公开(公告)号：US4942282A

公开(公告)日：1990-07-17

申请号：US367164

申请日：1989-06-16

申请人： Wayne P. Jensen

发明人： Wayne P. Jensen

IPC分类号： B23K3/047 ,  H05B3/10 ,  H05K3/34

CPC分类号： B23K3/0471 ,  H05B3/10 ,  H05K3/3421 ,  H05K3/3494

摘要： The transverse member (29) of a reflow soldering heater bar (23) is slotted at intervals to reduce thermal expansion. The slots (63), which typically extend orthogonally through the transverse member (29) and the connecting legs (61) of the heater bar (23), may extend diagonally therethrough to prevent missed welds.

摘要翻译： 回流焊接加热棒（23）的横向构件（29）间隔开以减小热膨胀。 典型地通过横向构件（29）和加热棒（23）的连接腿（61）正交地延伸的槽63可以对角地延伸穿过其中，以防止漏失焊缝。

公开(公告)号：US4894506A

公开(公告)日：1990-01-16

申请号：US246796

申请日：1988-09-20

申请人： Klaus D. Woerner

发明人： Klaus D. Woerner

IPC分类号： B23K3/047 ,  H05K3/34 ,  H05K13/04

CPC分类号： B23K3/0471 ,  H05K13/046 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2203/0195 ,  Y02P70/613

摘要： A method of reflow soldering a row of electrical component leads to a printed circuit board using a heater bar is disclosed. The method involves the steps of, firstly, moving the heater bar to a position above the location of the leads and allowing the heater bar to rock within its plane to float into proper position, and secondly, then clamping the heater bar, supplying voltage to heat the heating element portion of the heater bar, and applying soldering pressure. Corresponding apparatus is disclosed, in which the heater bar is adapted to rock within its plane. The heater bar has a support arm projecting upwardly from the heating element portion. A carriage includes a channel which accommodates the support arm and is somewhat larger in the horizontal dimension in the plane of the heater bar, thereby allowing the heater bar to rock. A clamping bar is movable into the channel for clamping the heater bar via the support arm. Voltage is supplied to the heating element though the contacts between positive and negative contact portions of the clamping bar and support arm respectively.

摘要翻译： 公开了使用加热棒将一排电气部件回流焊接到印刷电路板的方法。 该方法包括以下步骤：首先将加热器棒移动到引线位置上方的位置，并允许加热棒在其平面内摇动以浮动到适当的位置;其次，夹紧加热棒，将电压提供给 加热加热棒的加热元件部分并施加焊接压力。 公开了相应的装置，其中加热棒适于在其平面内摇动。 加热棒具有从加热元件部向上突出的支撑臂。 托架包括容纳支撑臂的通道，并且在加热棒的平面中的水平尺寸上稍大一些，从而允许加热棒摇动。 夹紧杆可移动到通道中，用于通过支撑臂夹紧加热棒。 分别通过夹紧杆和支撑臂的正极和负极接触部分之间的触点将电压提供给加热元件。

公开(公告)号：US4883214A

公开(公告)日：1989-11-28

申请号：US215625

申请日：1988-07-06

申请人： Gero Zimmer

发明人： Gero Zimmer

IPC分类号： B23K3/047 ,  B23K20/233 ,  H05K3/34 ,  H05K13/04

CPC分类号： B23K3/0471 ,  B23K20/2333 ,  H05K13/0465 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2203/0195 ,  Y02P70/613

摘要： A heating apparatus for heating components to be connected to each other which are supported on a thin substrate comprises a U-shaped heating tool which is brought down on the components and a U-shaped support which engages a lower surface of the substrate. Both the tool and the support are heated to reduce a temperature gradient or thermal losses through the substrate. The support also absorbs the forces of the tool when the tool is pressed against the parts to be connected to each other.

摘要翻译： 用于加热彼此连接的部件的加热装置，所述加热装置被支撑在薄的基板上，包括一个U形加热工具，该加工工具被放置在部件上，并且U形支撑件与基板的下表面接合。 加热工具和支撑件以减少通过基底的温度梯度或热损失。 当工具被压靠在彼此连接的部件上时，支撑件还吸收工具的力。

公开(公告)号：US4872604A

公开(公告)日：1989-10-10

申请号：US215626

申请日：1988-07-06

申请人： Gero Zimmer

发明人： Gero Zimmer

IPC分类号： B23K3/047 ,  B23K20/02 ,  H01R43/02 ,  H05K3/34

CPC分类号： B23K3/0471 ,  B23K20/025 ,  H01R43/02 ,  H05K3/3421 ,  H05K2203/0182 ,  H05K2203/0195 ,  Y02P70/613

摘要： An apparatus for connecting one part to another by heating the parts comprises a heated tool with a heating bar, having a heated surface for being brought into contact with the one part and for being moved toward the other part, and a stop mechanism in the form of a mechanical stop bar, or sensing arrangement for stopping the movement of the heated tool toward the other part when a selected spacing between the heated tool and the other part is reached.

摘要翻译： 用于通过加热部件将一个部件连接到另一个部件的装置包括具有加热棒的加热工具，其具有与一个部件接触并被朝向另一部分移动的加热表面，以及形式为止的停止机构 机械止动杆或用于当加热的工具和另一部分之间的选定间隔到达时停止加热的工具向另一部分运动的检测装置。

公开(公告)号：US916140A

公开(公告)日：1909-03-23

申请号：US1907354300

申请日：1907-01-26

申请人： FULTON CO

发明人： FULTON WESTON M

CPC分类号： B23K3/0471

公开(公告)号：US20170203378A1

公开(公告)日：2017-07-20

申请号：US15468138

申请日：2017-03-24

申请人： SAFRAN NACELLES

发明人： Philippe BIENVENU ,  Helene MALOT ,  Charlotte JULIENNE

IPC分类号： B23K1/00 ,  F01D25/24 ,  B23K1/19 ,  B23K3/053 ,  B23K1/008

CPC分类号： B23K1/0018 ,  B23K1/0014 ,  B23K1/008 ,  B23K1/19 ,  B23K3/0471 ,  B23K3/053 ,  B23K2103/14 ,  F01D25/24 ,  F02K1/78 ,  F05D2230/237 ,  F05D2300/133

摘要： The present disclosure relates to a method for producing a final metal part for a nacelle of a turbojet. The method includes brazing at least two parts, one being an inner part having an inner surface and the other being an outer part having an outer surface. The method further includes a step of heating the outer surface of the outer part using an external heating means, and a step of heating the inner surface of the inner part using an internal heating means.

公开(公告)号：US09643272B2

公开(公告)日：2017-05-09

申请号：US14460296

申请日：2014-08-14

申请人： Apple Inc.

发明人： Chiu-Yu Tang ,  Ibuki Kamei ,  Timothy J. Rasmussen

IPC分类号： H01R13/40 ,  H05K3/28 ,  B23K1/20 ,  B23K1/00 ,  B23K3/047 ,  H05K3/34

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K3/0471 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2203/1322 ,  H05K2203/304

摘要： A method for connecting or terminating wires to a printed circuit is disclosed. The method includes applying layers, such as a first layer and a second layer, to the printed circuit. The first layer is applied over several active components on the printed circuit, and provides a sealant against ingress of contaminants in the active components. The second layer is a rigid layer applied over the first layer. When the printed circuit is placed in a fixture, a metallic element, such as a thermode or hot bar, presses against the wires to hold the wires against several terminals on the printed circuit. The metallic element is heated to melt solder between the wires and the terminals. The second layer is configured to resist compressive forces from the metallic element and the fixture, such that the printed circuit and the active components are not damaged during the connection process.

公开(公告)号：US20140034716A1

公开(公告)日：2014-02-06

申请号：US13564542

申请日：2012-08-01

申请人： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Mario Lopez Ruiz

发明人： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Mario Lopez Ruiz

IPC分类号： B23K31/02 ,  B23K3/04

CPC分类号： H01L31/048 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/012 ,  B23K1/018 ,  B23K1/08 ,  B23K1/20 ,  B23K3/04 ,  B23K3/047 ,  B23K3/0471 ,  B23K3/08 ,  B23K2101/38 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  H01L2924/0001

摘要： A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.

摘要翻译： 太阳能电池模块包括焊接到基板的太阳能电池模具。 衬底包括一个或多个电源触点。 电力导体焊接到电源触点，从而将电力导体电耦合到太阳能电池模具。 预热模块将第一区域的衬底的第一侧加热至第一温度持续第一时间。 然后，焊接热源在第二温度下将功率导体焊接到衬底的第二区域处的功率接触持续第二持续时间。 在电源导体处产生的焊接连接不太容易发生冷焊缺陷。 控制预热模块的温度以促进用于制造太阳能电池模块的RTV密封剂的固化。 控制焊料热源的温度以避免RTV密封胶的燃烧和降解。

公开(公告)号：US20060269888A1

公开(公告)日：2006-11-30

申请号：US11444118

申请日：2006-05-31

申请人： Hideki Ogawa

发明人： Hideki Ogawa

IPC分类号： F27D3/00 ,  C23C16/00

CPC分类号： B23K1/008 ,  B23K1/012 ,  B23K3/0471 ,  H05K3/3494

摘要： According to one embodiment, a heating apparatus includes, a heating chamber, a fan provided in the heating chamber, the fan blowing atmosphere upward, a heater provided in the heating chamber and above the fan, the heater heating the atmosphere blown by the fan, a plurality of first straightening vanes arranged in a substantially horizontal direction so as to be spaced apart from one another in the heating chamber and above the heater, a plurality of second straightening vanes arranged in a substantially horizontal direction so as to be spaced apart from one another in the heating chamber and above the first straightening vanes, each of the plurality of second straightening vanes overlapping both of its adjacent first straightening vanes, and a transfer unit which transfers a board, at least part of the transfer unit being provided in the heating chamber and located above the second straightening vanes.

摘要翻译： 根据一个实施例，加热装置包括：加热室，设置在加热室中的风扇，向上风扇吹风;加热器设置在加热室中，风扇上方，加热器加热由风扇吹送的空气; 多个第一矫直叶片，其布置在大致水平的方向上，以在所述加热室中和所述加热器之间彼此间隔开;多个第二矫直叶片，其布置在基本上水平的方向上，以与其间隔开 另一个在加热室中并且在第一矫直叶片上方，多个第二矫直叶片中的每一个与其相邻的第一矫正叶片重叠，以及传送单元，其传送板，至少部分传送单元设置在加热 并且位于第二矫直叶片上方。

公开(公告)号：US06414271B2

公开(公告)日：2002-07-02

申请号：US09863685

申请日：2001-05-22

申请人： Kiyoshi Yokoyama ,  Takafumi Turumaru ,  Hiroyuki Arima ,  Hideaki Shimozuru

发明人： Kiyoshi Yokoyama ,  Takafumi Turumaru ,  Hiroyuki Arima ,  Hideaki Shimozuru

IPC分类号： H05B100

CPC分类号： H05B1/00 ,  B23K3/0471 ,  H01L21/67103 ,  H01L24/81 ,  H01L2924/12042 ,  H01L2924/00

摘要： There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.

摘要翻译： 提供了一种用于将半导体芯片封装在多层基板上的接合加热器，其具有适应各种芯片尺寸的特性，具有优异的维护特性，并且在将半导体芯片的安装时的芯片的不期望的位移制成小至 并且还具有缩短期望温度的温度上升时间。 该接合加热器由用于对待加热物体进行按压的陶瓷工具，用于加热工具的陶瓷加热器，将陶瓷加热器产生的热量主要传递到工具侧的隔热部件和用于将这些部件集成的保持器 将这些构件连接到另一构件，并且工具，陶瓷加热器，隔热构件和保持件可拆卸地结合。