摘要:
A receiving apparatus is for receiving radio signals including image information transmitted by a mobile transmitting device through a plurality of receiving antennas. The receiving apparatus includes a plurality of frequency converters for outputting modulated signals obtained by converting respective radio signal received through the plurality of receiving antennas by different modulation frequencies; a superposing unit for superposing each of the modulated signals generated by the plurality of frequency converters on a frequency axis; a cable with a single coaxial cable where each of the modulated signals superposed by the superposing unit is transmitted; and a receiving unit for demodulating each modulated signal input through the cable to receive and output the image information.
摘要:
An endoscopic imaging includes an image sensor having a polygonal outline; a lens for focusing an image onto the image sensor; a lens support member abutting on the image sensor, and supporting the lens; and an abutting portion formed while extending from a lower edge portion of the lens support member, the abutting portion abutting on at least two sides of an outline of the image sensor to position the lens support member so that the lens is positioned at a predetermined position of the image sensor.
摘要:
A solid-state imaging device comprises a solid-state imaging element including a photo-reception portion and electrode pads, and optical glass bonded onto the solid-state imaging element through a bonding layer, wherein penetrating electrodes which reach the rear face of the solid-state imaging element are formed below the electrode pads of the solid-state imaging element.
摘要:
A surface treatment is carried out on a surface of an inner circumferential die 53 among dies for forming a distal end cover of a capsule endoscope by irradiating ion beams from an ion source 55 of an ion implanter so that fine and random irregularities are generated on the surface of the inner circumferential die 53 to the extent that the surface of the inner circumferential die 53 is slightly roughened. Next, by forming the distal end cover that is a molded product by injection molding while combining this inner circumferential die 53 with other dies, a molding performance for molding the distal end cover is improved without hampering an imaging performance of the capsule endoscope.
摘要:
According to the present invention, a capsular endoscope having at least an image pickup optical system, an illumination unit, an image pickup portion, and a circuit board comprises a marker shooting unit that indwells a marker member in a body cavity. Consequently, a predetermined marker is indwelled in a desired region such as a lesion discovered using the capsular endoscope so that the region can be readily rediscovered during reexamination.
摘要:
An endoscopic imaging includes an image sensor having a polygonal outline; a lens for focusing an image onto the image sensor; a lens support member abutting on the image sensor, and supporting the lens; and an abutting portion formed while extending from a lower edge portion of the lens support member, the abutting portion abutting on at least two sides of an outline of the image sensor to position the lens support member so that the lens is positioned at a predetermined position of the image sensor.
摘要:
A solid-state imaging device comprises a solid-state imaging element including a photo-reception portion and electrode pads, and optical glass bonded onto the solid-state imaging element through a bonding layer, wherein penetrating electrodes which reach the rear face of the solid-state imaging element are formed below the electrode pads of the solid-state imaging element.
摘要:
A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.
摘要:
An imaging apparatus includes a solid-state imaging sensor. The sensor includes a semiconductor chip receiving light from an object through a light receiving surface and performing photoelectric conversion of the received light; a translucent member provided on an upper surface of the chip to protect the chip; and plural electrode terminals provided on a lower surface of the chip. The apparatus also includes an optical system which is provided on a light receiving region, which is on a surface of the translucent member and is arranged at a position facing with the light receiving surface to focus the light from the object on the light receiving surface; and a resin material which reinforces a bonding strength between a circuit board on which the sensor is mounted and the electrode terminals of the sensor, and shields a region outside the light receiving region of the translucent member from light.
摘要:
An object of the present invention is to readily initiate an operation of a capsule medical apparatus which is inserted into a subject and executes a predetermined function. In a capsule endoscope 3 according to the present invention, a reed switch 14 connected to a power supply unit and a function executing unit is arranged parallel to a direction of a longitudinal axis t of a capsule-like casing 16 in the substantially cylindrical capsule-like casing 16 of the capsule endoscope 3. A pair of movable electrodes of the reed switch 14 operates according to magnetic induction of a magnetic field of a magnet 6 applied substantially parallel to the direction t of the longitudinal axis of the capsule-like casing 16, and come into contact with each other. As a result, power supply from the power supply unit to the function executing unit is allowed.