Semiconductor and process for fabricating the same
    5.
    发明授权
    Semiconductor and process for fabricating the same 有权
    半导体及其制造方法

    公开(公告)号:US6110770A

    公开(公告)日:2000-08-29

    申请号:US229306

    申请日:1999-01-13

    摘要: A process for fabricating a semiconductor by crystallizing a silicon film in a substantially amorphous state by annealing it at a temperature not higher than the crystallization temperature of amorphous silicon, and it comprises forming selectively, on the surface or under an amorphous silicon film, a coating, particles, clusters, and the like containing nickel, iron, cobalt, platinum or palladium either as a pure metal or a compound thereof such as a silicide, a salt, and the like, shaped into island-like portions, linear portions, stripes, or dots; and then annealing the resulting structure at a temperature lower than the crystallization temperature of an amorphous silicon by 20 to 150.degree. C.

    摘要翻译: 一种通过在不高于非晶硅的结晶温度的温度下进行退火将基本无定形态的硅膜结晶化的半导体制造方法,其包括在表面上或非晶硅膜下选择性地形成涂层 ,含有镍,铁,钴,铂或钯的颗粒,簇等作为纯金属或其化合物,例如硅化物,盐等,成形为岛状部分,线状部分,条纹 ,或点; 然后在低于非晶硅的结晶温度的温度下将所得结构退火20〜150℃。

    Method for forming thin film transistor
    7.
    发明授权
    Method for forming thin film transistor 失效
    薄膜晶体管的形成方法

    公开(公告)号:US5650338A

    公开(公告)日:1997-07-22

    申请号:US216277

    申请日:1994-03-23

    IPC分类号: H01L21/336 H01L21/84

    CPC分类号: H01L27/1214 H01L29/66757

    摘要: In film forming of thin film semiconductors (TFTs), a gate electrode having an anodic-oxidizable material is formed on a substrate, and the surface of the gate electrode is oxidized by anodic oxidation in an electrolytic solution so that the surface of the gate electrode is coated with an insulating film. The doping is performed using the gate electrode and the anodic oxide film as a mask, to form a source and a drain region. Then, when the laminate is again dipped in an electrolytic solution, and a voltage is applied to the gate electrode so that a current curing produces in the laminate. During the current curing, a positive voltage is preferably applied to the gate electrode for N-channel TFTs and a negative voltage is preferably to the gate electrode for P-channel TFTs. After the doping, the source and the drain region is activated by laser annealing or the like, prior to the current curing.

    摘要翻译: 在薄膜半导体(TFT)的成膜中,在基板上形成具有阳极氧化材料的栅电极,并且通过电解液中的阳极氧化使栅电极的表面氧化,使得栅电极的表面 涂有绝缘膜。 使用栅电极和阳极氧化膜作为掩模进行掺杂,以形成源区和漏区。 然后,当层叠体再次浸渍在电解液中时,向栅电极施加电压,使得层压体产生电流固化。 在电流固化期间,优选对N沟道TFT的栅电极施加正电压,对P沟道TFT优选施加负电压。 在掺杂之后,在目前的固化之前,源极和漏极区域被激光退火等激活。