公开(公告)号：US08385069B2

公开(公告)日：2013-02-26

申请号：US12785779

申请日：2010-05-24

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

公开(公告)号：US20120079314A1

公开(公告)日：2012-03-29

申请号：US12891309

申请日：2010-09-27

申请人： Vinod Kamath ,  Jason A. Matteson ,  Gregory J. McKnight ,  Mark E. Steinke

发明人： Vinod Kamath ,  Jason A. Matteson ,  Gregory J. McKnight ,  Mark E. Steinke

IPC分类号： G06F11/07

CPC分类号： G06F11/0793 ,  G06F11/073

摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.

摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。

公开(公告)号：US20110232889A1

公开(公告)日：2011-09-29

申请号：US12729859

申请日：2010-03-23

申请人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

发明人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

IPC分类号： F28F27/00 ,  F28D15/00

CPC分类号： F28D1/0435 ,  F28D1/0477 ,  H05K7/2079

摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。

公开(公告)号：US20120254400A1

公开(公告)日：2012-10-04

申请号：US13077578

申请日：2011-03-31

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

IPC分类号： G06F15/173

CPC分类号： G06F9/5094 ,  Y02D10/22

摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.

摘要翻译： 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

公开(公告)号：US07826215B2

公开(公告)日：2010-11-02

申请号：US12032230

申请日：2008-02-15

申请人： Troy Williams Glover ,  Michael Sean June ,  Vinod Kamath ,  Whitcomb Randloph Scott, III

发明人： Troy Williams Glover ,  Michael Sean June ,  Vinod Kamath ,  Whitcomb Randloph Scott, III

IPC分类号： H05K7/20 ,  F28F7/00 ,  H05K5/00 ,  G05D23/00

CPC分类号： H05K7/20836 ,  H05K7/20727

摘要： A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.

摘要翻译： 计算机系统中的温度隔离管道，包括固定电路板的底盘和通过底盘吸入空气的风扇系统，以及发电部件安装在电路板上并暴露于空气流中。 热风管道将发热部件加热的空气从发热部件直接下游对准，将单个热风管道入口导向单个热风管道出口。 热传感器固定在管道出口附近的热空气管道内或与其直接对准，以便感测流过热风管道的空气的温度并产生温度信号。 控制器与热传感器进行电子通信，用于接收温度信号，并与风扇系统进行电子通信，以发送风扇速度控制信号。

公开(公告)号：US07660116B2

公开(公告)日：2010-02-09

申请号：US12107010

申请日：2008-04-21

申请人： Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, Jr. ,  Michael Sven Miller ,  Stephen Peter Mroz

发明人： Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, Jr. ,  Michael Sven Miller ,  Stephen Peter Mroz

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/2079 ,  Y10T29/49826

摘要： Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

摘要翻译： 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。

公开(公告)号：US20090262501A1

公开(公告)日：2009-10-22

申请号：US12107010

申请日：2008-04-21

申请人： Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, JR. ,  Michael Sven Miller ,  Stephen Peter Mroz

发明人： Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, JR. ,  Michael Sven Miller ,  Stephen Peter Mroz

IPC分类号： G06F1/20 ,  H05K7/20 ,  B23P11/00 ,  H05K5/00

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/2079 ,  Y10T29/49826

摘要： Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

摘要翻译： 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。

公开(公告)号：US20090256512A1

公开(公告)日：2009-10-15

申请号：US12099841

申请日：2008-04-09

申请人： Ralph Murray Begun ,  Raymond Mathew Clemo ,  Karl Klaus Dittus ,  Vinod Kamath ,  Michael Sven Miller ,  Warren Everett Price ,  Whitcomb Randolph Scott, III

发明人： Ralph Murray Begun ,  Raymond Mathew Clemo ,  Karl Klaus Dittus ,  Vinod Kamath ,  Michael Sven Miller ,  Warren Everett Price ,  Whitcomb Randolph Scott, III

IPC分类号： H02P31/00 ,  G06F1/20

CPC分类号： G06F1/20 ,  H05K7/20209 ,  Y10S388/934

摘要： A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.

摘要翻译： 一种包括底盘的系统，其包括多个模块和设置在所述底盘的远端中的风扇组件，用于通过所述多个模块的并行路径抽取空气。 至少一个模块是具有热传感器的计算模块，该热传感器设置成感测流过安装在母板上的处理器的空气的温度。 该系统还包括接收来自热传感器的输出的风扇控制器，其中风扇控制器操作风扇组件以冷却多个模块并将热传感器输出保持在工作温度范围内。 风扇控制器根据与在机箱中接收的计算模块之一相关联的预定热分布设置来控制风扇速度。 例如，预定的热分布设置可以包括最小风扇速度，最大风扇速度和控制回路反馈设置。

公开(公告)号：US20080116571A1

公开(公告)日：2008-05-22

申请号：US11604152

申请日：2006-11-22

申请人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

发明人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

IPC分类号： H01L23/467

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.

摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。

公开(公告)号：US20080055855A1

公开(公告)日：2008-03-06

申请号：US11470530

申请日：2006-09-06

申请人： Vinod Kamath ,  Jason Aaron Matteson

发明人： Vinod Kamath ,  Jason Aaron Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： Heat sinks and methods are provided for improved cooling of heat-generating components. In one embodiment, a heat sink includes a base having a first wall, a second wall, and a plurality of heat pipes sandwiched therebetween. The first and second walls, optionally plates, are spaced apart to provide an airflow pathway through the base. An outer cooling fin structure is disposed on the second wall, and an optional inner cooling fin structure may be disposed on the first wall. A plurality of perforations and/or a plurality of grooves may also be formed on the walls. The heat sink is secured to a chassis with the first wall in thermal contact with a CPU. Air flows through the cooling fin structure(s), as well as through the base, grooves, and holes. The airflow through the base, grooves, and holes improves cooling and lowers the impedance of the heat sink.

摘要翻译： 提供散热器和方法来改善发热部件的冷却。 在一个实施例中，散热器包括具有第一壁，第二壁和夹在其间的多个热管的基座。 第一和第二壁（可选的板）间隔开以提供穿过基座的气流路径。 外部冷却翅片结构设置在第二壁上，并且可选的内部冷却翅片结构可设置在第一壁上。 也可以在壁上形成多个穿孔和/或多个凹槽。 散热器固定在底盘上，第一个墙壁与CPU热接触。 空气流过冷却翅片结构，以及通过基座，凹槽和孔。 通过基座，槽和孔的气流改善了散热，降低了散热器的阻抗。