公开(公告)号：US10067201B2

公开(公告)日：2018-09-04

申请号：US15099561

申请日：2016-04-14

Applicant: Texas Instruments Incorporated

Inventor： Iouri N Mirgorodski ,  Roozbeh Parsa ,  William French ,  Dok Won Lee ,  Ann Gabrys

IPC: G01R33/09 ,  G01R33/00 ,  H05K1/02 ,  H05K3/06

Abstract: A magnetic sensor has a circuit segment with a quadrupole region. The quadrupole region includes a supply line, a first return line and a second return line, all in a conductor layer. The first supply line is laterally adjacent to the supply line on a first side, and the second return line is laterally adjacent to the supply line on a second, opposite side. A space between the supply line and the first return line is free of the conductor layer; similarly, a space between the supply line and the second return line is free of the conductor layer. The first return line and the second return line are electrically coupled to the supply line at a terminus of the circuit segment.

公开(公告)号：US20180128885A1

公开(公告)日：2018-05-10

申请号：US15348966

申请日：2016-11-10

Applicant: Texas Instruments Incorporated

Inventor： Roozbeh Parsa ,  William French

IPC: G01R33/032 ,  G01R33/00 ,  G04F5/14

CPC classification number: G01R33/032 ,  G01R33/0052 ,  G04F5/14

Abstract: A microfabricated sensor includes a first reflector and a second reflector in a sensor cell, separated by a cavity path segment through a sensor cavity in the sensor cell. A signal window is part of the sensor cell. A signal emitter and a signal detector are disposed outside of the sensor cavity. The signal emitter is separated from the first reflector by an emitter path segment which extends through the signal window. The second reflector is separated from the second reflector by a detector path segment which extends through the signal window.

公开(公告)号：US09899794B2

公开(公告)日：2018-02-20

申请号：US14319696

申请日：2014-06-30

Applicant: Texas Instruments Incorporated

Inventor： Will Kiang Wong ,  Roozbeh Parsa ,  William French ,  Noboru Nakanishi

IPC: H01L31/0232 ,  H01S5/022 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/167 ,  H01L31/173 ,  H01S5/183

CPC classification number: H01S5/02276 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/167 ,  H01L31/173 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/16152 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/0683 ,  H01S5/183 ,  H01L2924/00014

Abstract: A optoelectronic package includes an inner package with a dielectric substrate having at least a first dielectric level with a photodetector (PD) die on a die attach area, first routing connecting a first contact to a first external bond pad (FEBP), and second routing connecting a second contact to a second external bond pad (SEBP). An outer package (OP) includes a ceramic substrate including a light source die on a base portion in direct line of sight with the PD including a first electrode and second electrode. A first wire bond connects the FEBP to a first terminal, a second wire bond connects the SEBP to a second terminal, a third wire bond connects the first electrode to a third terminal, and a fourth wire bond connects the second electrode to a fourth terminal.

公开(公告)号：US09543735B2

公开(公告)日：2017-01-10

申请号：US14697768

申请日：2015-04-28

Applicant: Texas Instruments Incorporated

Inventor： Roozbeh Parsa ,  William French

IPC: H01L31/00 ,  G04F5/14 ,  H01S5/022 ,  H01L23/552 ,  H01L25/16 ,  H01L23/00 ,  H01L31/0232 ,  H01L31/109 ,  H01L25/00 ,  G01R33/26 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/024 ,  H01L31/167 ,  H01L31/18 ,  H01S5/183 ,  H01S5/024

CPC classification number: H01S5/02248 ,  G01R33/26 ,  G04F5/14 ,  H01L23/552 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L25/165 ,  H01L25/167 ,  H01L25/50 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/024 ,  H01L31/109 ,  H01L31/167 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02453 ,  H01S5/0683 ,  H01S5/183 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked optoelectronic packaged device includes a plurality of stacked components within a package material having a package body providing side walls and a bottom wall for the package, and a lid which seals a top of the package. The stacked components include a first cavity die having a top surface and a bottom surface including at least one through-channel formed in the bottom surface. A bottom die has a top surface including at least one electrical trace and a light source die thereon. At least one of the through-channels of the first cavity die are aligned to the electrical trace, and the first cavity die is bonded to the bottom die with the electrical trace being within the through-channel and not contacting the first cavity die to provide a vacuum sealing structure. A photodetector (PD) is optically coupled to receive the light originating from the light source.

Abstract translation: 堆叠的光电封装装置包括在封装材料内的多个堆叠部件，其具有提供侧壁的封装主体和用于封装的底壁，以及密封封装顶部的盖。 堆叠的部件包括具有顶表面和底表面的第一腔模，其包括形成在底表面中的至少一个通道。 底模具有包括至少一个电迹线和其上的光源管芯的顶表面。 第一腔模具的至少一个通道与电迹线对准，并且第一腔模具结合到底模具，电迹线在通道内，并且不接触第一腔模，以提供 真空密封结构。 光电检测器（PD）被光耦合以接收源自光源的光。

公开(公告)号：US09293422B1

公开(公告)日：2016-03-22

申请号：US14697792

申请日：2015-04-28

Applicant: Texas Instruments Incorporated

Inventor： Roozbeh Parsa ,  William French

IPC: H01L23/495 ,  H01L21/00 ,  H01L23/552 ,  H01L25/16 ,  H01L23/00 ,  H01L31/0232 ,  H01L31/109

CPC classification number: H01S5/02248 ,  G01R33/26 ,  G04F5/14 ,  H01L23/552 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L25/165 ,  H01L25/167 ,  H01L25/50 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/024 ,  H01L31/109 ,  H01L31/167 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02453 ,  H01S5/0683 ,  H01S5/183 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked optoelectronic packaged device includes a bottom die having a top surface including bottom electrical traces and a light source die coupled to ≧1 bottom electrical traces. A first cavity die is on the bottom die. An optics die is on the first cavity die and a second cavity die on the optics die. A mounting substrate is on the second cavity die including top electrical traces. A photodetector die is optically coupled to receive light from the light source. The bottom and top electrical traces are both positioned substantially symmetrically on sides of a mirror plane so that when conducting equal and opposite currents a first magnetic field emanating from the first side and a second magnetic field emanating from the second side cancel one another to provide a reduction in magnetic flux density by more than 50% at one or more die locations on the optics die.

公开(公告)号：US20200333406A1

公开(公告)日：2020-10-22

申请号：US16918098

申请日：2020-07-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ann Gabrys ,  Nathan Brockie ,  Terry Dyer ,  Roozbeh Parsa ,  William French

IPC: G01R33/032 ,  G04F5/14

Abstract: An integrated microfabricated sensor includes a sensor cell having a cell body, a first window attached to the cell body, and a second window attached to the cell body. The cell body laterally surrounds a cavity, so that both windows are exposed to the cavity. The sensor cell contains a sensor fluid material in the cavity. The cavity has concave profiles at cell body walls, so that the cavity is wider in a central region, approximately midway between the first window and the second window, than at the first surface and at the second surface. The cell body walls of the cell body have acute interior angles at both windows. The cell body is formed using an etch process that removes material from the cell body concurrently at the first surface and the second surface, forming the acute interior angles at both the first surface and the second surface.

公开(公告)号：US10665735B2

公开(公告)日：2020-05-26

申请号：US14703364

申请日：2015-05-04

Applicant: Texas Instruments Incorporated

Inventor： Peter J. Hopper ,  William French ,  Paul Mawson ,  Steven Hunt ,  Roozbeh Parsa ,  Martin Fallon ,  Ann Gabrys ,  Andrei Papou

IPC: G01R33/02 ,  H01L21/58 ,  H01L29/82 ,  H01L31/024 ,  H01L31/00 ,  H01L31/0224 ,  H01L31/103 ,  H01L31/18 ,  G04F5/14 ,  H03L7/26

Abstract: A micro-fabricated atomic clock structure is thermally insulated so that the atomic clock structure can operate with very little power in an environment where the external temperature can drop to −40° C., while at the same time maintaining the temperature required for the proper operation of the VCSEL and the gas within the vapor cell.

公开(公告)号：US10393826B2

公开(公告)日：2019-08-27

申请号：US15348966

申请日：2016-11-10

Applicant: Texas Instruments Incorporated

Inventor： Roozbeh Parsa ,  William French

IPC: G01R33/032 ,  G01R33/00 ,  G04F5/14

Abstract: A microfabricated sensor includes a first reflector and a second reflector in a sensor cell, separated by a cavity path segment through a sensor cavity in the sensor cell. A signal window is part of the sensor cell. A signal emitter and a signal detector are disposed outside of the sensor cavity. The signal emitter is separated from the first reflector by an emitter path segment which extends through the signal window. The second reflector is separated from the second reflector by a detector path segment which extends through the signal window.

公开(公告)号：US20180259596A1

公开(公告)日：2018-09-13

申请号：US15457669

申请日：2017-03-13

Applicant: Texas Instruments Incorporated

Inventor： Ann Gabrys ,  Nathan Brockie ,  Terry Dyer ,  Roozbeh Parsa ,  William French

IPC: G01R33/032 ,  G04F5/14

Abstract: An integrated microfabricated sensor includes a sensor cell having a cell body, a first window attached to the cell body, and a second window attached to the cell body. The cell body laterally surrounds a cavity, so that both windows are exposed to the cavity. The sensor cell contains a sensor fluid material in the cavity. The cavity has concave profiles at cell body walls, so that the cavity is wider in a central region, approximately midway between the first window and the second window, than at the first surface and at the second surface. The cell body walls of the cell body have acute interior angles at both windows. The cell body is formed using an etch process that removes material from the cell body concurrently at the first surface and the second surface, forming the acute interior angles at both the first surface and the second surface.

公开(公告)号：US20170199138A1

公开(公告)日：2017-07-13

申请号：US14993073

申请日：2016-01-11

Applicant: Texas Instruments Incorporated

Inventor： Roozbeh Parsa ,  Nathan Brockie ,  Terry Dyer ,  William French ,  Iouri N. Mirgorodski

IPC: G01N25/02

CPC classification number: G01N25/02 ,  G04F5/14 ,  H03L7/26

Abstract: A sensor cell has a chamber that defines an internal sensor volume for a sensor fluid in a vapor phase. A signal path extends into the internal sensor volume. The sensor cell includes a condensation reservoir for a condensed phase of the sensor fluid, in fluid communication with the internal sensor volume. The signal path is spatially separate from the condensation reservoir. During operation of the sensor cell, some of the sensor fluid may be converted to a vapor phase in the internal sensor volume. During such operation, sensor fluid in the condensed phase is disposed in the condensation reservoir, advantageously out of the signal path, leaving the signal path desirably free of the condensed phase sensor fluid. During periods of non-operation, a significant portion of the sensor fluid may condense from the vapor phase to the condensed phase in the condensation reservoir, advantageously out of the signal path.