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公开(公告)号：US20140285294A1
公开(公告)日：2014-09-25
申请号：US13907949
申请日：2013-06-02
IPC分类号： H01P1/06
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A rotatable coupler for dielectric wave guides is described. A first dielectric wave guide (DWG) has an interface surface at a one end of the DWG. A second DWG has a matching interface surface at an end of the second DWG. A rotatable coupling mechanism is coupled to the two DWG ends and is configured to hold the interface surface of the first DWG in axial alignment with the interface surface of the second DWG while allowing the interface surface of the first DWG to rotate axially with respect to the interface surface of the second DWG.
摘要翻译： 描述了用于介质波导的可旋转耦合器。 第一介质波导（DWG）在DWG的一端具有界面。 第二个DWG在第二个DWG的末尾具有匹配的界面。 可旋转的联接机构联接到两个DWG端部并且被配置为保持第一DWG的接口表面与第二DWG的界面表面轴向对准，同时允许第一DWG的界面相对于第二DWG轴向旋转 第二个DWG的界面。
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公开(公告)号：US20140285293A1
公开(公告)日：2014-09-25
申请号：US13854954
申请日：2013-04-01
IPC分类号： H01P1/04
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A communication cable includes a dielectric wave guide (DWG) that has a dielectric core member that has a first dielectric constant value and a cladding surrounding the dielectric core member that has a second dielectric constant value that is lower than the first dielectric constant. An RJ45 compatible connector is attached to a mating end of the DWG. The RJ45 connector is configured to retain a complimentary coupling mechanism on a mating end of a second DWG.
摘要翻译： 通信电缆包括具有第一介电常数值的介质芯构件和围绕介电芯构件的包层的电介质波导（DWG），其具有低于第一介电常数的第二介电常数值。 RJ45兼容连接器连接到DWG的配对端。 RJ45连接器被配置为在第二DWG的配合端上保持互补的耦合机构。
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公开(公告)号：US20140285290A1
公开(公告)日：2014-09-25
申请号：US13854956
申请日：2013-04-01
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A communication cable includes one or more conductive elements surrounded by a dielectric sheath. The sheath member has a first dielectric constant value. A dielectric core member is placed longitudinally adjacent to and in contact with an outer surface of the sheath member. The core member has a second dielectric constant value that is higher than the first dielectric constant value. A cladding surrounds the sheath member and the dielectric core member. The cladding has a third dielectric constant value that is lower than the second dielectric constant value. A dielectric wave guide is formed by the dielectric core member surrounded by the sheath and the cladding.
摘要翻译： 通信电缆包括由电介质护套包围的一个或多个导电元件。 护套构件具有第一介电常数值。 电介质芯构件被纵向地邻近鞘构件的外表面并与其接触。 芯构件具有比第一介电常数值高的第二介电常数值。 包层围绕护套构件和电介质芯构件。 包层具有低于第二介电常数值的第三介电常数值。 电介质波导由被护套和包层包围的介质芯构件形成。
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公开(公告)号：US20140240187A1
公开(公告)日：2014-08-28
申请号：US13854943
申请日：2013-04-01
CPC分类号： H01P3/16 , H01L2223/6677 , H01L2224/16227 , H01L2924/15311 , H01P1/04 , H01P3/121 , H01Q13/00 , H05K1/0239 , H05K1/024 , H05K2201/0187 , H05K2201/0195 , H05K2201/09618 , H05K2201/10098 , Y10T29/49826 , Y10T29/49908
摘要： A dielectric wave guide (DWG) has a dielectric core member having that has a first dielectric constant value. A cladding surrounding the dielectric core member has a second dielectric constant value that is lower than the first dielectric constant. A mating end of the DWG is configured in a non-planer shape for mating with a second DWG having a matching non-planar shaped mating end.
摘要翻译： 电介质波导（DWG）具有具有第一介电常数值的介质芯构件。 围绕介电芯构件的包层具有低于第一介电常数的第二介电常数值。 DWG的配合端构造成非平面形状，用于与具有匹配的非平面形配合端的第二DWG配合。
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公开(公告)号：US20240113413A1
公开(公告)日：2024-04-04
申请号：US18530179
申请日：2023-12-05
CPC分类号： H01Q1/2283 , H01L23/3114 , H01L23/66 , H05K1/0237 , H01L2223/6677
摘要： A described example includes an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.
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公开(公告)号：US20240045381A1
公开(公告)日：2024-02-08
申请号：US18491304
申请日：2023-10-20
摘要： In an example, an apparatus comprises a sealed container containing a dipolar gas. The apparatus also comprises a first transmit antenna, a second transmit antenna, and a receive antenna each communicatively coupled to the sealed container. The apparatus also comprises a control circuit including a transceiver, the control circuit having a first transmit output, a second transmit output, and a receive input, the first transmit output coupled to the first transmit antenna, the second transmit output coupled to the second transmit antenna, and the receive input coupled to the receive antenna.
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公开(公告)号：US11799184B2
公开(公告)日：2023-10-24
申请号：US17140858
申请日：2021-01-04
CPC分类号： H01P5/087 , H01P3/16 , H01P11/001
摘要： An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.
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公开(公告)号：US11600581B2
公开(公告)日：2023-03-07
申请号：US17231897
申请日：2021-04-15
IPC分类号： H01L23/66 , H01L21/48 , H01L23/495
摘要： A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.
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公开(公告)号：US20220336383A1
公开(公告)日：2022-10-20
申请号：US17231897
申请日：2021-04-15
IPC分类号： H01L23/66 , H01L23/495 , H01L21/48
摘要： A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.
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公开(公告)号：US11456751B1
公开(公告)日：2022-09-27
申请号：US17536924
申请日：2021-11-29
IPC分类号： H03L7/099 , H03B5/32 , H03L7/08 , H03L7/14 , H03L7/10 , H03L7/06 , H03L1/00 , H03L1/02 , H03L7/00
摘要： A reference frequency signal generator comprises a plurality of ovenized reference crystal oscillators (OCXOs) having different turn-over-temperatures, a selector logic circuit coupled to outputs of the OCXOs, a temperature sensor, and a controller coupled to an output of the temperature sensor. The selector logic circuit outputs one of the outputs of the OCXOs based on a control signal from the controller. The controller also generates control signals for the OCXOs. In some implementations, the reference frequency signal generator includes a phase-locked loop or a fractional output divider coupled to the output of the selector logic circuit and configured to receive a calibration signal from the controller.
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