公开(公告)号：US20180090306A1

公开(公告)日：2018-03-29

申请号：US15715227

申请日：2017-09-26

Applicant: Tokyo Electron Limited

Inventor： Jiro Higashijima ,  Nobuhiro Ogata ,  Yusuke Hashimoto

IPC: H01L21/02 ,  B05B15/12 ,  B05B12/10 ,  H01L21/67 ,  G03F7/42

CPC classification number: H01L21/0206 ,  B05B12/10 ,  B05B14/40 ,  G03F7/422 ,  G03F7/423 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67248

Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.

公开(公告)号：US20170361364A1

公开(公告)日：2017-12-21

申请号：US15624822

申请日：2017-06-16

Applicant: Tokyo Electron Limited

Inventor： Nobuhiro Ogata ,  Norihiro Ito ,  Jiro Higashijima ,  Yusuke Hashimoto ,  Kazuhiro Aiura

IPC: B08B13/00 ,  B08B3/04 ,  B08B3/08 ,  H01L21/67

CPC classification number: B08B13/00 ,  B08B3/041 ,  B08B3/08 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67173

Abstract: According to the present disclosure, both first and second cup bodies are brought into a state of being close to each other by lifting one of the first and second cup bodies. A first gap between a gap forming portion formed on the lower surface of a first protruding portion and the upper surface of a second protruding portion is narrower than a second gap between a portion of the first protruding portion where the gap forming portion is absent, and the upper surface of the second protruding portion. In this state, a cleaning liquid is supplied to the second gap. Since movement of the cleaning liquid that tends to flow radially outward is restricted by the first narrow gap, the entire area between the first and second protruding portions may be filled with the cleaning liquid so that the surface to be cleaned may be evenly cleaned.

公开(公告)号：US20160118275A1

公开(公告)日：2016-04-28

申请号：US14882864

申请日：2015-10-14

Applicant: Tokyo Electron Limited

Inventor： Shigehisa Inoue ,  Jiro Higashijima ,  Masami Akimoto

IPC: H01L21/67 ,  B08B3/12 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B05B13/0228 ,  B05B15/50 ,  B05B15/55 ,  B05B15/70 ,  B08B3/02 ,  B08B3/04 ,  B08B3/12

Abstract: Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.

Abstract translation: 公开了一种基板液体处理装置，其包括：被配置为保持基板的基板保持单元; 处理液喷嘴，被配置为向由所述基板保持单元保持的所述基板供给处理液; 喷嘴臂，其构造成保持所述处理液喷嘴; 以及配置成将喷嘴臂的整个表面浸入清洁液体中以清洁喷嘴臂的臂清洁罐。

公开(公告)号：US20150187613A1

公开(公告)日：2015-07-02

申请号：US14580557

申请日：2014-12-23

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/68728

Abstract: A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.

Abstract translation: 本公开的基板液体处理装置以切换的方式将多个处理液从处理液供给单元供给到保持在基板保持单元上的基板。 可升降的内杯横向地围绕衬底保持单元，并形成排出第一处理液体的第一排水路径。 外杯围绕内杯并形成排出第二处理液体的第二排水路径。 盖子覆盖外杯的外部，包括从上侧向内延伸的檐部，并且在盖和外杯之间形成排气路径。 排气路径连接到第一漏极路径和第二漏极路径的入口上方的第一漏极路径和第二漏极路径。

公开(公告)号：US20150090305A1

公开(公告)日：2015-04-02

申请号：US14483252

申请日：2014-09-11

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: B08B3/02

CPC classification number: H01L21/67051 ,  B08B17/00 ,  H01L21/67017 ,  H01L21/6719

Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

Abstract translation: 液体处理装置通过提供处理液体对旋转基板进行液体处理。 环绕构件围绕包括围绕旋转基板的杯体的上部空间并在基板上方设置有开口的区域。 气流形成部从杯体的上侧形成下降的气流。 底面部分沿圆周方向在杯体和周围部件之间阻塞。 排气口设置在底表面部分的上方和杯体外部，以排出由周围构件和底面部分包围的区域中的气氛。

公开(公告)号：US11574827B2

公开(公告)日：2023-02-07

申请号：US16641713

申请日：2018-08-17

Applicant: Tokyo Electron Limited

Inventor： Tadashi Iino ,  Yoshihiro Kai ,  Yoichi Tokunaga ,  Nobuhiro Ogata ,  Jiro Higashijima

IPC: H01L21/67 ,  H01L21/304 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.

公开(公告)号：US11056335B2

公开(公告)日：2021-07-06

申请号：US16710462

申请日：2019-12-11

Applicant: Tokyo Electron Limited

Inventor： Jiro Higashijima ,  Nobuhiro Ogata ,  Yusuke Hashimoto

IPC: H01L21/02 ,  H01L21/67 ,  G03F7/42 ,  B05B14/40 ,  B05B12/10

Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.

公开(公告)号：US20200152443A1

公开(公告)日：2020-05-14

申请号：US16710462

申请日：2019-12-11

Applicant: Tokyo Electron Limited

Inventor： Jiro Higashijima ,  Nobuhiro Ogata ,  Yusuke Hashimoto

IPC: H01L21/02 ,  H01L21/67 ,  G03F7/42 ,  B05B12/10 ,  B05B14/40

Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.

公开(公告)号：US20190067048A1

公开(公告)日：2019-02-28

申请号：US16074445

申请日：2017-01-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuhiro Takaki ,  Shinichi Umeno ,  Takashi Nagai ,  Hisashi Morita ,  Nobuhiro Ogata ,  Yusuke Takamatsu ,  Jiro Higashijima

IPC: H01L21/67

Abstract: A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.

公开(公告)号：US20180221925A1

公开(公告)日：2018-08-09

申请号：US15747921

申请日：2016-07-28

Applicant: Tokyo Electron Limited

Inventor： Norihiro Ito ,  Jiro Higashijima ,  Nobuhiro Ogata ,  Takahisa Otsuka ,  Yuichi Douki ,  Yusuke Hashimoto ,  Kazuhiro Aiura ,  Daisuke Goto

IPC: B08B17/02 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08

CPC classification number: B08B17/025 ,  B08B3/02 ,  B08B3/022 ,  B08B3/08 ,  B08B2203/0229 ,  B08B2203/0264 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/68764

Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.