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公开(公告)号：US11880213B2
公开(公告)日：2024-01-23
申请号：US17320733
申请日：2021-05-14
Applicant: Tokyo Electron Limited
Inventor： Mikio Nakashima , Akinori Tanaka , Nobuhiro Ogata , Isamu Miyamoto
CPC classification number: G05D7/0635 , B05C11/1026 , H01L21/6708 , H01L21/67023 , H01L21/67253 , G01F1/661 , G01M3/38
Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.
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公开(公告)号：US11574827B2
公开(公告)日：2023-02-07
申请号：US16641713
申请日：2018-08-17
Applicant: Tokyo Electron Limited
Inventor： Tadashi Iino , Yoshihiro Kai , Yoichi Tokunaga , Nobuhiro Ogata , Jiro Higashijima
IPC: H01L21/67 , H01L21/304 , H01L21/306 , H01L21/687
Abstract: A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.
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公开(公告)号：US11056335B2
公开(公告)日：2021-07-06
申请号：US16710462
申请日：2019-12-11
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata , Yusuke Hashimoto
Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.
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Patent Agency Ranking
公开(公告)号：US20200152443A1
公开(公告)日：2020-05-14
申请号：US16710462
申请日：2019-12-11
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata , Yusuke Hashimoto
Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.
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公开(公告)号：US20190067048A1
公开(公告)日：2019-02-28
申请号：US16074445
申请日：2017-01-20
Applicant: TOKYO ELECTRON LIMITED
Inventor： Yasuhiro Takaki , Shinichi Umeno , Takashi Nagai , Hisashi Morita , Nobuhiro Ogata , Yusuke Takamatsu , Jiro Higashijima
IPC: H01L21/67
Abstract: A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.
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公开(公告)号：US20180221925A1
公开(公告)日：2018-08-09
申请号：US15747921
申请日：2016-07-28
Applicant: Tokyo Electron Limited
Inventor： Norihiro Ito , Jiro Higashijima , Nobuhiro Ogata , Takahisa Otsuka , Yuichi Douki , Yusuke Hashimoto , Kazuhiro Aiura , Daisuke Goto
CPC classification number: B08B17/025 , B08B3/02 , B08B3/022 , B08B3/08 , B08B2203/0229 , B08B2203/0264 , H01L21/02052 , H01L21/67051 , H01L21/68764
Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.
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公开(公告)号：US09933702B2
公开(公告)日：2018-04-03
申请号：US15251072
申请日：2016-08-30
Applicant: Tokyo Electron Limited
Inventor： Jiro Higashijima , Nobuhiro Ogata
IPC: G03F7/42
CPC classification number: G03F7/423
Abstract: A processing fluid can be discharged according to a discharge type for a process involved, without a discharge defect. A substrate processing apparatus includes a nozzle and a pipeline. The nozzle is configured to discharge the processing fluid toward a substrate, and the processing fluid is supplied to the nozzle through the pipeline. The pipeline has a three-layer structure having a first layer, a second layer and a third layer in this sequence from an inner side thereof. Further, a leading end portion of the first layer and a leading end portion of the third layer are bonded to the nozzle, and the leading end portion of the first layer is located at a position which is not protruded more than a leading end portion of the second layer with respect to a discharging direction of the processing fluid.
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公开(公告)号：US09387520B2
公开(公告)日：2016-07-12
申请号：US13941770
申请日：2013-07-15
Applicant: Tokyo Electron Limited
Inventor： Nobuhiro Ogata , Terufumi Wakiyama , Yoshihiro Kai , Ryouga Kamo , Yoshinori Ikeda
CPC classification number: B08B3/04 , H01L21/67051
Abstract: Disclosed are a liquid processing apparatus and a cleaning method which may perform cleaning on a portion which is not in the vicinity of a drain section in an exhaust route. The liquid processing apparatus includes an exhaust section provided in vicinity of the drain section, which is configured to exhaust a surrounding atmosphere of the substrate held by the substrate holding unit; an exhaust route forming member configured to form an exhaust route reaching the exhaust section; and a first cleaning unit configured to supply a cleaning liquid to the exhaust route forming member at the exhaust route side.
Abstract translation: 公开了一种液体处理设备和清洁方法，其可以对排气路径中不在排水区附近的部分进行清洁。 液体处理装置包括设置在排出部附近的排气部，该排气部构造为排出由基板保持单元保持的基板的周围的气氛; 排气路径形成部件，其构成为形成到达排气部的排气路径; 以及构造成在排气路径侧向排气路径形成部件供给清洗液的第一清洗部。
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