公开(公告)号：US08318556B2

公开(公告)日：2012-11-27

申请号：US12704511

申请日：2010-02-11

Applicant: Ping Ting Wang ,  Cheng Yang ,  Seung Hyuk Lee ,  Jin Gang Wu

Inventor： Ping Ting Wang ,  Cheng Yang ,  Seung Hyuk Lee ,  Jin Gang Wu

IPC: H01L29/72

CPC classification number: H01L21/32139 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/0207 ,  H01L27/10855 ,  H01L27/10888 ,  H01L27/10891

Abstract: A method for making contact landing pad structures in a semiconductor integrated circuit device includes forming an isolation region and forming active regions in the semiconductor substrate. The active regions are separated by the isolation region, and each of the active regions includes one or more contact regions. The method includes forming a raised structure overlying the isolation region and disposed between a first and second contact regions. The method includes depositing a cap layer and forming an interlayer dielectric layer overlying the cap layer. The method includes depositing a photoresist layer overlying the interlayer dielectric layer and uses a mask pattern to selectively remove a portion of the photoresist layer to form a line type opening, which exposes a portion of the interlayer dielectric layer overlying at least the first and second contact regions. The method deposits a conductive fill material and performs a planarization process to form multiple conductive landing contact pads.

Abstract translation: 一种用于在半导体集成电路器件中形成接触着陆焊盘结构的方法包括形成隔离区并在半导体衬底中形成有源区。 有源区域被隔离区隔开，并且每个有源区域包括一个或多个接触区域。 该方法包括形成覆盖隔离区域的凸起结构，并设置在第一和第二接触区域之间。 该方法包括沉积覆盖层并形成覆盖覆盖层的层间电介质层。 该方法包括沉积覆盖在层间电介质层上的光致抗蚀剂层，并且使用掩模图案来选择性地去除光致抗蚀剂层的一部分以形成线型开口，其暴露部分至少覆盖第一和第二接触的层间电介质层 地区。 该方法沉积导电填充材料并执行平坦化处理以形成多个导电着陆接触焊盘。

公开(公告)号：US08312012B1

公开(公告)日：2012-11-13

申请号：US12842545

申请日：2010-07-23

Applicant: Radhika Malpani ,  Cheng Yang ,  Yonatan Zunger

Inventor： Radhika Malpani ,  Cheng Yang ,  Yonatan Zunger

IPC: G06F7/00 ,  G06F17/30

CPC classification number: G06F17/30277 ,  G06F17/30265 ,  G06F17/30864 ,  G06K9/6267

Abstract: Image galleries are automatically located within documents, such as web pages. Documents that are determined to contain image galleries may be treated differently when storing the document for later retrieval by an image search engine. In one implementation, the image galleries are automatically located within a document by calculating position information indicating relative positions of images in the document. The document may be determined to contain an image gallery when the position information indicates that the images in the document are generally evenly distributed.

Abstract translation: 图像库自动位于文档（如网页）中。 确定包含图像库的文档在存储文档以供图像搜索引擎稍后检索时可以被不同地对待。 在一个实现中，图像库通过计算指示文档中的图像的相对位置的位置信息而自动位于文档内。 当位置信息指示文档中的图像大致均匀分布时，文档可以被确定为包含图像库。

公开(公告)号：US20120228777A1

公开(公告)日：2012-09-13

申请号：US12918579

申请日：2009-11-25

Applicant: Cheng Yang ,  Jiamin Qian ,  Hai Wu

Inventor： Cheng Yang ,  Jiamin Qian ,  Hai Wu

IPC: H01L23/522 ,  H01L21/78

CPC classification number: H01L23/585 ,  H01L23/481 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present disclosure relates to forming a plurality of through silicon vias guard rings proximate the scribes streets of a microelectronic device wafer. The microelectronic device wafer includes a substrate wherein the through silicon via guard ring is fabricated by forming vias extending completely through the substrate. The through silicon via guard rings act as crack arresters, such that defects caused by cracks resulting from the dicing of the microelectronic wafer are substantially reduced or eliminated.

Abstract translation: 本公开涉及在微电子器件晶片的文字街道附近形成多个通过硅通孔的保护环。 微电子器件晶片包括其中通过硅通孔保护环的衬底通过形成完全延伸穿过衬底的通孔来制造。 通过硅通孔保护环作为裂纹捕获器，使得由微电子晶片的切割引起的裂纹引起的缺陷被显着地减少或消除。

公开(公告)号：US08231808B2

公开(公告)日：2012-07-31

申请号：US12453810

申请日：2009-05-22

Applicant: Cheng Yang ,  Matthew Ming Fai Yuen ,  Bing Xu

Inventor： Cheng Yang ,  Matthew Ming Fai Yuen ,  Bing Xu

IPC: H01B1/00 ,  H01B1/02 ,  H01B1/22 ,  B32B5/16 ,  B32B9/00

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2203/125 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

Abstract translation: 形成导电接合材料作为改性导电胶（MECA），由树脂基体和改性导电填料组成。 如果通过提供热固性或热塑性树脂基聚合物树脂形成树脂基体。 导电填料是适用于树脂基体的导电填料的金属填料。 通过施加选自卤素，假卤素或其前体之一的材料来修饰金属填料。

公开(公告)号：US20110042732A1

公开(公告)日：2011-02-24

申请号：US12704511

申请日：2010-02-11

Applicant: Ping Ting Wang ,  Cheng Yang ,  Seung Hyuk Lee ,  Jin Gang Wu

Inventor： Ping Ting Wang ,  Cheng Yang ,  Seung Hyuk Lee ,  Jin Gang Wu

IPC: H01L29/772 ,  H01L21/336

CPC classification number: H01L21/32139 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/0207 ,  H01L27/10855 ,  H01L27/10888 ,  H01L27/10891

Abstract: A method for making contact landing pad structures in a semiconductor integrated circuit device. The method includes forming an isolation region and forming active regions in the semiconductor substrate. The active regions are separated by the isolation region, and each of the active regions includes one or more contact regions. The method includes forming a raised structure between a first and second contact regions. The raised structure overlying the isolation region. The method includes depositing a cap layer and forming an interlayer dielectric layer overlying the cap layer. The method uses a mask pattern to selectively remove a portion of the photoresist layer to form a line type opening, which exposes a portion of the interlayer dielectric layer overlying at least the first and second contact regions. The method deposits a conductive fill material and performs a planarization process, whereby a plurality of conductive landing contact pads are formed.

Abstract translation: 一种用于在半导体集成电路器件中制造接触着陆焊盘结构的方法。 该方法包括形成隔离区并在半导体衬底中形成有源区。 有源区域被隔离区隔开，并且每个有源区域包括一个或多个接触区域。 该方法包括在第一和第二接触区域之间形成凸起结构。 覆盖隔离区的凸起结构。 该方法包括沉积覆盖层并形成覆盖覆盖层的层间电介质层。 该方法使用掩模图案来选择性地去除光致抗蚀剂层的一部分以形成线型开口，其暴露部分至少覆盖第一和第二接触区域的层间电介质层。 该方法沉积导电填充材料并进行平面化处理，从而形成多个导电着陆接触垫。

公开(公告)号：US20080233298A1

公开(公告)日：2008-09-25

申请号：US12068658

申请日：2008-02-08

Applicant: Bing Xu ,  Ping Gao ,  Cheng Yang

Inventor： Bing Xu ,  Ping Gao ,  Cheng Yang

IPC: B05D3/02

CPC classification number: D06M13/432 ,  D06M15/233 ,  D06M15/263 ,  D06M23/08 ,  D06M2200/20

Abstract: A method is described for treating fabrics, yarns and individual fibers to improve the mechanical properties thereof, for example their wrinkle-resistance, by treating the fabric, yarn, and fibers in a solution containing polymer nanoparticles. The nanoparticles include two sizes of particles and an appropriate selection of the nanoparticles to control the degree and mode of cross-linking in the fabric with corresponding control of the mechanical properties. The nanoparticles can be provided with an electrical charge that can be opposite in sign to any charge carried by the fabric in order to enhance the formation of a polymer film on the fabric.

Abstract translation: 描述了一种通过在含有聚合物纳米颗粒的溶液中处理织物，纱线和纤维来处理织物，纱线和单独纤维以改善其机械性能（例如它们的抗皱性）的方法。 纳米颗粒包括两种尺寸的颗粒和适当选择的纳米颗粒以通过相应的机械性能控制来控制织物中交联的程度和模式。 纳米颗粒可以具有与织物承载的任何电荷相反的电荷，以增强织物上聚合物膜的形成。

公开(公告)号：US20080146030A1

公开(公告)日：2008-06-19

申请号：US11615972

申请日：2006-12-23

Applicant: Jingang Wu ,  Fei Luo ,  Guanqie Gao ,  Cheng Yang

Inventor： Jingang Wu ,  Fei Luo ,  Guanqie Gao ,  Cheng Yang

IPC: H01L21/44

CPC classification number: H01L21/76802

Abstract: System and method for direct etching. According to an embodiment, the present invention provides a method for manufacturing an integrated circuit device. The method includes a step for providing a substrate having a contact region, which is provided between a first word line and a second word line. The contact region has an overlying plug structure, which is provided within a thickness of a first dielectric layer. The first dielectric layer includes a portion overlying the plug structure. The first dielectric layer has a planarized surface region. The method also includes a step for forming a first line and a second line and a space provided between the first word line and the second world line. The space is provided within a region overlying the plug structure.

Abstract translation: 用于直接蚀刻的系统和方法 根据实施例，本发明提供一种用于制造集成电路器件的方法。 该方法包括提供具有接触区域的基板的步骤，该接触区域设置在第一字线和第二字线之间。 接触区域具有覆盖的塞子结构，其设置在第一介电层的厚度内。 第一电介质层包括覆盖插塞结构的部分。 第一电介质层具有平坦化的表面区域。 该方法还包括用于形成第一线和第二线以及设置在第一字线和第二世界线之间的空间的步骤。 该空间设置在覆盖插头结构的区域内。

公开(公告)号：US20070001185A1

公开(公告)日：2007-01-04

申请号：US11435842

申请日：2006-05-18

Applicant: Ying Lu ,  Cheng Yang ,  Pong Lai ,  Ching Wu

Inventor： Ying Lu ,  Cheng Yang ,  Pong Lai ,  Ching Wu

IPC: H01L33/00

CPC classification number: G02F1/133603 ,  G02F1/133609 ,  H01L33/58 ,  H01L33/60

Abstract: A LED backlight module including a diffusion plate, at least an optical devices, at least a light-emitting diode and a second reflection surface is provided. The optical device is provided underneath the diffusion plate and has a first reflection surface. The light-emitting diode is provided underneath the optical device, for emitting light to the first reflection surface where first reflection of the light is performed. The second reflection surface is provided underneath the light-emitting diode, for receiving the light of the first reflection and performing second reflection of the received light. By controlling light paths of LED with the optical devices, light emitted from LED may be leaded to a specific direction instead of directly emitting from a front surface of LED, so as to achieve the performance of color-mixing and uniform distribution.

Abstract translation: 提供了包括扩散板的LED背光模块，至少一个光学装置，至少一个发光二极管和第二反射表面。 光学装置设置在扩散板下方并具有第一反射面。 发光二极管设置在光学装置下方，用于将光发射到执行光的第一反射的第一反射表面。 第二反射表面设置在发光二极管的下面，用于接收第一反射的光并对接收的光进行第二反射。 通过利用光学器件控制LED的光路，从LED发出的光可以被引导到特定方向，而不是直接从LED的前表面发射，从而实现混色和均匀分布的性能。

公开(公告)号：US20060279626A1

公开(公告)日：2006-12-14

申请号：US11150047

申请日：2005-06-10

Applicant: Shun Tu ,  Huai Chung ,  Chih Chuang ,  Cheng Yang ,  Chieh Hung ,  Hung Wang

Inventor： Shun Tu ,  Huai Chung ,  Chih Chuang ,  Cheng Yang ,  Chieh Hung ,  Hung Wang

IPC: B41J2/45

CPC classification number: B41J2/45

Abstract: An optics lens structure of LED printer head has a light array mould includes a plurality of LED array and driving chip array mounted at a printed circuit board formed at least two orientation points; and a stationary barrier comprising a housing and fastening parts installed at bottom of the housing which is imbedded an optics rod lens array on the top and has at least two orientation points; wherein the orientation points of the printed circuit board are according to the orientation points of the housing for assembling the light array mould and the stationary barrier.

Abstract translation: LED打印头的光学透镜结构具有光阵列模具，其包括多个LED阵列和安装在形成至少两个取向点的印刷电路板上的驱动芯片阵列; 以及固定屏障，其包括壳体和安装在壳体底部的紧固部件，其在顶部嵌入光学棒状透镜阵列并且具有至少两个取向点; 其中印刷电路板的取向点根据用于组装光阵列模具和固定屏障的壳体的取向点。

公开(公告)号：US20060238467A1

公开(公告)日：2006-10-26

申请号：US11114551

申请日：2005-04-26

Applicant: Chien Hung ,  Huai Chung ,  Chih Chuang ,  Cheng Yang ,  Shun Tu ,  Hung Wang

Inventor： Chien Hung ,  Huai Chung ,  Chih Chuang ,  Cheng Yang ,  Shun Tu ,  Hung Wang

IPC: G09G3/32

CPC classification number: H04N9/31 ,  G09G3/02 ,  G09G3/2003 ,  G09G2300/026

Abstract: A full-color scanning-type LED display is provided, including a scanning LED module, a projection screen and a structure frame. The scanning LED module further includes a red LED row having a plurality of red LEDs, a green LED row having a plurality of green LEDs, a blue LED row having a plurality of blue LEDs, a driver for driving the red, green, and blue LED rows, a plurality of metal conductive lines for connecting these elements of the scanning LED module, and a micro lens structure for focusing and projecting the light emitted from the red, green and blue LED rows. The driver further includes a driving IC and a serving motor. The projection screen is placed at an appropriate distance from scanning LED module, and both are engaged at the fixed distance by the structure frame.

Abstract translation: 提供全彩扫描型LED显示器，包括扫描LED模块，投影屏幕和结构框架。 扫描LED模块还包括具有多个红色LED的红色LED行，具有多个绿色LED的绿色LED行，具有多个蓝色LED的蓝色LED行，用于驱动红色，绿色和蓝色的驱动器 LED行，用于连接扫描LED模块的这些元件的多条金属导线和用于聚焦和投影从红色，绿色和蓝色LED行发射的光的微透镜结构。 驱动器还包括驱动IC和伺服电机。 投影屏放置在与扫描LED模块适当的距离处，并且两者都通过结构框架以固定的距离接合。