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    Thermal imaging system with thermal image superimposed on a target scene
    21.
    发明授权
    Thermal imaging system with thermal image superimposed on a target scene 失效
    热成像系统，在目标场景下超声图像

    公开(公告)号：US3641348A

    公开(公告)日：1972-02-08

    申请号：US3641348D

    申请日：1969-07-24

    Applicant: BARNES ENG CO

    Inventor： SCHWARZ FRANK

    IPC: G02B23/12 ,  G01J1/02 ,  G01J1/10

    CPC classification number: G02B23/12 ,  G01J5/0815 ,  G01J5/0831 ,  G01J5/0859 ,  G01J5/0896 ,  G01J2005/0077 ,  G01J2005/0081

    Abstract: A field of view which is sighted through a telescope is simultaneously scanned by a rotating reticle and applied to an infrared detector to derive thermal information from the field of view. A light source is modulated by the infrared channel and the intensity-modulated light source is imaged through the same reticle and superimposed on the sight of the telescope. The operator will thus see in the telescope the view of the target scene with a red tinge in those regions in which the target is warm or overheated.

    Abstract translation: 通过望远镜瞄准的视场被旋转的掩模版同时扫描，并被施加到红外检测器以从视野中导出热信息。 光源被红外线通道调制，强度调制的光源通过相同的标线成像，并叠加在望远镜的视线上。 因此，操作者将在望远镜中看到目标场景在目标温暖或过热的区域中具有红色色调的视图。

    THERMOPILE INFRARED SENSOR STRUCTURE WITH A HIGH FILLING LEVEL
    26.
    发明申请
    THERMOPILE INFRARED SENSOR STRUCTURE WITH A HIGH FILLING LEVEL 有权
    具有高填充水平的热像红外传感器结构

    公开(公告)号：US20160025571A1

    公开(公告)日：2016-01-28

    申请号：US14379007

    申请日：2013-01-18

    Applicant: Heimann Sensor GmbH

    Inventor： Frank Herrmann ,  Marion Simon ,  Wilhelm Leneke ,  Bodo Forg ,  Karlheinz Storck ,  Michael Mueller ,  Joerg Schieferdecker

    IPC: G01J5/12 ,  G01J5/08 ,  G01J5/06 ,  G01J5/02

    CPC classification number: G01J5/12 ,  G01J5/023 ,  G01J5/06 ,  G01J5/0815 ,  G01J5/0853

    Abstract: Thermopile infrared sensor structure with a high filling level in a housing filled with a medium (15), consisting of a carrier substrate (11) which has electrical connections (28, 28′) to the outside and is closed with an optical assembly (13), wherein a sensor chip (14) is applied to the carrier substrate (11) in the housing, which chip has a plurality of thermoelectric sensor element structures (16), the so-called “hot contacts” (10) of which are located on individual diaphragms (3) which are stretched across a respective cavity (9) in a silicon carrying body (24) with good thermal conductivity, wherein the “cold contacts” (25) are located on or in the vicinity of the silicon carrying body (24). The problem addressed by the invention is that of specifying a thermopile infrared array sensor (sensor cell) which, with a small chip size, has a high thermal resolution and a particularly high filling level. This sensor is preferably intended to be operated in gas with a normal pressure or a reduced pressure and is intended to be able to be mass-produced in a cost-effective manner under ultra-high vacuum without complicated technologies for closing the housing. This is achieved by virtue of the fact that a radiation collector structure (17) is located above each individual diaphragm (3) of the sensor element structures (16) which spans a cavity (9).

    Abstract translation: 在填充有介质（15）的壳体中具有高填充水平的热电堆红外传感器结构，由具有到外部的电连接（28,28'）并且用光学组件（13）封闭的载体基板（11） ），其中传感器芯片（14）被施加到壳体中的载体基板（11）上，该芯片具有多个热电传感器元件结构（16），所谓的“热触点”（10） 位于在具有良好导热性的硅载体（24）中穿过相应空腔（9）的单个膜片（3）上，其中“冷触点”（25）位于硅载体上或其附近 身体（24）。 本发明解决的问题是指定热电堆红外阵列传感器（传感器单元），其具有小的芯片尺寸，具有高热分辨率和特别高的填充水平。 该传感器优选用于在正常压力或减压下的气体中操作，并且旨在能够在超高真空下以成本有效的方式批量生产，而不需要用于关闭壳体的复杂技术。 这通过以下事实来实现：辐射收集器结构（17）位于跨越空腔（9）的传感器元件结构（16）的每个单独隔膜（3）上方。

    Pyrometer
    27.
    发明授权
    Pyrometer 有权
    高温计

    公开(公告)号：US09028135B1

    公开(公告)日：2015-05-12

    申请号：US13349265

    申请日：2012-01-12

    Applicant: Asia N. Quince ,  Alexander Stein

    Inventor： Asia N. Quince ,  Alexander Stein

    IPC: G01K15/00 ,  G01K19/00

    CPC classification number: G01K15/00 ,  G01J5/041 ,  G01J5/0815 ,  G01J5/10 ,  G01K19/00

    Abstract: A non-contact pyrometer and method for calibrating the same are provided. The pyrometer includes a radiation sensor configured to measure at least a portion of a radiance signal emitted from a target medium and output a voltage that is a function of an average of the absorbed radiance signal, and an optical window disposed proximate the radiation sensor and configured to control a wavelength range of the radiance signal that reaches the radiation sensor. The pyrometer may further include a reflective enclosure configured to receive the target medium therein, wherein the radiation sensor and the optical window are disposed within the reflective enclosure, an amplifier in communication with an output of the radiation sensor, and a data acquisition system in communication with an output of the amplifier.

    Abstract translation: 提供非接触式高温计及其校准方法。 高温计包括辐射传感器，其被配置为测量从目标介质发射的辐射信号的至少一部分并输出作为吸收辐射信号的平均值的函数的电压，以及设置在辐射传感器附近的配置 以控制到达辐射传感器的辐射信号的波长范围。 高温计还可以包括被配置为在其中接收目标介质的反射壳体，其中辐射传感器和光学窗口设置在反射外壳内，放大器与辐射传感器的输出端通信，以及通信中的数据采集系统 具有放大器的输出。

    Thermal detector, thermal detection device and electronic instrument, and method for manufacturing thermal detector
    28.
    发明授权
    Thermal detector, thermal detection device and electronic instrument, and method for manufacturing thermal detector 有权
    热检测器，热检测装置和电子仪器，以及制造热探测器的方法

    公开(公告)号：US09000372B2

    公开(公告)日：2015-04-07

    申请号：US13012906

    申请日：2011-01-25

    Applicant: Yasushi Tsuchiya

    Inventor： Yasushi Tsuchiya

    IPC: H01L27/14 ,  G01J5/08 ,  G01J5/02 ,  H01L27/146

    CPC classification number: G01J5/08 ,  G01J5/02 ,  G01J5/024 ,  G01J5/0806 ,  G01J5/0815 ,  H01L27/14649

    Abstract: A thermal detector includes a substrate, a thermal detection element and a support member. The substrate has a concave portion, a bottom surface of the concave portion forming a light-reflecting curved surface. The thermal detection element includes a light-absorbing film. The support member supports the thermal detection element with a cavity being provided between the substrate and the support member. The light-reflecting curved surface and the light-absorbing film overlap each other in plan view, the light-reflecting curved surface having a projected area in plan view larger than an area of the light-absorbing film.

    Abstract translation: 热检测器包括基板，热检测元件和支撑构件。 基板具有凹部，凹部的底面形成光反射曲面。 热检测元件包括光吸收膜。 支撑构件支撑热检测元件，其中空腔设置在基板和支撑构件之间。 光反射曲面和光吸收膜在平面图中彼此重叠，所述光反射曲面具有比所述光吸收膜的面积大的平面图中的投影面积。

    Planar thermopile infrared microsensor
    29.
    发明授权
    Planar thermopile infrared microsensor 有权
    平面热电堆红外微传感器

    公开(公告)号：US08853632B2

    公开(公告)日：2014-10-07

    申请号：US13062873

    申请日：2009-09-07

    Applicant: Mohamed Boutchich ,  Benoit Bataillou

    Inventor： Mohamed Boutchich ,  Benoit Bataillou

    IPC: G01J5/20 ,  G01J5/00 ,  G01J5/12 ,  G01J5/08 ,  G01J5/02

    CPC classification number: G01J5/12 ,  G01J5/022 ,  G01J5/0806 ,  G01J5/0815 ,  G01J5/0853

    Abstract: An IR sensor comprises a heat sink substrate (10) having portions (12) of relatively high thermal conductivity and portions (14) of relatively low thermal conductivity and a planar thermocouple layer (16) having a hot junction (18) and a cold junction (20), with the hot junction (18) located on a portion (14) of the heat sink substrate with relatively low thermal conductivity. A low thermal conductivity dielectric layer (22) is provided over the thermocouple layer (16), and has a via (24) leading to the hot junction (18). An IR reflector layer (26) covers the low thermal conductivity dielectric layer (22) and the side walls of the via (24). An IR absorber (30; 30′) is within the via. This structure forms a planar IR microsensor which uses a structured substrate and a dielectric layer to avoid the need for any specific packaging. This design provides a higher sensitivity by providing a focus on the thermocouple, and also gives better immunity to gas conduction and convection.

    Abstract translation: IR传感器包括散热基板（10），散热基板（10）具有相对较高导热率的部分（12）和相对较低导热率的部分（14）和具有热接点（18）的平面热电偶层（16） （20），热接头（18）位于散热器衬底的一部分（14）上，导热系数相对较低。 在热电偶层（16）之上提供低导热介电层（22），并且具有通向热连接点（18）的通孔（24）。 IR反射器层（26）覆盖低导热介电层（22）和通孔（24）的侧壁。 IR吸收器（30; 30'）在通孔内。 该结构形成平面的IR微传感器，其使用结构化基板和电介质层以避免对任何特定封装的需要。 该设计通过提供对热电偶的关注而提供更高的灵敏度，并且还对气体传导和对流提供更好的抗扰性。

    Infrared sensor and infrared sensor module
    30.
    发明授权
    Infrared sensor and infrared sensor module 失效
    红外传感器和红外线传感器模块

    公开(公告)号：US08519336B2

    公开(公告)日：2013-08-27

    申请号：US12980227

    申请日：2010-12-28

    Applicant: Makoto Ohhira ,  Fumiji Aita ,  Yutaka Koyama ,  Sho Sasaki

    Inventor： Makoto Ohhira ,  Fumiji Aita ,  Yutaka Koyama ,  Sho Sasaki

    IPC: G01J5/02 ,  G01J5/20

    CPC classification number: G01J5/02 ,  G01J5/0215 ,  G01J5/024 ,  G01J5/04 ,  G01J5/045 ,  G01J5/08 ,  G01J5/0815 ,  G01J5/0853 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14649 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention provides an infrared sensor and an infrared sensor module having reduced noise, improved detection precision, and reduced manufacture cost. The infrared sensor includes a first substrate transmitting infrared light including at least one reduced-pressure and sealed cavity, at least one infrared sensing unit provided on the side of the first substrate, and at least one infrared sensing unit generating an output change. The infrared sensor includes a second substrate stacked on the first substrate with a recess, a reflection face capable of reflecting the infrared light, and at least one arithmetic circuit for amplifying or integrating an output, arranged in such a manner that the reflection face is sandwiched between the at least one sensing unit and the least one arithmetic circuit.

    Abstract translation: 本发明提供一种红外传感器和红外传感器模块，其具有降低的噪声，提高的检测精度和降低的制造成本。 红外线传感器包括透射包括至少一个减压密封空腔的红外光的第一基板，设置在第一基板侧的至少一个红外感测单元和产生输出变化的至少一个红外感测单元。 红外线传感器包括：堆叠在具有凹部的第一基板上的第二基板，能够反射红外光的反射面;以及至少一个用于放大或积分输出的运算电路，以使反射面夹在 在所述至少一个感测单元和所述至少一个运算电路之间。

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