公开(公告)号：US07638904B2

公开(公告)日：2009-12-29

申请号：US11206226

申请日：2005-08-18

申请人： Hiroyuki Shoji ,  Akihiko Kanouda ,  Ryuichi Saito ,  Seigou Yukutake ,  Katsuhiro Higuchi

发明人： Hiroyuki Shoji ,  Akihiko Kanouda ,  Ryuichi Saito ,  Seigou Yukutake ,  Katsuhiro Higuchi

IPC分类号： G01R1/20

CPC分类号： H02M1/34 ,  H02M3/33584 ,  H02M2001/342 ,  Y02B70/1491

摘要： The DC-DC converter connects a first and a second switching circuit for converting power mutually between direct current and alternating current respectively to a first DC power source and a second DC power source and has a transformer between the AC terminals thereof. Here, between the AC terminals of the second switching circuit and the negative pole terminal of the DC power source, a voltage clamp circuit composed of a series unit of switching devices with a reverse parallel diode and a clamp condenser is connected.An isolated bidirectional DC-DC converter which prevents a reduction in a circulating current at time of buck and an occurrence of a surge voltage at time of voltage boost and realizes highly efficiency, low noise, and miniaturization is provided.

摘要翻译： DC-DC转换器将用于将直流和交流之间的功率相互转换的第一和第二开关电路分别连接到第一直流电源和第二直流电源，并且在其AC端子之间具有变压器。 这里，在第二开关电路的交流端子和直流电源的负极端子之间，连接由串联的具有反向并联二极管的开关器件和钳位电容器组成的电压钳位电路。 提供一种隔离的双向DC-DC转换器，其防止降压时的循环电流的降低和在升压时的浪涌电压的发生，并且实现高效率，低噪声和小型化。

公开(公告)号：US07551462B2

公开(公告)日：2009-06-23

申请号：US11348348

申请日：2006-02-07

申请人： Junpei Uruno ,  Hiroyuki Shoji ,  Akihiko Kanouda ,  Yasuo Kaminaga

发明人： Junpei Uruno ,  Hiroyuki Shoji ,  Akihiko Kanouda ,  Yasuo Kaminaga

IPC分类号： H02M5/42 ,  H02M7/04 ,  H02M7/68

CPC分类号： H02M3/158 ,  H02M2001/342 ,  Y02B70/1425 ,  Y02B70/1491

摘要： A soft switching DC-DC converter is provided which includes circuitry for both a buck converter and a boost converter. The buck converter circuitry and the boost converter circuitry share a common transformer including a primary coil and first and second secondary coils. A first switching element is coupled to a first capacitor to provide the buck converter operation while another switching element is provided to provide the boost converting operation. The primary coil of the transformer is commonly used as a choke coil by both the buck converter and the boost converter. In this way, size and cost reduction can be obtained.

摘要翻译： 提供了一种软开关DC-DC转换器，其包括用于降压转换器和升压转换器的电路。 降压转换器电路和升压转换器电路共享共同的变压器，其包括初级线圈和第一和第二次级线圈。 第一开关元件耦合到第一电容器以提供降压转换器操作，同时提供另一开关元件以提供升压转换操作。 变压器的初级线圈通常由降压转换器和升压转换器用作扼流线圈。 以这种方式，可以获得尺寸和成本降低。

公开(公告)号：US07410305B2

公开(公告)日：2008-08-12

申请号：US11230822

申请日：2005-09-21

申请人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： G02B6/36

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  H01L33/56 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01049

摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.).

摘要翻译： 光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。 透光树脂含有基础树脂和填料。 透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性。

公开(公告)号：US07358535B2

公开(公告)日：2008-04-15

申请号：US10747403

申请日：2003-12-30

申请人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L21/00

CPC分类号： H01L25/167 ,  H01L31/16 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.

摘要翻译： 光耦合器半导体器件包括分别安装在第一和第二引线框架的远端部分的上表面上的主要部分和远端部分的第一和第二平面引线框架，发光元件和光接收元件， 覆盖发光元件和受光元件的透光树脂构件，并且以与发光元件和受光元件隔开的相对关系的方式支撑第一引线框架和第二引线框架的远端部分，其安装在 所述远端部分使得所述第一引线框架和所述第二引线框架的主要部分位于共面关系处，以及不透明树脂构件，其覆盖所述透光树脂构件，并且支撑所述第一引线框架和所述第二引线框架的主要部分。 透光树脂构件和不透明树脂构件各自由作为基础树脂的环氧树脂构成。

公开(公告)号：US07004325B2

公开(公告)日：2006-02-28

申请号：US10144313

申请日：2002-05-07

申请人： Hiroyuki Shoji

发明人： Hiroyuki Shoji

IPC分类号： B65D85/30

CPC分类号： H01L23/10 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/30107 ,  Y10S206/832 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

公开(公告)号：US20050253227A1

公开(公告)日：2005-11-17

申请号：US11186794

申请日：2005-07-22

申请人： Hiroyuki Shoji

发明人： Hiroyuki Shoji

IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L23/08 ,  H01L23/10 ,  H01L23/498 ,  H01L23/34

CPC分类号： H01L23/10 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/30107 ,  Y10S206/832 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

摘要翻译： 包装包括：具有脊状周边部分和由脊状周边部分限定的中心部分的基底。 半导体芯片安装在中心部分上。 多个引线电耦合到半导体芯片并从中心部分向外穿透基板。 封装还包括限定容纳半导体芯片的空腔的盖。 盖具有与脊状周边部的基板接合面接合的盖接合面。 盖接合面和基板接合面的水平高于中央部。

公开(公告)号：US20050237039A1

公开(公告)日：2005-10-27

申请号：US10524087

申请日：2003-08-08

申请人： Mutsumi Kikuchi ,  Noboru Akiyama ,  Hiroyuki Shoji ,  Fumio Murabayashi ,  Akihiko Kanouda ,  Takashi Sase ,  Koji Tateno

发明人： Mutsumi Kikuchi ,  Noboru Akiyama ,  Hiroyuki Shoji ,  Fumio Murabayashi ,  Akihiko Kanouda ,  Takashi Sase ,  Koji Tateno

IPC分类号： G05F1/40 ,  G11C5/14 ,  H01L27/06 ,  H01L27/08 ,  H02M3/156

CPC分类号： G11C5/147 ,  H01L27/0688 ,  H01L27/08 ,  H02M3/156 ,  H02M2001/007

摘要： A semiconductor device capable of achieving downsizing without reducing the power supply efficiency and capable of reducing switching noises and a memory card using the same are disclosed. The device comprises a plurality of stages of voltage booster circuits for potentially raising a power supply voltage up to a final output voltage, a voltage control unit for controlling an output voltage at a nearby location of the final stage, and one or more internal elements to which the final output voltage is supplied. A primary voltage booster circuit at the first stage includes an inductance element, a switching element, a diode and a driver circuit. At a metal core part of the inductance element, a metal wiring line is used, which was formed by use of a fabrication process of semiconductor integrated circuits, while employing for its core part an inter-wiring layer dielectric film that was formed using the fabrication process. In addition, the switching element and the diode are arranged so that portions thereof are disposed beneath the inductance element.

摘要翻译： 公开了能够实现小型化而不降低电源效率并且能够降低开关噪声的半导体器件和使用其的存储卡。 该装置包括用于潜在地提高最终输出电压的电源电压的多级升压电路，用于控制最后级的附近位置处的输出电压的电压控制单元和一个或多个内部元件 其提供最终输出电压。 第一级的初级升压电路包括电感元件，开关元件，二极管和驱动器电路。 在电感元件的金属芯部分，使用通过使用半导体集成电路的制造工艺形成的金属布线，同时使用其核心部分使用该制造形成的布线层电介质膜 处理。 此外，开关元件和二极管被布置成使得其部分设置在电感元件下方。

公开(公告)号：US08605464B2

公开(公告)日：2013-12-10

申请号：US13591264

申请日：2012-08-22

申请人： Takashi Sase ,  Akihiko Kanouda ,  Yosuke Tsuyuki ,  Hiroyuki Shoji

发明人： Takashi Sase ,  Akihiko Kanouda ,  Yosuke Tsuyuki ,  Hiroyuki Shoji

IPC分类号： H02M3/335

CPC分类号： H02M1/4258 ,  H02M2001/0064 ,  Y02B70/126

摘要： A power converter includes a first inductor, a rectifier arm, a first switch arm including a first and second switch circuits, a second switch arm including a third switch circuit and a first capacitor, a LC serial circuit, a Transformer, a rectification and smoothing circuit connected to secondary winding of the transformer, and a control circuit to perform on-off control of the three switch circuits. The rectifier arm, the first and second switch arms and the LC serial circuit are connected in parallel with each other. The LC serial circuit and primary winding of the transformer are connected. AC power supply is connected to the rectifier arm via the first inductor. The control circuit includes an output voltage control circuit to control output voltage at specific setting value, an intermediate voltage control circuit to control intermediate voltage at specific setting value, and a power factor correction control circuit.

摘要翻译： 电力转换器包括第一电感器，整流器臂，包括第一和第二开关电路的第一开关臂，包括第三开关电路和第一电容器的第二开关臂，LC串联电路，变压器，整流和平滑 连接到变压器的次级绕组的电路，以及用于执行三个开关电路的开关控制的控制电路。 整流臂，第一和第二开关臂和LC串联电路彼此并联连接。 变压器的LC串联电路和初级绕组连接。 交流电源通过第一电感连接到整流臂。 控制电路包括用于以特定设定值控制输出电压的输出电压控制电路，以特定设定值控制中间电压的中间电压控制电路和功率因数校正控制电路。

公开(公告)号：US08513823B2

公开(公告)日：2013-08-20

申请号：US13172328

申请日：2011-06-29

申请人： Hiroyuki Shoji

发明人： Hiroyuki Shoji

IPC分类号： H01L23/544 ,  H01L21/78

CPC分类号： H01L21/6836 ,  H01L23/544 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/68368 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2224/131 ,  H01L2924/014

摘要： In a semiconductor package, a stamp is provided on at least one of at least a pair of opposed sides on an outer peripheral portion in contact with an edge of the package, which is a blank space up to now. With this configuration, the amount of stamp can be increased even in a narrow stamp area.

摘要翻译： 在半导体封装中，在外周边部分的至少一对相对侧中的至少一个上，与封装的边缘接触地形成印模，该封边是迄今为止的空白区域。 通过这种结构，即使在狭窄的邮票区域中也可以增加邮票量。

公开(公告)号：US08035754B2

公开(公告)日：2011-10-11

申请号：US11492002

申请日：2006-07-25

申请人： Hiroyuki Shoji ,  Yoshikazu Suga ,  Kouichi Aoto

发明人： Hiroyuki Shoji ,  Yoshikazu Suga ,  Kouichi Aoto

IPC分类号： H04N5/44 ,  H04N5/455

CPC分类号： H04N21/4821 ,  G11B27/105 ,  G11B27/322 ,  H04N5/4401 ,  H04N5/45 ,  H04N5/602 ,  H04N5/781 ,  H04N5/9205 ,  H04N7/0806 ,  H04N21/4147 ,  H04N21/42661 ,  H04N21/4334 ,  H04N21/4383 ,  H04N21/47214 ,  H04N21/4856

摘要： First and second signal processing units are each configured by an IC, so that the circuit space occupying in a receiver apparatus can be reduced. The signal path can be shortened from a BPF section inputting a program signal coming from a broadcasting station to a demodulation section compared with the related art. The transmission loss on the signal path can be thus reduced compared with the related art. The possible route for noise entering from the outside to the first and second signal processing units can be made as short as possible. This enables to reduce the noise entering from the outside, and prevents the signals coming over the signal path from being attenuated by the noise so that the signal reception sensitivity can be increased.

摘要翻译： 第一信号处理单元和第二信号处理单元均由IC配置，从而可以减少占用在接收机装置中的电路空间。 与相关技术相比，信号路径可以从输入来自广播站的节目信号的BPF部分缩短到解调部分。 与现有技术相比，可以减小信号路径上的传输损耗。 可以使从外部进入第一和第二信号处理单元的噪声的可能路线尽可能短。 这使得能够减少从外部进入的噪声，并且防止信号路径上的信号被噪声衰减，从而可以提高信号接收灵敏度。