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235 条记录 (耗时 0.032 秒)

    Semiconductor integrated circuit device
    23.
    发明申请
    Semiconductor integrated circuit device 有权
    半导体集成电路器件

    公开(公告)号：US20060232307A1

    公开(公告)日：2006-10-19

    申请号：US11405541

    申请日：2006-04-18

    申请人： Yusuke Kanno ,  Kazuo Tanaka ,  Shunsuke Toyoshima ,  Takeo Toba

    发明人： Yusuke Kanno ,  Kazuo Tanaka ,  Shunsuke Toyoshima ,  Takeo Toba

    IPC分类号： H03B1/00

    CPC分类号： H03K19/018521 ,  H01L27/0928 ,  H01L27/105 ,  H03K3/356113

    摘要： A semiconductor integrated circuit device including an I/O circuitry capable of low-voltage high-speed operation at low cost is provided. In the I/O circuitry, when an I/O voltage (for example, 3.3 V) is lowered to a predetermined voltage (for example, 1.8 V), portions causing a speed deterioration are a level conversion unit and a pre-buffer unit for driving a main large-sized buffer. In view of this, a high voltage is applied to a level up converter and a pre-buffer circuit. By doing so, it is possible to achieve an I/O circuitry capable of low-voltage high-speed operation at low cost.

    摘要翻译： 提供了包括能够以低成本进行低电压高速运行的I / O电路的半导体集成电路装置。 在I / O电路中，当I / O电压（例如3.3V）降低到预定电压（例如1.8V）时，导致速度劣化的部分是电平转换单元和预缓冲单元 用于驱动主要大型缓冲区。 鉴于此，高电压被施加到电平转换器和预缓冲器电路。 通过这样做，可以以低成本实现能够进行低电压高速操作的I / O电路。

    Semiconductor device
    24.
    发明申请
    Semiconductor device 审中-公开
    半导体器件

    公开(公告)号：US20060077601A1

    公开(公告)日：2006-04-13

    申请号：US11222780

    申请日：2005-09-12

    申请人： Hiroyuki Ikeda ,  Kazuo Tanaka ,  Hiroyasu Ishizuka ,  Koichiro Takakuwa

    发明人： Hiroyuki Ikeda ,  Kazuo Tanaka ,  Hiroyasu Ishizuka ,  Koichiro Takakuwa

    IPC分类号： H02H9/00

    CPC分类号： H01L27/0251

    摘要： The invention intends to provide a semiconductor device capable of preventing an electrostatic breakdown especially by the CDM, of the electrostatic breakdowns generated between plural power supply systems, with a few number of protection circuits. The semiconductor device includes a first circuit block that operates with a first power supply voltage and a first reference voltage, and a second circuit block that operates with a second power supply voltage and a second reference voltage. Further, the semiconductor device includes a first clamp circuit that clamps a potential between the first power supply voltage and the second reference voltage, a second clamp circuit that clamps a potential between the second power supply voltage and the first reference voltage, and a third clamp circuit that clamps a potential between the first reference voltage and the second reference voltage.

    摘要翻译： 本发明旨在提供一种半导体器件，其能够防止特别是CDM的静电击穿在多个电源系统之间产生的静电击穿与少数保护电路。 半导体器件包括以第一电源电压和第一参考电压工作的第一电路块，以及以第二电源电压和第二参考电压工作的第二电路块。 此外，半导体器件包括钳位第一电源电压和第二参考电压之间的电位的第一钳位电路，钳位第二电源电压和第一参考电压之间的电位的第二钳位电路和第三钳位电路 电路，钳位第一参考电压和第二参考电压之间的电位。

    Radio communication system
    26.
    发明申请
    Radio communication system 失效
    无线通信系统

    公开(公告)号：US20050266797A1

    公开(公告)日：2005-12-01

    申请号：US10530976

    申请日：2004-07-22

    申请人： Kuniaki Utsumi ,  Hiroaki Yamamoto ,  Kouichi Masuda ,  Tsutomu Niiho ,  Mariko Nakaso ,  Kazuo Tanaka ,  Hiroyuki Sasai

    发明人： Kuniaki Utsumi ,  Hiroaki Yamamoto ,  Kouichi Masuda ,  Tsutomu Niiho ,  Mariko Nakaso ,  Kazuo Tanaka ,  Hiroyuki Sasai

    IPC分类号： H04B7/005 ,  H04B10/00 ,  H04B10/071 ,  H04B10/077 ,  H04B10/079 ,  H04B10/272 ,  H04J13/00 ,  H04W52/04 ,  H04W52/14 ,  H04W52/24 ,  H04W88/08 ,  H04W92/00 ,  H04B7/14

    CPC分类号： H04W52/143 ,  H04B10/25754 ,  H04W52/24 ,  H04W88/085

    摘要： The present invention is directed to a wireless communication system capable of keeping a level of a wireless signal received by a relay apparatus (20) within a predetermined dynamic range. In a control apparatus (10), a transmitting section (102) converts a downstream electric signal into a downstream optical signal and transmits the downstream optical signal to the relay apparatus (20) via an optical transmission path (40). The relay apparatus (20) converts the received downstream optical signal into a downstream electric signal and transmits the downstream electric signal as a wireless signal to a wireless communication terminal (30) from a transmitting/receiving antenna section (204). In the relay apparatus (20), a level adjustment section (207) adjusts the level of the wireless signal transmitted by the relay apparatus (20) such that the receiving level of the wireless signal received by the relay apparatus is kept within a predetermined range.

    摘要翻译： 本发明涉及能够将由中继装置（20）接收的无线信号的电平保持在规定动态范围内的无线通信系统。 在控制装置（10）中，发送部（102）将下行电信号转换为下行光信号，经由光传输路径（40）将下行光信号发送给中继装置（20）。 中继装置（20）将接收到的下行光信号转换为下行电信号，并将发送/接收天线部（204）的下行电信号作为无线信号发送到无线通信终端（30）。 在中继装置（20）中，电平调整部（207）调整由中继装置（20）发送的无线信号的电平，使得由中继装置接收到的无线信号的接收电平保持在预定范围内 。

    Method and apparatus for controlling a semiconductor fabrication temperature
    27.
    发明申请
    Method and apparatus for controlling a semiconductor fabrication temperature 审中-公开
    用于控制半导体制造温度的方法和装置

    公开(公告)号：US20050266685A1

    公开(公告)日：2005-12-01

    申请号：US11153223

    申请日：2005-06-15

    申请人： Minoru Nakano ,  Masaaki Ueno ,  Kazuo Tanaka

    发明人： Minoru Nakano ,  Masaaki Ueno ,  Kazuo Tanaka

    IPC分类号： H01L21/205 ,  C23C16/46 ,  G05D23/19 ,  H01L21/00 ,  H01L21/44

    CPC分类号： G05D23/1935 ,  H01L21/67248

    摘要： In a method for controlling temperatures in a semiconductor manufacturing apparatus including a reaction chamber and a plurality of heating sources, a set of power ratios to be fed to the heating sources is determined for each of two or more selected temperatures. Then, a temperature of the reaction chamber is controlled by performing power control on the heating sources based on at least one set of power ratios obtained.

    摘要翻译： 在用于控制包括反应室和多个加热源的半导体制造装置中的温度的方法中，针对两个或多个所选择的温度中的每一个确定要供给到加热源的一组功率比。 然后，通过基于获得的至少一组功率比，对加热源进行功率控制来控制反应室的温度。

    Shielding device for antenna board, and liquid ejection apparatus incorporating the same
    28.
    发明授权
    Shielding device for antenna board, and liquid ejection apparatus incorporating the same 失效
    用于天线板的屏蔽装置和包括该屏蔽装置的液体喷射装置

    公开(公告)号：US06900774B2

    公开(公告)日：2005-05-31

    申请号：US10652240

    申请日：2003-09-02

    申请人： Kunio Kawakami ,  Osamu Koshiishi ,  Kazuo Tanaka ,  Osamu Hanamura

    发明人： Kunio Kawakami ,  Osamu Koshiishi ,  Kazuo Tanaka ,  Osamu Hanamura

    IPC分类号： B41J2/175 ,  B41J29/00 ,  H01Q1/52 ,  G01D11/00

    CPC分类号： H01Q1/52

    摘要： A first plate member constitutes a part of a main frame of a liquid ejection apparatus. A second plate member is extended from the first plate member such that a first part thereof opposes to a traveling path of a carriage which carries a plurality of liquid containers each provided with an IC chip and a receiving antenna. A transmission antenna is provided on an antenna board. The antenna board is mounted on the first part of the second plate member. The second plate member is formed with a first region which allows the transmission antenna to establish radio communication with the receiving antenna, and a second region which shields radio waves.

    摘要翻译： 第一板构件构成液体喷射装置的主框架的一部分。 第二板构件从第一板构件延伸，使得其第一部分与承载多个液体容器的托架的行进路径相对，每个液体容器均设置有IC芯片和接收天线。 在天线板上设置发送天线。 天线板安装在第二板构件的第一部分上。 第二板构件形成有允许发射天线与接收天线建立无线电通信的第一区域和屏蔽无线电波的第二区域。

    Temperature control simulation method and apparatus
    29.
    发明授权
    Temperature control simulation method and apparatus 失效
    温度控制仿真方法及装置

    公开(公告)号：US06711531B1

    公开(公告)日：2004-03-23

    申请号：US09369926

    申请日：1999-08-09

    申请人： Kazuo Tanaka ,  Hideto Yamaguchi ,  Kenzo Urabe

    发明人： Kazuo Tanaka ,  Hideto Yamaguchi ,  Kenzo Urabe

    IPC分类号： G06G748

    CPC分类号： G06G7/66

    摘要： A temperature control simulation method and apparatus for forming a temperature system simulation model on a computer, provide substantially the same response or simulation characteristics as a temperature change in an actual furnace, whereby a temperature control algorithm can be developed and the method or manner of manipulating the temperature control can be learned without using an actual furnace. A transfer function is determined which represents a relationship between a heater input and a temperature output. A temperature control simulation for a heating furnace is executed using the transfer function of a heating furnace as a transfer function that a temperature system simulation device uses.

    摘要翻译： 用于在计算机上形成温度系统模拟模型的温度控制模拟方法和装置提供与实际炉中的温度变化基本相同的响应或模拟特性，由此可以开发温度控制算法，以及操作的方法或方式 可以在不使用实际炉的情况下学习温度控制。 确定表示加热器输入和温度输出之间的关系的传递函数。 使用加热炉的传递函数作为温度系统模拟装置使用的传递函数来执行加热炉的温度控制模拟。