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73 条记录 (耗时 0.025 秒)

    Multi-electrode electrostatic chuck having fuses in hollow cavities
    25.
    发明授权
    Multi-electrode electrostatic chuck having fuses in hollow cavities 失效
    多孔静电卡盘，在中空腔内具有保险丝

    公开(公告)号：US06055150A

    公开(公告)日：2000-04-25

    申请号：US188038

    申请日：1998-11-06

    申请人： Jon Clinton ,  Mark Contreras ,  Anand H. Kumar ,  Shamouil Shamouilian ,  You Wang ,  Surinder Bedi

    发明人： Jon Clinton ,  Mark Contreras ,  Anand H. Kumar ,  Shamouil Shamouilian ,  You Wang ,  Surinder Bedi

    IPC分类号： H01L21/683 ,  H02N13/00

    CPC分类号： H01L21/6833 ,  Y10T279/23

    摘要： A failure resistant electrostatic chuck 20 for holding a substrate 35 during processing of the substrate 35 comprises one or more electrodes 25 covered by an insulator 30, the electrodes 25 capable of electrostatically holding a substrate 35 when a voltage is applied thereto. An electrical power bus 40 comprises one or more output terminals 45 that conduct voltage to the electrodes 25. The fuses 50 are positioned in hollow cavities 55 in the insulator 30, and electrically connect the electrodes 25 in series to the output terminals 45 of the power bus 40. Each fuse 50 can electrically disconnect an electrode 25 from an output terminal 45 when the insulator 30 covering the electrode 25 punctures and exposes the electrode 25 to a plasma process environment thereby causing a plasma current discharge to flow through the fuse 50.

    摘要翻译： 用于在基板35的处理期间保持基板35的耐破坏静电卡盘20包括由绝缘体30覆盖的一个或多个电极25，当施加电压时能够静电保持基板35的电极25。 电力总线40包括向电极25传导电压的一个或多个输出端子45.保险丝50定位在绝缘体30中的空腔55中，并将电极25串联电连接到电源的输出端子45 总线40.当覆盖电极25的绝缘体30刺穿并将电极25暴露于等离子体处理环境时，每个保险丝50可以将电极25与输出端子45电断开，从而使等离子体电流放电流过保险丝50。

    Sliding mechanism
    26.
    发明授权
    Sliding mechanism 有权
    滑动机构

    公开(公告)号：US08428668B2

    公开(公告)日：2013-04-23

    申请号：US12813615

    申请日：2010-06-11

    申请人： You Wang

    发明人： You Wang

    IPC分类号： H04M1/00

    CPC分类号： H04M1/0237

    摘要： A sliding mechanism comprises a main plate, a sliding plate, a sliding enabling member and a biasing assembly. The sliding enabling member is coupled between the sliding plate and the main plate so the sliding plate slidably engages with the main plate. The biasing assembly is coupled between the sliding plate and the main plate. When the sliding plate is slid from a closed position to an intermediate position, the biasing assembly is distorted to exert a force on the sliding plate and the main plate, causing the sliding plate to automatically slide toward an open position once the sliding plate passes the intermediate position.

    摘要翻译： 滑动机构包括主板，滑板，滑动启用构件和偏置组件。 滑动启用构件联接在滑板和主板之间，使得滑动板可滑动地与主板接合。 偏置组件联接在滑板和主板之间。 当滑板从关闭位置滑动到中间位置时，偏压组件变形，以在滑板和主板上施加力，一旦滑板通过滑板，滑板就会自动滑向打开位置 中间位置

    Method and composition for electrochemically polishing a conductive material on a substrate
    27.
    发明授权
    Method and composition for electrochemically polishing a conductive material on a substrate 失效
    在基材上电化学研磨导电材料的方法和组合物

    公开(公告)号：US07879255B2

    公开(公告)日：2011-02-01

    申请号：US11556593

    申请日：2006-11-03

    申请人： Huyen Karen Tran ,  Renhe Jia ,  You Wang ,  Stan D. Tsai ,  Martin S. Wohlert ,  Daxin Mao

    发明人： Huyen Karen Tran ,  Renhe Jia ,  You Wang ,  Stan D. Tsai ,  Martin S. Wohlert ,  Daxin Mao

    IPC分类号： C09K13/00

    CPC分类号： B23H5/08

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 该方法包括提供包括介电特征定义的基底，设置在特征定义中的阻挡材料和以足以填充特征定义的量设置在阻挡材料上的体导电材料; 抛光衬底以基本上去除体导电材料; 抛光残余导电材料以暴露特征定义，包括：施加第一电压第一时间段，其中所述第一电压小于所述临界电压; 以及施加第二时间段的第二电压，其中所述第二电压大于所述临界电压。

    COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING
    28.
    发明申请
    COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING 审中-公开
    用于障碍层抛光的组合物和方法

    公开(公告)号：US20100096360A1

    公开(公告)日：2010-04-22

    申请号：US12579860

    申请日：2009-10-15

    申请人： You Wang ,  Yuchun Wang ,  Yan Wang ,  Kuo-Lih Chang ,  Jin Xu ,  Wen-Chaing Tu

    发明人： You Wang ,  Yuchun Wang ,  Yan Wang ,  Kuo-Lih Chang ,  Jin Xu ,  Wen-Chaing Tu

    IPC分类号： C09K13/00 ,  C23F1/02

    CPC分类号： C09K3/1463 ,  C09G1/02 ,  H01L21/3212

    摘要： Methods and apparatus are provided for polishing barrier layer materials. In one embodiment, a composition is provided for removing at least a barrier material from a substrate surface, including includes a base composition, a silica abrasive, a solvent, a pH between about 7 and about 10, and one or more components selected from the group of a metal passivating compound, an oxidizer, and an alumina abrasive. The composition may be used to chemical mechanical polishing process a substrate surface having a ruthenium-based barrier and one or more material selected from the group of a polysilicon layer, a dielectric layer, or metal layer.

    摘要翻译： 提供了用于抛光阻挡层材料的方法和装置。 在一个实施方案中，提供了用于从基材表面去除至少阻挡材料的组合物，包括基础组合物，二氧化硅磨料，溶剂，约7至约10的pH以及选自下列的一种或多种组分 一组金属钝化剂，氧化剂和氧化铝磨料。 该组合物可以用于化学机械抛光工艺，其具有钌基阻挡层和选自多晶硅层，电介质层或金属层的一种或多种材料的衬底表面。

    Process and composition for conductive material removal by electrochemical mechanical polishing
    29.
    发明授权
    Process and composition for conductive material removal by electrochemical mechanical polishing 失效
    通过电化学机械抛光去除导电材料的工艺和组成

    公开(公告)号：US07582564B2

    公开(公告)日：2009-09-01

    申请号：US11123274

    申请日：2005-05-05

    申请人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu ,  Yuan A. Tian ,  Liang-Yuh Chen

    发明人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu ,  Yuan A. Tian ,  Liang-Yuh Chen

    IPC分类号： H01L21/302

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09G1/02 ,  H01L21/32125 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

    COMPOSITION FOR POLISHING A SUBSTRATE
    30.
    发明申请
    COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
    用于抛光基材的组合物

    公开(公告)号：US20080035882A1

    公开(公告)日：2008-02-14

    申请号：US11877344

    申请日：2007-10-23

    申请人： Junzi Zhao ,  You Wang ,  Feng Liu ,  Stan Tsai

    发明人： Junzi Zhao ,  You Wang ,  Feng Liu ,  Stan Tsai

    IPC分类号： C09K13/06 ,  C09K13/00 ,  C09K13/04

    CPC分类号： H01L21/7684 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32125

    摘要： Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.

    摘要翻译： 提供了用于从衬底表面去除阻挡材料的抛光组合物和方法。 一方面，提供一种组合物，用于从基材表面至少除去阻挡材料，所述基材表面包括酸性电解质体系，一种或多种螯合剂，一种或多种pH调节剂以提供约3至约11的pH，以及 溶剂。 该组合物可用于电化学机械平面化工艺中。 本文所述的抛光组合物和方法通过减小平坦化型缺陷来改善阻挡材料从衬底表面的有效去除速率。