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    HIGH-FREQUENCY CIRCUIT MODULE
    21.
    发明申请
    HIGH-FREQUENCY CIRCUIT MODULE 审中-公开
    高频电路模块

    公开(公告)号：US20140056183A1

    公开(公告)日：2014-02-27

    申请号：US13963775

    申请日：2013-08-09

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Hiroshi Nakamura ,  Tomohiro Igarashi

    IPC: H04L5/14

    CPC classification number: H04L5/1461 ,  H01L23/3735 ,  H01L2224/16225 ,  H03H7/463 ,  H03H9/0547 ,  H03H9/08 ,  H04B1/0057 ,  H05K1/0207 ,  H05K1/0216 ,  H05K1/0237

    Abstract: Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC.

    Abstract translation: 提供了具有高安装密度的高频电路模块。 在高频电路模块中，执行高频信号的发送和接收处理的RFIC，放大来自RFIC的发送信号的功率放大器IC以及将从功率放大器IC输出的发送信号分离成的双工器 从天线向RFIC输入的天线和接收信号形成在其顶表面上。 双工器设置在RFIC和功率放大器IC之间。

    Multilayer circuit substrate
    22.
    发明授权
    Multilayer circuit substrate 有权
    多层电路基板

    公开(公告)号：US09526165B2

    公开(公告)日：2016-12-20

    申请号：US14072648

    申请日：2013-11-05

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Tetsuo Saji ,  Hiroshi Nakamura

    IPC: H01P3/08 ,  H05K1/02

    CPC classification number: H05K1/025 ,  H05K1/0298

    Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area.

    Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层经由绝缘层面对所述第一导电层。 第一信号线在多层电路基板的俯视图中与第二信号线相交，第一和第二信号线的交叉区域中的第一接地导体与第一信号线的间隔比第 非交叉区域，并且第二接地导体和第二信号线之间的空间在交叉区域中比在非交叉区域中的空间小。

    Substrate with built-in component
    23.
    发明授权
    Substrate with built-in component 有权
    基板与内置组件

    公开(公告)号：US09101075B2

    公开(公告)日：2015-08-04

    申请号：US14101026

    申请日：2013-12-09

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Masaki Naganuma ,  Kazuaki Ida ,  Tatsuro Sawatari ,  Hiroshi Nakamura

    IPC: H05K1/18

    CPC classification number: H05K1/186 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/15151 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/09063 ,  H05K2201/09427 ,  H05K2201/09854 ,  H01L2924/00

    Abstract: There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction.

    Abstract translation: 提供了具有内置部件的基板，包括具有用于存储部件的空腔的金属芯层; 层叠在所述芯层上并具有多个用于层间连接的通孔的布线层，所述通孔形成在与所述空腔相对的区域处; 以及电子部件，包括电连接到所述多个通孔的多个端子，以及存储在所述空腔中并具有用于支撑所述多个端子的支撑表面的部件主体，所述多个端子偏离所述多个端子的中心 所述支撑表面朝向第一方向，并且所述部件主体从所述腔的中心偏心地设置到与所述第一方向相反的第二方向。

    Circuit module
    25.
    发明授权
    Circuit module 有权
    电路模块

    公开(公告)号：US09065539B2

    公开(公告)日：2015-06-23

    申请号：US14275788

    申请日：2014-05-12

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Tetsuo Saji ,  Hiroshi Nakamura

    IPC: H04M1/00 ,  H04B1/40 ,  H04W88/10

    CPC classification number: H04B1/40 ,  H04B1/3805 ,  H04B1/525 ,  H04W88/10

    Abstract: A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate.

    Abstract translation: 电路模块包括：具有用于处理与移动电话通信有关的高频信号的收发器电路的RFIC和用于处理与作为卫星定位系统的GPS相关的接收信号的接收电路; GPS前端部件; 和手机前端组件。 移动电话前端部件安装在电路基板的一个主表面上，并且至少一个GPS前端部件（第二带通滤波器）嵌入在电路基板中。

    Circuit module
    26.
    发明授权
    Circuit module 有权
    电路模块

    公开(公告)号：US08897019B1

    公开(公告)日：2014-11-25

    申请号：US14103620

    申请日：2013-12-11

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Masaya Shimamura ,  Kenzo Kitazaki ,  Eiji Mugiya ,  Tetsuo Saji ,  Atsushi Tsunoda ,  Hiroshi Nakamura

    IPC: H05K7/00 ,  H05K9/00

    CPC classification number: H01L24/97 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K9/003 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00

    Abstract: There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.

    Abstract translation: 提供了一种电路模块，包括：包括安装表面的电路基板; 安装在安装表面上的安装部件; 形成在安装面上的密封体覆盖安装部件，并且包括由密封体的主表面朝向安装面形成的沟槽，该沟槽包括沿平行方向延伸的第一沟槽部分和 相对于与主表面平行的方向的正交方向和与第一沟槽部分连接的第二沟槽部分平行于主表面，并且在不平行或不垂直于第一沟槽部分的方向上延伸; 以及覆盖所述密封体并且包括形成在所述沟槽内的内屏蔽部和设置在所述主表面和所述内屏蔽部上的外屏蔽部的屏蔽。

    High-frequency circuit module
    28.
    发明授权
    High-frequency circuit module 有权

    公开(公告)号：US08725086B2

    公开(公告)日：2014-05-13

    申请号：US14056758

    申请日：2013-10-17

    Applicant: Taiyo Yuden Co., LTD

    Inventor： Tetsuo Saji ,  Hiroshi Nakamura

    IPC: H04B1/44

    CPC classification number: H04B1/40 ,  H04B1/006 ,  H04B1/525 ,  H04B15/00

    Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.

    HIGH-FREQUENCY CIRCUIT MODULE
    30.
    发明申请
    HIGH-FREQUENCY CIRCUIT MODULE 有权

    公开(公告)号：US20140051371A1

    公开(公告)日：2014-02-20

    申请号：US14058035

    申请日：2013-10-18

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Tetsuo Saji ,  Hiroshi Nakamura

    IPC: H04B15/00

    CPC classification number: H04B1/40 ,  H04B1/006 ,  H04B1/525 ,  H04B15/00

    Abstract: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.

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