公开(公告)号：US20200066768A1

公开(公告)日：2020-02-27

申请号：US16113066

申请日：2018-08-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hung Cheng ,  Shyh-Fann Ting ,  Yen-Ting Chiang ,  Yeur-Luen Tu ,  Min-Ying Tsai

IPC: H01L27/146

Abstract: In some embodiments, a method is provided. The method includes forming a plurality of trenches in a semiconductor substrate, where the trenches extend into the semiconductor substrate from a back-side of the semiconductor substrate. An epitaxial layer comprising a dopant is formed on lower surfaces of the trenches, sidewalls of the trenches, and the back-side of the semiconductor substrate, where the dopant has a first doping type. The dopant is driven into the semiconductor substrate to form a first doped region having the first doping type along the epitaxial layer, where the first doped region separates a second doped region having a second doping type opposite the first doping type from the sidewalls of the trenches and from the back-side of the semiconductor substrate. A dielectric layer is formed over the back-side of the semiconductor substrate, where the dielectric layer fill the trenches to form back-side deep trench isolation structures.

公开(公告)号：US10510789B2

公开(公告)日：2019-12-17

申请号：US16352108

申请日：2019-03-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Yuan Chen ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Hsiao-Hui Tseng ,  Jhy-Jyi Sze ,  Shyh-Fann Ting ,  Tzu-Jui Wang ,  Yen-Ting Chiang ,  Yu-Jen Wang ,  Yuichiro Yamashita

IPC: H01L21/00 ,  H01L27/146

Abstract: The present disclosure, in some embodiments, relates to a method of forming an image sensor. The method includes implanting a dopant into a substrate to form a doped region and implanting one or more additional dopants into the substrate to form an image sensing element between the doped region and a front-side of the substrate. The doped region directly contacts a boundary of the image sensing element that is furthest from the front-side of the substrate. The method further includes etching the substrate to form one or more trenches extending into a back-side of the substrate. The back-side of the substrate opposes the front-side of the substrate. The method further includes filling the one or more trenches with one or more dielectric materials to form isolation structures.

公开(公告)号：US10475828B2

公开(公告)日：2019-11-12

申请号：US15868324

申请日：2018-01-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yen-Ting Chiang ,  Chun-Yuan Chen ,  Hsiao-Hui Tseng ,  Yu-Jen Wang ,  Shyh-Fann Ting ,  Wei-Chuang Wu ,  Jen-Cheng Liu ,  Dun-Nian Yaung

IPC: H01L27/146 ,  H01L31/0352 ,  H01L31/11

Abstract: An image sensor device structure is provided. The image sensor device structure includes a substrate, and the substrate is doped with a first conductivity type. The image sensor device structure includes a light-sensing region formed in the substrate, and the light-sensing region is doped with a second conductivity type that is different from the first conductivity type. The image sensor device structure further includes a doping region extended into the light-sensing region, and the doping region is doped with the first conductivity type. The image sensor device structure also includes a plurality of color filters formed on the doping region.

公开(公告)号：US20180204862A1

公开(公告)日：2018-07-19

申请号：US15919784

申请日：2018-03-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Yuan Chen ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Hsiao-Hui Tseng ,  Jhy-Jyi Sze ,  Shyh-Fann Ting ,  Tzu-Jui Wang ,  Yen-Ting Chiang ,  Yu-Jen Wang ,  Yuichiro Yamashita

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14689

Abstract: The present disclosure, in some embodiments, relates to a CMOS image sensor. The CMOS image sensor has an image sensing element disposed within a substrate. A plurality of isolation structures are arranged along a back-side of the substrate and are separated from opposing sides of the image sensing element by non-zero distances. A doped region is laterally arranged between the plurality of isolation structures. The doped region is also vertically arranged between the image sensing element and the back-side of the substrate. The doped region physically contacts the image sensing element.

公开(公告)号：US20170117316A1

公开(公告)日：2017-04-27

申请号：US15149561

申请日：2016-05-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kai-Chun Hsu ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Jeng-Shyan Lin ,  Shyh-Fann Ting

IPC: H01L27/146 ,  H01L23/00

Abstract: The present disclosure relates to an integrated circuit having a bond pad with a relatively flat surface topography that mitigates damage to underlying layers. In some embodiments, the integrated circuit has a plurality of metal interconnect layers within a dielectric structure over a substrate. A passivation structure is arranged over the dielectric structure. The passivation structure has a recess with sidewalls connecting a horizontal surface of the passivation structure to an upper surface of the passivation structure. A bond pad is arranged within the recess and has a lower surface overlying the horizontal surface. One or more protrusions extend outward from the lower surface through openings in the passivation structure to contact one of the metal interconnect layers. Arranging the bond pad within the recess and over the passivation structure mitigates stress to underlying layers during bonding without negatively impacting an efficiency of an image sensing element within the substrate.

公开(公告)号：US09564468B2

公开(公告)日：2017-02-07

申请号：US14663899

申请日：2015-03-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Keng-Yu Chou ,  Chun-Hao Chuang ,  Chien-Hsien Tseng ,  Shyh-Fann Ting ,  Wei-Chieh Chiang ,  Yuichiro Yamashita

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685

Abstract: A semiconductor structure for back side illumination (BSI) pixel sensors is provided. Photodiodes are arranged within a semiconductor substrate. A metal grid overlies the semiconductor substrate and is made up of metal grid segments that surround outer perimeters of the photodiodes, respectively, such that first openings within the metal grid overlie the photodiodes, respectively. A low-n grid is made up of low-n grid segments that surround the respective outer perimeters of the photodiodes, respectively, such that second openings within the low-n grid overlie the photodiodes, respectively. Color filters are arranged in the first and second openings of the photodiodes and have a refractive index greater than a refractive index of the low-n grid. A substrate isolation grid extends into the semiconductor substrate and is made up of isolation grid segments that surround outer perimeters of the photodiodes, respectively. A method for manufacturing the BSI pixel sensors is also provided.

Abstract translation: 提供了用于背面照明（BSI）像素传感器的半导体结构。 光电二极管布置在半导体衬底内。 金属网格覆盖半导体衬底，并且由分别围绕光电二极管的外周的金属栅格段组成，使得金属栅格内的第一开口分别覆盖在光电二极管上。 低n栅格分别由围绕光电二极管的相应外周的低n栅格段组成，使得低n栅格内的第二开口分别覆盖光电二极管。 滤光器布置在光电二极管的第一和第二开口中并且具有大于低n栅格的折射率的折射率。 衬底隔离栅格延伸到半导体衬底中，并且由分别围绕光电二极管外周的隔离栅格段组成。 还提供了用于制造BSI像素传感器的方法。

公开(公告)号：US20160276395A1

公开(公告)日：2016-09-22

申请号：US14663918

申请日：2015-03-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Keng-Yu Chou ,  Chun-Hao Chuang ,  Chien-Hsien Tseng ,  Shyh-Fann Ting ,  Wei-Chieh Chiang ,  Yuichiro Yamashita

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687

Abstract: A semiconductor structure for back side illumination (BSI) pixel sensors is provided. Photodiodes are arranged within a semiconductor substrate. A composite grid includes a metal grid and a low refractive index (low-n) grid. The metal grid includes first openings overlying the semiconductor substrate and corresponding to ones of the photodiodes. The low-n grid includes second openings overlying the semiconductor substrate and corresponding to ones of the photodiodes. Color filters are arranged in the first and second openings of the corresponding photodiodes and have a refractive index greater than a refractive index of the low-n grid. Upper surfaces of the color filters are offset relative to an upper surface of the composite grid. A method for manufacturing the BSI pixel sensors is also provided.

Abstract translation: 提供了用于背面照明（BSI）像素传感器的半导体结构。 光电二极管布置在半导体衬底内。 复合网格包括金属网格和低折射率（low-n）网格。 金属栅格包括覆盖半导体衬底并对应于一个光电二极管的第一开口。 低n栅格包括覆盖半导体衬底并对应于光电二极管中的一个的第二开口。 彩色滤光器布置在相应的光电二极管的第一和第二开口中并且具有大于低n栅格的折射率的折射率。 滤色片的上表面相对于复合网格的上表面偏移。 还提供了用于制造BSI像素传感器的方法。

公开(公告)号：US11923392B2

公开(公告)日：2024-03-05

申请号：US17140346

申请日：2021-01-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Keng-Yu Chou ,  Chun-Hao Chuang ,  Jen-Cheng Liu ,  Kazuaki Hashimoto ,  Ming-En Chen ,  Shyh-Fann Ting ,  Shuang-Ji Tsai ,  Wei-Chieh Chiang

IPC: H01L27/146 ,  H04N25/11 ,  H04N25/77

CPC classification number: H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H04N25/77 ,  H04N25/11

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

公开(公告)号：US11837622B2

公开(公告)日：2023-12-05

申请号：US17876858

申请日：2022-07-29

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chun-Wei Chia ,  Chun-Hao Chou ,  Kai-Chun Hsu ,  Kuo-Cheng Lee ,  Shyh-Fann Ting

IPC: H01L21/28 ,  H01L29/49 ,  H01L27/146

CPC classification number: H01L27/14689 ,  H01L21/28247 ,  H01L27/14603 ,  H01L29/4916

Abstract: An image sensor includes a semiconductor substrate, a gate dielectric layer, a gate electrode, a protection oxide film, and a nitride hard mask. The gate dielectric layer is over the semiconductor substrate. The gate electrode is over the gate dielectric layer. An entirety of a first portion of the gate dielectric layer directly under the gate electrode is of uniform thickness. The protection oxide film is in contact with a top surface of the gate electrode. The gate dielectric layer extends beyond a sidewall of the protection oxide film. The nitride hard mask is in contact with a top surface of the protection oxide film.

公开(公告)号：US11322540B2

公开(公告)日：2022-05-03

申请号：US17070430

申请日：2020-10-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kai-Chun Hsu ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Jeng-Shyan Lin ,  Shyh-Fann Ting

IPC: H01L27/146 ,  H01L23/00

Abstract: The present disclosure relates to an integrated circuit. The integrated circuit includes a plurality of interconnects within a dielectric structure over a substrate. A passivation structure is arranged over the dielectric structure. The passivation structure has sidewalls connected to one or more upper surfaces of the passivation structure. A bond pad is arranged directly between the sidewalls of the passivation structure. An upper passivation layer is disposed over the passivation structure and the bond pad. The upper passivation layer extends from over an upper surface of the bond pad to within a recess in the upper surface of the bond pad.