公开(公告)号：US07652368B2

公开(公告)日：2010-01-26

申请号：US11946581

申请日：2007-11-28

申请人： Yoshinari Hayashi ,  Toshikazu Ishikawa ,  Takayuki Hoshino

发明人： Yoshinari Hayashi ,  Toshikazu Ishikawa ,  Takayuki Hoshino

IPC分类号： H01L21/58

CPC分类号： H01L23/49816 ,  H01L22/32 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device having a first semiconductor chip with an SDRAM and a second semiconductor chip with a an MPU controlling the SDRAM. The contour size of the semiconductor device is reduced to a smaller size without impairing the testability of the first semiconductor chip. The two semiconductor chips are stacked over the top surface of an interconnect substrate and sealed in a molding resin, thus forming an SiP (System-in-Package). First terminals electrically connected with the second chip are arranged as external terminals of the SiP on the outer periphery of the bottom surface of the interconnect substrate. Plural second electrodes electrically connected with interconnects, which electrically connect the two chips, are mounted as terminals for testing of the SDRAM. The second electrodes are located more inwardly than the innermost row of the first external electrodes on the bottom surface of the interconnect substrate.

摘要翻译： 具有SDRAM的第一半导体芯片和具有控制SDRAM的MPU的第二半导体芯片的半导体器件。 半导体器件的轮廓尺寸减小到更小的尺寸，而不损害第一半导体芯片的可测试性。 将两个半导体芯片堆叠在互连基板的顶表面上并密封在模制树脂中，从而形成SiP（系统级封装）。 与第二芯片电连接的第一端子被布置为在互连基板的底表面的外周上的SiP的外部端子。 电连接两个芯片的互连电连接的多个第二电极被安装作为用于测试SDRAM的端子。 第二电极比互连基板的底表面上的第一外部电极的最内排更向内定位。

公开(公告)号：US07323773B2

公开(公告)日：2008-01-29

申请号：US11221904

申请日：2005-09-09

申请人： Yoshinari Hayashi ,  Toshikazu Ishikawa ,  Takayuki Hoshino

发明人： Yoshinari Hayashi ,  Toshikazu Ishikawa ,  Takayuki Hoshino

IPC分类号： H01L21/58

CPC分类号： H01L23/49816 ,  H01L22/32 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is disclosed a semiconductor device having first and second semiconductor chips. The first semiconductor chip has a memory circuit. The second semiconductor chip has a circuit controlling the memory circuit. The contour size of the semiconductor device is reduced down to a smaller size required by a client without impairing the testability of the first semiconductor chip having the memory circuit. The circuit controlling the memory circuit consists of an MPU. The memory circuit consists of an SDRAM. The two semiconductor chips are stacked on top of each other over the top surface of an interconnect substrate. The chips are sealed in a molding resin, thus forming an SiP (System-in-Package). First terminals electrically connected with the second chip are arranged as external terminals of the SiP on the outer periphery of the bottom surface of the interconnect substrate. Plural second electrodes electrically connected with interconnects, which electrically connect the two chips, are mounted as terminals for testing of the SDRAM. The second electrodes are located more inwardly than the innermost row of the first external electrodes on the bottom surface of the interconnect substrate.

摘要翻译： 公开了具有第一和第二半导体芯片的半导体器件。 第一半导体芯片具有存储电路。 第二半导体芯片具有控制存储电路的电路。 半导体器件的轮廓尺寸减小到客户所需的较小尺寸，而不损害具有存储电路的第一半导体芯片的可测试性。 控制存储电路的电路由MPU组成。 存储电路由SDRAM组成。 两个半导体芯片在互连衬底的顶表面上彼此堆叠。 将芯片密封在模制树脂中，从而形成SiP（系统级封装）。 与第二芯片电连接的第一端子被布置为在互连基板的底表面的外周上的SiP的外部端子。 电连接两个芯片的互连电连接的多个第二电极被安装作为用于测试SDRAM的端子。 第二电极比互连基板的底表面上的第一外部电极的最内排更向内定位。

公开(公告)号：US5603226A

公开(公告)日：1997-02-18

申请号：US365400

申请日：1994-12-28

申请人： Toshikazu Ishikawa ,  Shigetoshi Doi ,  Shinshi Kajimoto ,  Eiji Ukita ,  Yoshiaki Nagayama ,  Hiroshi Asou ,  Yasuhiro Enno ,  Takashi Tsuchida

发明人： Toshikazu Ishikawa ,  Shigetoshi Doi ,  Shinshi Kajimoto ,  Eiji Ukita ,  Yoshiaki Nagayama ,  Hiroshi Asou ,  Yasuhiro Enno ,  Takashi Tsuchida

IPC分类号： B60H1/00 ,  F25D17/08

CPC分类号： B60H1/00892 ,  B60H1/00735 ,  B60H1/00814 ,  B60H1/00864

摘要： This invention has as its object to provide a method and apparatus for controlling a vehicle air conditioner, which can obtain a combination of an outlet air flow rate V.sub.a and an outlet air temperature T.sub.o, which is desirable for comfort of a passenger, under a condition of air-conditioning control based on a heat balance equation. In order to achieve this object, this invention provides a method of controlling a vehicle air conditioner, including the first step of obtaining, from a heat balance equation, a plurality of combinations of the outlet air flow rates V.sub.a and the outlet air temperatures T.sub.o necessary for maintaining the passenger room temperature to be a predetermined target temperature, the second step of calculating comfort indices each representing the comfort level of a passenger on the basis of state amounts of factors which influence comfort felt by the passenger in the passenger room, and the plurality of combinations of the outlet air flow rates V.sub.a and the outlet air temperatures T.sub.o obtained in the first step, and the third step of searching a combination of the outlet air flow rate and the outlet air temperature, which can provide a comfort index closest to an optimal value of the comfort indices calculated in the second step.

摘要翻译： 本发明的目的是提供一种用于控制车辆空调的方法和装置，其可以在条件下获得出口空气流量Va和出口空气温度To的组合，这对于乘客的舒适是理想的 基于热平衡方程的空调控制。 为了实现该目的，本发明提供了一种控制车辆空调的方法，其包括从热平衡方程式获得出口空气流量Va和出口空气温度的多种组合的第一步骤。 用于将乘员室温度保持为预定目标温度，第二步骤基于影响乘客在乘客室感觉到舒适感的因素的状态量来计算每个代表乘客舒适度的舒适度指标，以及 在第一步骤中获得的出口空气流量Va和出口空气温度To的多个组合，以及搜索出口空气流量和出口空气温度的组合的第三步骤，其可以提供最接近 在第二步骤中计算的舒适度指标的最佳值。

公开(公告)号：US5518065A

公开(公告)日：1996-05-21

申请号：US254106

申请日：1994-06-06

申请人： Hiroshi Asou ,  Eiji Ukita ,  Yasuhiro Enno ,  Takashi Tsuchida ,  Toshikazu Ishikawa

发明人： Hiroshi Asou ,  Eiji Ukita ,  Yasuhiro Enno ,  Takashi Tsuchida ,  Toshikazu Ishikawa

IPC分类号： B60H1/00

CPC分类号： B60H1/00864 ,  B60H1/00814

摘要： An air conditioning control method of a vehicle includes the step of determining a target temperature of a passenger compartment of the vehicle, calculating a comfort index provided as a function of at least an outlet air temperature and outlet air volume flowing out of a heater-air-conditioner system in which air is treated to be introduce to a passenger compartment, setting a target comfort index, determining an optimized combination of the output air temperature and the output air volume which minimizes a deviation of the comfort index from the target comfort index, compensating the target temperature to reduce the deviation when the deviation is greater than a predetermined value. The optimized comfort level can be accomplished quickly through the control.

摘要翻译： 车辆的空调控制方法包括以下步骤：确定车辆的乘客舱的目标温度，计算作为至少出口空气温度和从加热器空气流出的出口空气量的函数而提供的舒适度指标 - 处理系统，其中处理空气被引入乘客舱，设定目标舒适指数，确定输出空气温度和输出空气量的优化组合，其使舒适指数与目标舒适指数的偏差最小化， 补偿目标温度以在偏差大于预定值时减小偏差。 可以通过控制快速完成优化的舒适度。

公开(公告)号：US5102041A

公开(公告)日：1992-04-07

申请号：US631692

申请日：1990-12-19

申请人： Tsutomu Fujiki ,  Toshikazu Ishikawa

发明人： Tsutomu Fujiki ,  Toshikazu Ishikawa

IPC分类号： B60H1/00

CPC分类号： B60H1/00864

摘要： Air conditioning is so implemented as to allow a current of air fed into a passenger compartment of the vehicle to be closer to or approach to a gentle and natural wind by making the applicable voltage to the blower motor variable so as to change the air volume or amount to a subtle extent for a stable period of time when the air volume or amount to be fed into the compartment is reduced to a small level under automatic control.

摘要翻译： 空调被实现为使得馈送到车辆的乘客室中的空气的电流更接近或接近温和自然的风，使得适用于鼓风机电动机的电压可变，以便改变风量或 在自动控制下将空气量或进料室的数量降低到一个较小的水平时，在稳定的时间段内达到微妙程度。