中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

95 records (took 0.025 seconds)

    EAS and UHF combination tag
    21.
    发明授权
    EAS and UHF combination tag 有权
    EAS和UHF组合标签

    公开(公告)号：US08026818B2

    公开(公告)日：2011-09-27

    申请号：US11955917

    申请日：2007-12-13

    Applicant: Andre Cote ,  Jack Mingle ,  Anthony Piccoli

    Inventor： Andre Cote ,  Jack Mingle ,  Anthony Piccoli

    IPC: B60R25/00 ,  H01F5/00

    CPC classification number: G06K19/0723 ,  G06K19/07749 ,  G06K19/07767 ,  G06K19/07779 ,  G06K19/07786

    Abstract: A combination EAS and UHF security tag that adds the ability to add item level UHF functionality to a retail tag and maintain the integrity of the EAS systems installed in the business and whereby the EAS and UHF security elements are substantially formed from a common conductive layer. This combination tag also includes the ability to change a tag from a “far-field read” tag to a “near-field read” tag.

    Abstract translation: 组合的EAS和UHF安全标签增加了将商品级UHF功能添加到零售标签并保持安装在业务中的EAS系统的完整性的能力，并且EAS和UHF安全元件基本上由公共导电层形成。 该组合标签还包括将标签从“远场读取”标签更改为“近场读取”标签的功能。

    RFID tags for pallets and cartons and system for attaching same
    22.
    发明授权
    RFID tags for pallets and cartons and system for attaching same 有权
    用于托盘和纸箱的RFID标签和用于连接的RFID标签

    公开(公告)号：US07961102B2

    公开(公告)日：2011-06-14

    申请号：US12202762

    申请日：2008-09-02

    Applicant: Thomas J. Clare ,  Andre Cote

    Inventor： Thomas J. Clare ,  Andre Cote

    IPC: G08B23/00 ,  G06K19/02

    CPC classification number: G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07786 ,  H01L2224/16225 ,  H01L2224/16227

    Abstract: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.

    Abstract translation: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面，并提供具有主体，第一底部导电点，第二底部导电点和非导电鳍片的RFID芯片，其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品，使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带，并且第二底部导电点电连接到第二条带。

    Method of fabricating a security tag in an integrated surface processing system
    25.
    发明授权
    Method of fabricating a security tag in an integrated surface processing system 失效
    在综合表面处理系统中制造安全标签的方法

    公开(公告)号：US07704346B2

    公开(公告)日：2010-04-27

    申请号：US11533172

    申请日：2006-09-19

    Applicant: Andre Cote

    Inventor： Andre Cote

    IPC: B32B37/02 ,  B32B37/16 ,  B32B38/04 ,  B32B38/10 ,  G08B13/14

    CPC classification number: G06K19/07749 ,  B32B37/02 ,  B32B37/025 ,  B32B37/1292 ,  B32B2041/04 ,  B32B2519/02 ,  G08B13/244 ,  H05K3/041 ,  H05K3/046 ,  H05K2203/0522 ,  H05K2203/1545 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1074 ,  Y10T156/1075 ,  Y10T156/1077

    Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.

    Abstract translation: 制造标签的方法包括以下步骤：将第一图案化的粘合剂施加到基底的表面，并将第一导电箔施加到第一图案化的粘合剂上。 去除不粘附到第一图案化的粘合剂的第一导电箔的一部分，并且将第二图案化的粘合剂施加到标签的表面区域的一部分。 将预制的第二导电箔施加到第二图案化的粘合剂以将第二导电箔粘附到基板的表面，并且第一和第二导电箔的部分彼此电耦合以形成标签电路。 第二图案化粘合剂可以设置在第一和第二导电箔之间。

    RFID Tags for Pallets and Cartons and System for Attaching Same
    27.
    发明申请
    RFID Tags for Pallets and Cartons and System for Attaching Same 有权
    托盘和纸箱的RFID标签及其附件系统

    公开(公告)号：US20090015412A1

    公开(公告)日：2009-01-15

    申请号：US12202762

    申请日：2008-09-02

    Applicant: Thomas J. Clare ,  Andre Cote

    Inventor： Thomas J. Clare ,  Andre Cote

    IPC: G08B13/14 ,  G06K19/06

    CPC classification number: G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07786 ,  H01L2224/16225 ,  H01L2224/16227

    Abstract: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.

    Abstract translation: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面，并提供具有主体，第一底部导电点，第二底部导电点和非导电鳍片的RFID芯片，其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品，使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带，并且第二底部导电点电连接到第二条带。

    Security tag and process for making same
    30.
    发明申请
    Security tag and process for making same 审中-公开
    安全标签和制作过程

    公开(公告)号：US20060071083A1

    公开(公告)日：2006-04-06

    申请号：US11285255

    申请日：2005-11-22

    Applicant: Lawrence Appalucci ,  Andre Cote ,  David Perez ,  Gary Mazoki ,  Anthony Piccoli ,  Rolando Martinez ,  Luis Soler Bonnin ,  Takeshi Matsumoto ,  Hideaki Imaichi

    Inventor： Lawrence Appalucci ,  Andre Cote ,  David Perez ,  Gary Mazoki ,  Anthony Piccoli ,  Rolando Martinez ,  Luis Soler Bonnin ,  Takeshi Matsumoto ,  Hideaki Imaichi

    IPC: G06K19/02 ,  G06K19/06

    CPC classification number: B32B38/10 ,  B32B38/0004 ,  B32B2311/24 ,  B32B2317/12 ,  G08B13/244 ,  Y10T156/108 ,  Y10T156/1085

    Abstract: A tag and method of making it. The tag includes a first adhesive layer provided in a first predetermined pattern between a surface of a first substrate and a first conductive foil. The first pattern corresponds to a pattern for a first conductive trace, e.g., a portion of a resonant circuit. The first conductive foil is laminated, e.g., adhesively secured, to the surface of the first substrate to form a first conductive layer. A first portion of that layer is shaped, e.g., die-cut, to generally correspond to the first pattern. A second portion of the first conductive layer not corresponding to the first portion is removed, to establish the first conductive trace, with the adhesive layer confined within the boundaries of the first conductive trace. Another conductive trace is secured to the first conductive trace, with a dielectric therebetween, to form a resonant circuit.

    Abstract translation: 标签和制作方法。 标签包括在第一基板的表面和第一导电箔之间以第一预定图案提供的第一粘合剂层。 第一图案对应于第一导电迹线的图案，例如谐振电路的一部分。 将第一导电箔层压，例如粘合地固定到第一基板的表面，以形成第一导电层。 该层的第一部分成形为例如模切，以大致对应于第一图案。 去除不对应于第一部分的第一导电层的第二部分，以建立第一导电迹线，其中粘合剂层限制在第一导电迹线的边界内。 另一导电迹线被固定到第一导电迹线，其间具有电介质以形成谐振电路。

Patent Agency Ranking