound thereof such as a silicide, a salt, and the like, shaped into island-like portions, linear portions, stripes, or dots; and then annealing the resulting structure at a temperature lower than the crystallization temperature of an amorphous silicon by 20 to 150° C.

摘要翻译： 一种通过在不高于非晶硅的结晶温度的温度下进行退火将基本无定形态的硅膜结晶化的半导体制造方法，其包括在表面上或非晶硅膜下选择性地形成涂层 ，含有镍，铁，钴，铂或钯的颗粒，簇等作为纯金属或其化合物，例如硅化物，盐等，成形为岛状部分，线状部分，条纹 ，或点; 然后在低于非晶硅的结晶温度的温度下将所得结构退火20〜150℃。

公开(公告)号：US6084247A

公开(公告)日：2000-07-04

申请号：US769114

申请日：1996-12-18

申请人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

发明人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

IPC分类号： H01L29/78 ,  H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/786 ,  H01L29/76 ,  H01L31/036

CPC分类号： H01L29/78696 ,  H01L21/2022 ,  H01L21/2026 ,  H01L27/1277 ,  H01L29/66757 ,  H01L29/78618

摘要： Semiconductor devices such as thin-film transistors formed by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron, cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.

摘要翻译： 半导体器件如薄膜晶体管，其通过在低于非晶硅的正常结晶温度或低于衬底的玻璃化转变温度的温度下退火基本非晶硅膜而形成，以使硅膜结晶。 镍，铁，钴或铂的岛，条纹，线或点，镍，铁，钴或铂的硅化物，乙酸盐或硝酸盐，含有各种盐，包含至少一种镍， 铁，钴和铂用作结晶的起始原料。 这些材料形成在非晶硅膜上或下方。

公开(公告)号：US5899709A

公开(公告)日：1999-05-04

申请号：US627083

申请日：1996-04-03

申请人： Shunpei Yamazaki ,  Hongyong Zhang ,  Hideki Uochi ,  Hiroki Adachi ,  Yasuhiko Takemura

发明人： Shunpei Yamazaki ,  Hongyong Zhang ,  Hideki Uochi ,  Hiroki Adachi ,  Yasuhiko Takemura

IPC分类号： H01L21/321 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/49 ,  H01L21/28 ,  H01L21/283

CPC分类号： H01L27/1214 ,  H01L21/32105 ,  H01L29/4908 ,  H01L29/66757 ,  H01L29/66765

摘要： An improved method for manufacturing an insulated gate field effect transistor is described. The method comprises the steps of forming a semiconductor film on an insulating substrate, forming a gate insulating film on said semiconductor film, forming a gate electrode on said gate insulating film with said gate insulating film inbetween, anoding said gate electrode in order to coat an external surface of said gate electrode with an oxide film thereof and applying a negative or positive voltage to said gate electrode with respect to said semiconductor film. Lattice defects and interfacial states caused by the application of a positive voltage during the anoding are effectively eliminated by the negative voltage application.

摘要翻译： 描述了用于制造绝缘栅场效应晶体管的改进方法。 该方法包括以下步骤：在绝缘基板上形成半导体膜，在所述半导体膜上形成栅极绝缘膜，在所述栅极绝缘膜上形成栅电极，在其间具有栅极绝缘膜，对所述栅极电极进行涂覆 所述栅电极的外表面具有氧化膜，并相对于所述半导体膜向所述栅电极施加负电压或正电压。 通过施加负电压，能够有效地消除由于在安装期间施加正电压引起的晶格缺陷和界面状态。

公开(公告)号：US5897347A

公开(公告)日：1999-04-27

申请号：US718895

申请日：1996-09-24

申请人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

发明人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

IPC分类号： H01L29/78 ,  H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/786 ,  H01L21/00 ,  H01L21/322

CPC分类号： H01L29/78696 ,  H01L21/2022 ,  H01L21/2026 ,  H01L27/1277 ,  H01L29/66757 ,  H01L29/78618

摘要： Method of fabricating semiconductor devices such as thin-film transistors by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.

摘要翻译： 通过在低于非晶硅的正常结晶温度或低于基板的玻璃化转变点的温度下退火基本非晶硅膜以使硅膜结晶的方法来制造诸如薄膜晶体管的半导体器件。 镍，铁，钴，铂，镍，铁，钴或铂的镍，铁钴或铂，硅化物，乙酸盐或硝酸盐的岛，条纹，线或点，含有各种盐，含有镍，铁， ，钴和铂用作结晶的起始材料。 这些材料形成在非晶硅膜上或下方。

公开(公告)号：US5879977A

公开(公告)日：1999-03-09

申请号：US636819

申请日：1996-04-23

申请人： Hongyong Zhang ,  Hideki Uochi ,  Toru Takayama ,  Shunpei Yamazaki ,  Yasuhiko Takemura

发明人： Hongyong Zhang ,  Hideki Uochi ,  Toru Takayama ,  Shunpei Yamazaki ,  Yasuhiko Takemura

IPC分类号： H01L21/20 ,  H01L21/00 ,  H01L21/324 ,  H01L21/336 ,  H01L27/12 ,  H01L29/02 ,  H01L29/78 ,  H01L29/786 ,  H01L21/10

CPC分类号： H01L21/2022 ,  H01L27/1281 ,  H01L29/66757

摘要： A process for fabricating a semiconductor by crystallizing a silicon film in a substantially amorphous state by annealing it at a temperature not higher than the crystallization temperature of amorphous silicon, and it comprises forming selectively, on the surface or under an amorphous silicon film, a coating, particles, clusters, and the like containing nickel, iron, cobalt, platinum or palladium either as a pure metal or a compound thereof such as a silicide, a salt, and the like, shaped into island-like portions, linear portions, stripes, or dots; and then annealing the resulting structure at a temperature lower than the crystallization temperature of an amorphous silicon by 20.degree. to 150.degree. C.

摘要翻译： 一种通过在不高于非晶硅的结晶温度的温度下进行退火将基本无定形态的硅膜结晶化的半导体制造方法，其包括在表面上或非晶硅膜下选择性地形成涂层 ，含有镍，铁，钴，铂或钯的颗粒，簇等作为纯金属或其化合物，例如硅化物，盐等，成形为岛状部分，线状部分，条纹 ，或点; 然后在低于非晶硅的结晶温度的温度下将所得结构退火20〜150℃。

公开(公告)号：US5830786A

公开(公告)日：1998-11-03

申请号：US654030

申请日：1996-05-28

申请人： Hongyong Zhang ,  Hideki Uochi ,  Shunpei Yamazaki ,  Yasuhiko Takemura ,  Minoru Miyazaki ,  Akane Murakami ,  Toshimitsu Konuma ,  Akira Sugawara ,  Yukiko Uehara

发明人： Hongyong Zhang ,  Hideki Uochi ,  Shunpei Yamazaki ,  Yasuhiko Takemura ,  Minoru Miyazaki ,  Akane Murakami ,  Toshimitsu Konuma ,  Akira Sugawara ,  Yukiko Uehara

IPC分类号： H01L21/02 ,  H01L21/28 ,  H01L21/3213 ,  H01L21/336 ,  H01L21/76 ,  H01L29/49 ,  H01L21/3215

CPC分类号： H01L21/02071 ,  H01L21/28079 ,  H01L21/32134 ,  H01L29/4908 ,  H01L29/66757

摘要： A process for fabricating an electronic circuit by oxidizing the surroundings of a metallic interconnection such as of aluminum, tantalum, and titanium, wherein anodic oxidation is effected at a temperature not higher than room temperature, preferably, at 10.degree. C. or lower, and more preferably, at 0.degree. C. or lower. The surface oxidation rate of a metallic interconnection can be maintained constant to provide a surface free of irregularities.

摘要翻译： 通过氧化诸如铝，钽和钛的金属互连的周围来制造电子电路的方法，其中阳极氧化在不高于室温，优选在10℃或更低的温度下进行，以及 更优选在0℃以下。 金属互连的表面氧化速率可以保持恒定，以提供没有凹凸的表面。

公开(公告)号：US5639698A

公开(公告)日：1997-06-17

申请号：US196856

申请日：1994-02-15

申请人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

发明人： Shunpei Yamazaki ,  Yasuhiko Takemura ,  Hongyong Zhang ,  Toru Takayama ,  Hideki Uochi

IPC分类号： H01L29/78 ,  H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/786

CPC分类号： H01L29/78696 ,  H01L21/2022 ,  H01L21/2026 ,  H01L27/1277 ,  H01L29/66757 ,  H01L29/78618

摘要： Method of fabricating semiconductor devices such as thin-film transistors by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron, cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.

摘要翻译： 通过在低于非晶硅的正常结晶温度或低于基板的玻璃化转变点的温度下退火基本非晶硅膜以使硅膜结晶的方法来制造诸如薄膜晶体管的半导体器件。 镍，铁，钴或铂的岛，条纹，线或点，镍，铁，钴或铂的硅化物，乙酸盐或硝酸盐，含有各种盐，包含至少一种镍， 铁，钴和铂用作结晶的起始原料。 这些材料形成在非晶硅膜上或下方。