Abstract:
In a nonvolatile memory, the select gates (144S) are formed from one conductive layer (e.g. polysilicon or polyside), and the wordlines (144) interconnecting the select gates are made from a different conductive layer (e.g. metal). The wordlines overlie an dielectric (302, 304, 310) formed over control gate lines (134). Each control gate line provides control gates for one column of the memory cells. The adjacent control gate lines for the adjacent memory columns are spaced from each other. The dielectric thickness can be controlled to reduce the capacitance between the wordlines and the control gates. In some embodiments, the floating gates (120) are fabricated in a self-aligned manner using an isotropic etch of the floating gate layer.
Abstract:
In a nonvolatile memory, the select gates (144S) are formed from one conductive layer (e.g. polysilicon or polyside), and the wordlines (144) interconnecting the select gates are made from a different conductive layer (e.g. metal). The wordlines overlie an interlevel dielectric (310) formed over control gates (134). The dielectric thickness can be controlled to reduce the capacitance between the wordlines and the control gates. In some embodiments, the floating gates (120) are fabricated in a self-aligned manner using an isotropic etch of the floating gate layer.
Abstract:
Dielectric regions (210) are formed on a semiconductor substrate between active areas of nonvolatile memory cells. The top portions of the dielectric region sidewalls are etched to recess the top portions laterally away from the active areas. Then a conductive layer is deposited to form the floating gates (410). The recessed portions of the dielectric sidewalls allow the floating gates to be wider at the top. The gate coupling ratio is increased as a result. Other features are also provided.
Abstract:
In a memory cell (110) having multiple floating gates (160), the select gate (140) is formed before the floating gates. In some embodiments, the memory cell also has control gates (170) formed after the select gate. Substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions protrude above the substrate. Then select gate lines (140) are formed. Then a floating gate layer (160) is deposited. The floating gate layer is etched until the substrate isolation regions are exposed. A dielectric (164) is formed over the floating gate layer, and a control gate layer (170) is deposited. The control gate layer protrudes upward over each select gate line. These the control gates and the floating gates are defined independently of photolithographic alignment. In another aspect, a nonvolatile memory cell has at least two conductive floating gates (160). A dielectric layer (164) overlying the floating gate has a continuous feature that overlies the floating gate and also overlays a sidewall of the select gate (140). Each control gate (160) overlies the continuous feature of the dielectric layer and also overlies the floating gate. In another aspect, substrate isolation regions (220) are formed in a semiconductor substrate. Select gate lines cross over the substrate isolation regions. Each select gate line has a planar top surface, but its bottom surface goes up and down over the substrate isolation regions. Other features are also provided.
Abstract:
A method of plating a nanoporous metal membrane is provided where at least a portion of the nanoporous metal member is freely supported on the surface of a metal plating solution containing at least one platable metal and the surface of the metal plating solution is contacted with a plating initiator. The nanoporous metal membrane is allowed to contact the plating solution for a period of time effective to plate at least a portion of the nanoporous metal membrane with the at least one platable metal. The plating initiator is preferably hydrazine.
Abstract:
In a nonvolatile memory cell, the floating gate (160) has an upward protruding portion. This portion can be formed as a spacer over a sidewall of the select gate (140). The spacer can be formed from a layer (160.2) deposited after the layer (160.1) which provides a lower portion of the floating gate. Alternatively, the upward protruding portion and the lower portion can be formed from the same layers or sub-layers all of which are present in both portions. The control gate (170) can be defined without photolithography. Other embodiments are also provided.
Abstract:
A system and method for charging a battery is provided. The method includes applying an excitation current pulse to the battery to determine the battery type and whether the battery is capable of holding a charge. To charge the battery, a series of current pulses are applied in groups with the average current being reduced for each succeeding group to take advantage of changing battery charge acceptance. When the voltage of the battery matches a predetermined value, application of the current pulse groups is ended. A single current pulse is then applied to complete the battery charge.
Abstract:
Detectors and methods for rapid charging each provide efficient recharging of batteries of various types and ratings. During the charging process, the detector preferably monitors battery state of charge (SOC) and/or battery charge acceptance (BCA) in order to select appropriate waveforms for the charging signal. The charging signal may be a pulse width and amplitude modulated current, voltage or power waveform with the amplitude and pulse width of each charging pulse being selected based upon the detected battery SOC and/or BCA.
Abstract:
The present invention is a system and method for enhancing the charging of a battery by exposing the battery to acoustic excitation while the battery is being charged. By adding acoustic excitation to the charging process, the present invention reduces the time needed to charge the battery, reduces the energy needed for charging, and increases the battery's cycle life. The present invention may be used to charge new and used batteries and to rejuvenate dead batteries.