公开(公告)号：US06446102B1

公开(公告)日：2002-09-03

申请号：US09316892

申请日：1999-05-21

Applicant: David L. Kryger ,  Steven Webster

Inventor： David L. Kryger ,  Steven Webster

IPC: G06F501

CPC classification number: G06F17/17 ,  G06F7/52 ,  G06F7/544

Abstract: A method and a device for high-speed scale conversion wherein a value N within a range of N1 and N2 is converted into a small value M within a range of M1 and M2. The method includes the step of obtaining an approximate value of M by loading the value (N−N1+2p−1) into a multi-bit shift register and right-shifting p bits. A binary search process is then used to determine the error value between the actual value of M and the approximate value of M. By avoiding actual multiplication processes, the conversion can be carried out using low-cost electronic hardware such as a microprocessor or a PROM to carry out the binary search process, a shift-register to obtain the approximate value of M, a multiplexer to receive an analog input data N and an A/D converter to convert the analog input data N into a digital data N.

Abstract translation: 一种用于高速度转换的方法和装置，其中在N1和N2的范围内的值N在M1和M2的范围内被转换成小的值M. 该方法包括通过将值（N-N1 + 2p-1）加载到多位移位寄存器和右移p位中来获得近似值M的步骤。 然后使用二进制搜索处理来确定M的实际值和M的近似值之间的误差值。通过避免实际的乘法处理，可以使用诸如微处理器或PROM的低成本电子硬件来执行转换 执行二进制搜索处理，移位寄存器以获得近似值M，用于接收模拟输入数据N的多路复用器和用于将模拟输入数据N转换成数字数据N的A / D转换器。

公开(公告)号：US06396043B1

公开(公告)日：2002-05-28

申请号：US09448538

申请日：1999-11-22

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H01L24/97 ,  H01L27/14601 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/81

Abstract: A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

Abstract translation: 薄图像传感器封装包括具有响应于辐射的有效区域的图像传感器。 图像传感器安装在对辐射透明的基板上。 图像传感器被安装成使得图像传感器的有效区域面向基板。 重要的是，衬底具有双重功能。 特别地，衬底是覆盖图像传感器的有效区域的窗口。 此外，基板是制造图像传感器封装的平台。 因此，图像传感器封装薄，重量轻且制造成本低廉。

公开(公告)号：US08994860B2

公开(公告)日：2015-03-31

申请号：US13350619

申请日：2012-01-13

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H04N5/335 ,  H04N5/225 ,  G02B7/02 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L23/00

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。

公开(公告)号：US08988564B2

公开(公告)日：2015-03-24

申请号：US13229363

申请日：2011-09-09

Applicant: Steven Webster ,  Ning Y. Chan

Inventor： Steven Webster ,  Ning Y. Chan

IPC: H04N9/09 ,  G02B27/14 ,  H04N5/225 ,  G02B27/10 ,  G03B33/12 ,  G02B15/177 ,  G03B17/17 ,  H04N5/232 ,  G02B13/00

CPC classification number: G02B27/1013 ,  G02B13/009 ,  G02B15/177 ,  G02B27/149 ,  G02B27/646 ,  G03B17/17 ,  G03B33/12 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H04N5/23248 ,  H04N5/23296 ,  H04N2209/049

Abstract: A digital camera component is described that has a light splitter cube having an entrance face to receive incident light from a camera scene. The cube splits the incident light into first, second, and third color components that emerge from the cube through a first face, a second face, and a third face of the cube, respectively. First, second, and third image sensors are provided, each being positioned to receive a respective one of the color components that emerge from the first, second, and third faces of the cube. Other embodiments are also described and claimed.

Abstract translation: 描述了一种数字照相机部件，其具有具有入射面的分光立方体，以接收来自相机场景的入射光。 立方体将入射光分解成从立方体通过第一面，第二面和立方体的第三面分别出现的第一，第二和第三颜色分量。 提供第一，第二和第三图像传感器，每个传感器被定位成接收从立方体的第一，第二和第三面出现的相应的一个颜色分量。 还描述和要求保护其他实施例。

公开(公告)号：US08661346B2

公开(公告)日：2014-02-25

申请号：US13277024

申请日：2011-10-19

Applicant: Steven J. Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

Inventor： Steven J. Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

IPC: G06F3/00

CPC classification number: G06F9/451

Abstract: A method is disclosed for instructing a user interface (UI) in communication with a first of vision processor (VP) to establish communication with a second (VP). The invention is useful in a machine vision system having a plurality of VPs and at least one UI. The method includes the steps of providing each VP with a link function for establishing communication between a VP and a UI; and activating the link function so as to issue instructions to the UI to establish communication with another VP. The link function enables local dynamic display of a remote VP on the UI, and a dynamic connection that provides a continually updated display representing a current state of the VP connected to the UI. An operator may observe results and alter parameters on any of the VPs in the system without having to first understand the architecture of the machine vision system.

Abstract translation: 公开了一种用于指示与第一视觉处理器（VP）通信的用户界面（UI）与第二（VP）建立通信的方法。 本发明在具有多个VP和至少一个UI的机器视觉系统中是有用的。 该方法包括以下步骤：为每个VP提供用于建立VP与UI之间的通信的链接功能; 并激活链接功能，以向UI发出指令以建立与另一个VP的通信。 链接功能使得UI上的远程VP的本地动态显示以及提供连续更新的显示的动态连接表示连接到UI的VP的当前状态。 操作员可以观察系统中任何VP的结果并更改参数，而无需首先了解机器视觉系统的架构。

公开(公告)号：US08605211B2

公开(公告)日：2013-12-10

申请号：US13096659

申请日：2011-04-28

Applicant: Steven Webster ,  Thomas B. Templeton

Inventor： Steven Webster ,  Thomas B. Templeton

IPC: H04N5/225

CPC classification number: H05K1/021 ,  H01L2224/48091 ,  H04M1/0264 ,  H04N5/2257 ,  H05K2201/10121 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A printed circuit carrier has an opening therein against which a back plate is attached to thereby form a cavity. An image sensor device is attached to the back plate inside the cavity. The height of the image sensor device is about equal to or less than the height of the cavity. Electrical signal connections are formed between the image sensor device and the printed circuit carrier. A cap is attached directly to the carrier by a flowable adhesive layer, to seal off the cavity. Other embodiments are also described and claimed.

Abstract translation: 印刷电路载体具有开口，背板附接到开口，从而形成空腔。 图像传感器装置安装在腔内的背板上。 图像传感器装置的高度大约等于或小于空腔的高度。 在图像传感器装置和印刷电路载体之间形成电信号连接。 帽通过可流动的粘合剂层直接附接到载体上，以密封空腔。 还描述和要求保护其他实施例。

公开(公告)号：US07538862B2

公开(公告)日：2009-05-26

申请号：US11592768

申请日：2006-11-03

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

IPC: G01N21/00

CPC classification number: H04N17/002

Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.

Abstract translation: 一种用于数字照相机模块（100）的测试系统（200）包括第一测试模块（50），组装机构（60），聚焦模块（62），第二测试模块（70） ，以及主处理器（90）。 携带机构在第一测试模块，组装机构，聚焦模块和第二测试模块之间支撑和传送数字照相机模块和数字照相机模块的子组件。 第一测试模块，组装机构，聚焦模块，承载机构和第二测试模块都与主处理器电连接。

公开(公告)号：US20080203512A1

公开(公告)日：2008-08-28

申请号：US12151369

申请日：2008-05-06

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L31/0203

CPC classification number: H04N5/2253 ,  G02B7/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A chip package includes a carrier (32), an image sensor chip (34), a plurality of wires (36), an adhesive means (3262) and a transparent cover (38). The carrier has a cavity (321) therein. The image sensor chip is received in the cavity, and the image sensor has a photosensitive area (344). Each wire electronically connects the image sensor chip and the carrier. The adhesive means is applied to the image sensor chip around the photosensitive area and covers at least one portion of all the wires adjacent to the photosensitive area. The adhesive means surrounds an enclosing body (3264) around the photosensitive area. The transparent cover is mounted to the carrier, and the cover is adhered to the carrier with the adhesive means. The cover with the enclosing body defines a sealing space (37) for enclosing the photosensitive area of the image sensor chip therein.

Abstract translation: 芯片封装包括载体（32），图像传感器芯片（34），多个导线（36），粘合装置（3262）和透明盖（38）。 载体在其中具有空腔（321）。 图像传感器芯片被接收在空腔中，并且图像传感器具有感光区域（344）。 每条线电子连接图像传感器芯片和载体。 粘合装置被施加到感光区周围的图像传感器芯片上，并且覆盖与感光区域相邻的所有导线的至少一部分。 粘合剂包围围绕光敏区域的封闭体（3264）。 透明盖安装在托架上，盖子用粘合剂粘合到托架上。 具有封闭体的盖限定用于将图像传感器芯片的感光区域包围在其中的密封空间（37）。

公开(公告)号：US07342215B2

公开(公告)日：2008-03-11

申请号：US11453454

申请日：2006-06-14

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H01L27/00 ,  H01J5/02

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

Abstract translation: 数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。 第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。 最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

公开(公告)号：US20070126915A1

公开(公告)日：2007-06-07

申请号：US11595297

申请日：2006-11-10

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254

Abstract: An image sensor chip package method includes the following steps: firstly, a plurality of shaped conductors are provided. Secondly, plastics are injected to partially enclose the conductors, thereby forming a base. Some of the conductors are exposed outside of the base. Thirdly, a ring-like middle portion is further formed on the base by means of injection. The base and the middle portion cooperatively form a space. Fourthly, an image sensor having a plurality of pads is disposed in the space. Fifthly, a number of bonding wires are provided to connect the pads and the conductors. Finally, a cover is secured to the top of the middle portion via an adhesive glue, thereby hermetically sealing the space and allowing light beams to pass therethrough.

Abstract translation: 图像传感器芯片封装方法包括以下步骤：首先，多个形导体。 其次，注射塑料以部分地包封导体，从而形成基底。 一些导体暴露在基部外部。 第三，通过注射在基座上进一步形成环状中间部分。 底座和中间部分协同地形成一个空间。 第四，具有多个焊盘的图像传感器设置在该空间中。 第五，提供多个接合线来连接焊盘和导体。 最后，通过胶粘剂将盖固定到中间部分的顶部，从而气密地密封空间并允许光束通过。