公开(公告)号：US20160252689A1

公开(公告)日：2016-09-01

申请号：US15152569

申请日：2016-05-12

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/12

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US09335470B2

公开(公告)日：2016-05-10

申请号：US14490688

申请日：2014-09-19

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/4203 ,  G02B6/4231 ,  G02B6/428 ,  Y10T29/49131

Abstract: A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.

Abstract translation: 光电路基板的组装方法如下所述。 在基底上有序地形成底部包层，芯层和顶部覆层，使得波导完成。 在基材中形成第一导光孔，在基材上设置光源，形成发光成分。 在另一个基材中形成第二导光孔，然后将光接收器设置在另一个基材上，从而形成接收器部件。 处理电路基板以在基板的第一电路层上形成第一空腔，第二空腔和第三空腔。 波导，发射部件和接收器部件分别设置在第一腔体，第二腔体和第三腔体中。

公开(公告)号：US20160073505A1

公开(公告)日：2016-03-10

申请号：US14477874

申请日：2014-09-05

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Po Yu ,  Kuo-Wei Li

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/007 ,  H05K1/0373 ,  H05K3/421 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0154

Abstract: A manufacturing method of multilayer flexible circuit structure including the following steps is provided. Two first flexible substrates are correspondingly bonded on two sides of a release film, and two conductive materials are correspondingly formed on the two first flexible substrates. The two conductive materials are patterned to form two first inner-layer circuits. Two outer build-up structures are bonded on the two corresponding first flexible substrates. The release film is removed, so as to separate the two first flexible substrates. An outer-layer circuit is formed on each of the first flexible substrates and the corresponding outer build-up structure, wherein the outer-layer circuit is connected to the corresponding first inner-layer circuit, and each of the first flexible substrates, the corresponding first inner-layer circuit, the outer build-up structure and the outer-layer circuit correspondingly form a multilayer flexible circuit structure. Another manufacturing method of multilayer flexible circuit structure is also provided.

Abstract translation: 提供了包括以下步骤的多层柔性电路结构的制造方法。 两个第一柔性基板相应地结合在剥离膜的两侧上，并且两个导电材料相应地形成在两个第一柔性基板上。 将两个导电材料图案化以形成两个第一内层电路。 两个外部积聚结构结合在两个对应的第一柔性基底上。 去除剥离膜，以分离两个第一柔性基底。 在每个第一柔性基板和相应的外部积层结构上形成外层电路，其中外层电路连接到对应的第一内层电路，并且每个第一柔性基板，相应的 第一内层电路，外部积层结构和外层电路相应地形成多层柔性电路结构。 还提供了另一种多层柔性电路结构的制造方法。

公开(公告)号：US20160050771A1

公开(公告)日：2016-02-18

申请号：US14460365

申请日：2014-08-15

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Po Yu ,  Ming-Chia Li

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/4644 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/183 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/066 ,  H05K2201/09845 ,  H05K2201/10416

Abstract: A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.

Abstract translation: 提供一种嵌入散热块的电路结构的制造方法，包括以下步骤。 提供了包括第一电介质层和位于第一介电层的两个相对侧上的两个第一导电层的芯板。 形成穿过芯板的通孔。 散热块设置在通孔中。 两个内层电路形成在芯板的两个相对的两侧。 至少一个堆积结构结合在芯板上，其中积聚结构包括第二介电层和第二导电层，第二介电层位于第二导电层和芯板之间。 在积聚结构的预定区域上形成空腔，并且空腔与相应的内层电路连通。 还提供了另外一种嵌入散热块的电路结构的制造方法。

公开(公告)号：US09159713B1

公开(公告)日：2015-10-13

申请号：US14493336

申请日：2014-09-22

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: H01L23/52 ,  H01L25/16 ,  G02B6/12

CPC classification number: H01L25/167 ,  G02B6/12004 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An opto-electronic circuit board includes a substrate, a cavity, blind vias, metal layers, a first chip, a second chip, and the optical component. The substrate includes a first circuit layer, a second circuit layer, and a dielectric layer disposed between the first circuit layer and the second circuit layer. The cavity is disposed on the dielectric layer, in which the cavity extends from the first circuit layer to the second circuit layer. The blind vias are disposed at opposite sides of the cavity. The first chip is disposed on the second circuit layer with corresponding to one of the blind vias. The second chip is disposed on the second circuit layer with corresponding to the other one of the blind vias. The optical component is disposed in the cavity, in which the second surface of the optical component is connected to the first circuit layer.

Abstract translation: 光电子电路板包括基板，空腔，盲孔，金属层，第一芯片，第二芯片和光学部件。 衬底包括第一电路层，第二电路层和布置在第一电路层和第二电路层之间的电介质层。 空腔设置在电介质层上，空腔从第一电路层延伸到第二电路层。 盲孔设置在空腔的相对侧。 第一芯片设置在与其中一个盲孔相对应的第二电路层上。 第二芯片设置在第二电路层上，对应于盲孔中的另一个。 光学部件设置在空腔中，光学部件的第二表面连接到第一电路层。

公开(公告)号：US20150121694A1

公开(公告)日：2015-05-07

申请号：US14073873

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46

CPC classification number: H05K3/4679 ,  H05K1/0268 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有彼此相对的两个表面的基板和连接在其间的通孔。 接下来，通过使用通孔作为对准对象，在每个表面上形成图案化电路层。 每个图案化电路层包括同心圆图案。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 接着，在第一层叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US20140099432A1

公开(公告)日：2014-04-10

申请号：US13727600

申请日：2012-12-27

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC: H05K3/00

CPC classification number: H05K3/007 ,  H05K3/0097 ,  H05K3/381 ,  H05K2201/0154

Abstract: A fabrication method for a flexible circuit board is provided. The fabrication method includes the following steps. Firstly, a release film having an upper surface and a lower surface opposite to each other is provided. Next, two flexible substrates are respectively disposed on the upper surface and the lower surface. Next, a plurality of nano-scale micro-pores are formed on each flexible substrate to form two non-smooth flexible substrates. The nano-scale micro-pores evenly distributed over an outer surface of each non-smooth flexible substrate. Each non-smooth flexible substrate being adapted to be performed a plating process directly on the outer surface thereof.

Abstract translation: 提供了一种柔性电路板的制造方法。 制造方法包括以下步骤。 首先，提供具有彼此相对的上表面和下表面的剥离膜。 接下来，在上表面和下表面上分别设置两个柔性基板。 接下来，在每个柔性基板上形成多个纳米级微孔，以形成两个非平滑柔性基板。 纳米级微孔均匀分布在每个非光滑柔性基底的外表面上。 每个非光滑柔性基底适于在其外表面上直接进行电镀工艺。

公开(公告)号：US20180160543A1

公开(公告)日：2018-06-07

申请号：US15430556

申请日：2017-02-13

Applicant: Unimicron Technology Corp.

Inventor： Po-Hsuan Liao ,  Chi-Min Chang ,  Cheng-Po Yu

IPC: H05K3/20 ,  H05K3/38 ,  H05K1/11

CPC classification number: H05K3/20 ,  H05K3/4644 ,  H05K2201/09727 ,  H05K2201/09918 ,  H05K2203/0522 ,  H05K2203/107 ,  H05K2203/1476

Abstract: A manufacturing method of a circuit board including the following steps is provided. A first patterned circuit layer is formed on a surface of a circuit substrate, and the first patterned circuit layer exposes a portion of the surface of the circuit substrate. A patterned glue layer is formed on the portion of the surface of the circuit substrate exposed by the first patterned circuit layer. A second patterned circuit layer is transfer-printed on the corresponding patterned glue layer. In addition, a structure of the circuit board is also mentioned.

公开(公告)号：US09805875B2

公开(公告)日：2017-10-31

申请号：US14705950

申请日：2015-05-06

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu

IPC: H01G11/58 ,  H01G11/24 ,  H01G9/035 ,  H01G9/145 ,  H01G9/00 ,  H01G9/02 ,  H01G9/04

CPC classification number: H01G9/035 ,  H01G9/0029 ,  H01G9/02 ,  H01G9/04 ,  H01G9/145

Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a porous substrate, an electrolyte composition, and a pair of electrodes. The porous substrate has a plurality of holes. The electrolyte composition is located in the holes of the porous substrate, and the electrolyte composition includes an electrolyte solution and a nano carbon material dispersed in the electrolyte solution. The electrodes are respectively located on two opposite surfaces of the porous substrate.

公开(公告)号：US09635757B1

公开(公告)日：2017-04-25

申请号：US15233972

申请日：2016-08-11

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Chi-Min Chang ,  Cheng-Po Yu

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0366 ,  H05K3/4673 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2203/0557

Abstract: A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.