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    METHOD OF CONTROLLING AN LED, AND AN LED CONTROLLER
    3.
    发明申请
    METHOD OF CONTROLLING AN LED, AND AN LED CONTROLLER 有权
    控制LED的方法和LED控制器

    公开(公告)号：US20120001570A1

    公开(公告)日：2012-01-05

    申请号：US13257266

    申请日：2010-02-25

    Applicant: Peter Hubertus Franciscus Deurenberg ,  Gert-Jan Koolen ,  Gian Hoogzaad ,  Radu Surdeanu ,  Pascal Bancken ,  Benoit Bataillou ,  Viet Nguyen Hoang

    Inventor： Peter Hubertus Franciscus Deurenberg ,  Gert-Jan Koolen ,  Gian Hoogzaad ,  Radu Surdeanu ,  Pascal Bancken ,  Benoit Bataillou ,  Viet Nguyen Hoang

    IPC: H05B37/02

    CPC classification number: H05B33/086 ,  H05B33/0815 ,  H05B33/0848

    Abstract: A method is disclosed of controlling a LED, comprising driving the LED with a DC current for a first time, interrupting the DC current for a second time such that the first time and the second time sum to a period, determining at least one characteristic of the LED whilst the DC current is interrupted, and controlling the DC current during a subsequent period in dependence on the at least one characteristic. The invention thus benefits from the simplicity of DC operation. By operating at the LED in a DC mode, rather than say in a PWM mode, the requirement to be able to adjust the duty cycle is avoided. By including interruptions to the DC current, it is possible to utilise the LED itself to act as a sensor in order to determine a characteristic of the LED. The need for additional sensors is thereby avoided.

    Abstract translation: 公开了一种控制LED的方法，包括第一次用DC电流驱动LED，第二次中断DC电流，使得第一时间和第二时间总和到一个周期，确定至少一个特性 所述LED在DC电流中断期间，并且根据所述至少一个特性在随后的时段期间控制所述DC电流。 因此，本发明由于DC操作的简单性而受益。 通过在DC模式下操作LED，而不是在PWM模式下说明，可以避免能够调整占空比的要求。 通过包含直流电流的中断，可以利用LED本身作为传感器，以便确定LED的特性。 从而避免了对附加传感器的需要。

    Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
    5.
    发明申请
    Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate 失效
    用于同时产生至少一对半导体结构的方法，每个半导体结构在衬底上包括至少一个有用层

    公开(公告)号：US20060286770A1

    公开(公告)日：2006-12-21

    申请号：US11509047

    申请日：2006-08-24

    Applicant: Bruno Ghyselen ,  Cecile Aulnette ,  Benoit Bataillou ,  Carlos Mazure ,  Hubert Moriceau

    Inventor： Bruno Ghyselen ,  Cecile Aulnette ,  Benoit Bataillou ,  Carlos Mazure ,  Hubert Moriceau

    IPC: H01L21/30 ,  H01L21/46

    CPC classification number: H01L21/76254 ,  Y10S438/977

    Abstract: A method for producing a semiconductor structure that includes at least one useful layer on a substrate. This method includes providing a source substrate with a zone of weakness therein that defines a relatively thick useful layer between the zone of weakness and a front face of the source substrate; bonding the front face of the source substrate to a support substrate and detaching the useful layer from the source substrate at the zone of weakness to transfer the useful layer to the support substrate; implanting atomic species into a free face of the useful layer to a controlled mean implantation depth therein to form a zone of weakness within the useful layer that defines front and rear useful layers, with the rear useful layer contacting the source substrate and the front useful layer containing a greater concentration of defects; bonding a stiffening substrate to the free face of the front useful layer after implantation of the atomic species; and detaching the front useful layer from the rear useful layer along the zone of weakness to form a semiconductor structure comprising the support substrate and the rear useful layer thereon. The structures obtained can be used in the fields of electronics, optoelectronics or optics.

    Abstract translation: 一种用于制造半导体结构的方法，所述半导体结构在衬底上包括至少一个有用层。 该方法包括提供源极基底中的弱化区域，其在弱化区域和源极基底的前面之间限定相对较厚的有用层; 将源极基板的正面粘合到支撑基板上，并在弱化区域将有用层与源极基板分离，以将有用层转移到支撑基板; 将原子物质植入有用层的自由面中，以在其中形成受控的平均注入深度，以在限定前后有用层的有用层内形成弱化区，其中后部有用层与源极基底和前部有用层接触 含有较大浓度的缺陷; 在加入原子物质之后将加强基底粘合到前有用层的自由面上; 并且沿着弱化区从后部有用层分离前部有用层，以形成包括支撑基板和其上的后部有用层的半导体结构。 所获得的结构可用于电子学，光电子学或光学领域。

    Integrated circuit manufacturing method
    6.
    发明授权
    Integrated circuit manufacturing method 有权
    集成电路制造方法

    公开(公告)号：US08772073B2

    公开(公告)日：2014-07-08

    申请号：US12988110

    申请日：2009-04-14

    Applicant: Viet Nguyen Hoang ,  Radu Surdeanu ,  Benoit Bataillou

    Inventor： Viet Nguyen Hoang ,  Radu Surdeanu ,  Benoit Bataillou

    IPC: H01L21/00 ,  H01L27/146 ,  H01L21/3105

    CPC classification number: H01L27/14685 ,  H01L21/31053 ,  H01L21/31111 ,  H01L27/14621 ,  H01L27/14629

    Abstract: A method of providing a dielectric material (18) having regions (18′, 18″) with a varying thickness in an IC manufacturing process is disclosed. The method comprises forming a plurality of patterns in respective regions (20′, 20″) of the dielectric material (18), each pattern increasing the susceptibility of the dielectric material (18) to a dielectric material removal step by a predefined amount and exposing the dielectric material (18) to the dielectric material removal step. In an embodiment, the IC comprises a plurality of pixilated elements (12) and a plurality of light interference elements (24), each comprising a first mirror element (16) and a second mirror element (22), a region of the dielectric material (18) separating the first mirror element (16) and the second element (22), and each being arranged over one of said pixilated elements (12), the method further comprising forming the respective first mirror elements (16) in a dielectric layer (14) over a substrate (10) comprising the plurality of pixilated elements; depositing the dielectric material over the dielectric layer; and forming the respective second mirror elements such that each second mirror element is separated from a respective first mirror element by a region of the exposed dielectric material. Hence, an IC having a layer of a dielectric material (18) comprising regions of different thicknesses can be obtained requiring only a few process steps.

    Abstract translation: 公开了一种在IC制造过程中提供具有变化厚度的区域（18'，18“）的介电材料（18）的方法。 该方法包括在介电材料（18）的相应区域（20'，20“）中形成多个图案，每个图案将电介质材料（18）的敏感性增加到电介质材料去除步骤预定量并暴露 介电材料（18）到介电材料去除步骤。 在一个实施例中，IC包括多个像素化元件（12）和多个光干涉元件（24），每个元件包括第一镜元件（16）和第二镜元件（22），介电材料的区域 （18）分离第一镜元件（16）和第二元件（22），并且每个被布置在一个所述像素化元件（12）上，所述方法还包括在电介质层中形成相应的第一镜元件（16） （14）包括多个像素化元件的衬底（10）上; 在电介质层上沉积电介质材料; 以及形成各个第二反射镜元件，使得每个第二反射镜元件通过暴露的电介质材料的区域与相应的第一反射镜元件分离。 因此，可以获得具有包括不同厚度的区域的电介质材料层（18）的IC，只需要几个工艺步骤。

    Method of controlling an LED, and an LED controller
    7.
    发明授权
    Method of controlling an LED, and an LED controller 有权
    控制LED的方法和LED控制器

    公开(公告)号：US08723443B2

    公开(公告)日：2014-05-13

    申请号：US13257266

    申请日：2010-02-25

    Applicant: Peter Hubertus Franciscus Deurenberg ,  Gert-Jan Koolen ,  Gian Hoogzaad ,  Radu Surdeanu ,  Pascal Bancken ,  Benoit Bataillou ,  Viet Nguyen Hoang

    Inventor： Peter Hubertus Franciscus Deurenberg ,  Gert-Jan Koolen ,  Gian Hoogzaad ,  Radu Surdeanu ,  Pascal Bancken ,  Benoit Bataillou ,  Viet Nguyen Hoang

    IPC: H05B33/00

    CPC classification number: H05B33/086 ,  H05B33/0815 ,  H05B33/0848

    Abstract: A method is disclosed of controlling a LED, comprising driving the LED with a DC current for a first time, interrupting the DC current for a second time such that the first time and the second time sum to a period, determining at least one characteristic of the LED while the DC current is interrupted, and controlling the DC current during a subsequent period in dependence on the at least one characteristic. The invention thus benefits from the simplicity of DC operation. By operating at the LED in a DC mode, rather than say in a PWM mode, the requirement to be able to adjust the duty cycle is avoided. By including interruptions to the DC current, it is possible to utilize the LED itself to act as a sensor in order to determine a characteristic of the LED. The need for additional sensors is thereby avoided.

    Abstract translation: 公开了一种控制LED的方法，包括第一次用DC电流驱动LED，第二次中断DC电流，使得第一时间和第二时间总和到一个周期，确定至少一个特性 所述LED在DC电流中断期间，并且根据所述至少一个特性在随后的时段期间控制所述DC电流。 因此，本发明由于DC操作的简单性而受益。 通过在DC模式下操作LED，而不是在PWM模式下说明，可以避免能够调整占空比的要求。 通过包含直流电流的中断，可以利用LED本身作为传感器，以便确定LED的特性。 从而避免了对附加传感器的需要。

    Method for production of a very thin layer with thinning by means of induced self-support
    9.
    发明授权
    Method for production of a very thin layer with thinning by means of induced self-support 有权
    通过诱导自支撑生产具有变薄的非常薄层的方法

    公开(公告)号：US07776714B2

    公开(公告)日：2010-08-17

    申请号：US10558621

    申请日：2004-06-03

    Applicant: Hubert Moriceau ,  Chrystelle Lagahe ,  Benoit Bataillou

    Inventor： Hubert Moriceau ,  Chrystelle Lagahe ,  Benoit Bataillou

    IPC: H01L21/30

    CPC classification number: H01L21/76254

    Abstract: The invention relates to a process for obtaining a thin layer made of a first material on a substrate made of a second material called the final substrate, including the following steps: bonding a thick layer of a first material on one of its main faces on the final substrate at an interface, implantation of gaseous species in the thick layer of first material to create a weakened zone delimiting said thin layer between the interface and the weakened zone, deposit a layer of third material called the self-supporting layer on the thick layer made of first material, fracture within the structure composed of the final substrate, the thick layer of first material and the layer of third material, at the weakened zone to supply the substrate supporting said thin layer.

    Abstract translation: 本发明涉及一种获得由第二材料制成的基板上由第一材料制成的薄层的方法，所述第二材料被称为最终基板，包括以下步骤：将第一材料的厚层在其主面之一 在界面处的最终底物，在第一材料的厚层中注入气态物质以产生限定界面和弱化区之间的所述薄层的弱化区，在厚层上沉积称为自支撑层的第三材料层 由第一材料制成，在由最终基底构成的结构内的断裂，第一材料的厚层和第三材料层在弱化区域处供应支撑所述薄层的基板。

    Method and device for measuring bond energy
    10.
    发明授权
    Method and device for measuring bond energy 有权
    用于测量结合能的方法和装置

    公开(公告)号：US07688946B2

    公开(公告)日：2010-03-30

    申请号：US11666368

    申请日：2005-10-24

    Applicant: Francois Rieutord ,  Hubert Moriceau ,  Benoit Bataillou

    Inventor： Francois Rieutord ,  Hubert Moriceau ,  Benoit Bataillou

    IPC: G01N23/20

    CPC classification number: G01N23/20 ,  G01N19/04

    Abstract: The adhesion between two layers, in particular two thin layers of a microelectronic device, is a data item of importance. It was found that the closure ratio of the interface could be used, in non-destructive manner, to determine a measurement of bond energy. A method and a device using a magnitude characteristic of this length are described, in particular using low incidence X-ray reflection and electronic density at the interface.

    Abstract translation: 两层之间的粘附，特别是微电子器件的两个薄层，是重要的数据项。 已经发现界面的封闭比可以以非破坏性方式用于确定键能的测量。 具体地说，使用该长度的幅度特性的方法和装置，特别是在界面处使用低入射X射线反射和电子密度。

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