Abstract:
A semiconductor device includes a group of fin structures. The group of fin structures includes a conductive material and is formed by growing the conductive material in an opening of an oxide layer. The semiconductor device further includes a source region formed at one end of the group of fin structures, a drain region formed at an opposite end of the group of fin structures, and at least one gate.
Abstract:
A computer network-based distributed presentation system and process is presented that controls the display of one or more video streams output by multiple video cameras located across multiple presentation sites on display screens located at each presentation site. The distributed presentation system and process provides the ability for a user at a site to customize the screen configuration (i.e., what video streams are display at any one time and in what format) for that site via a two-layer display director module. In the design layer of the module, a user interface is provided for a user to specify display priorities dictating what video streams are to be displayed on the screen over time. These display priorities are then provided to the execution layer of the module which translates them into probabilistic timed automata and uses the automata to control what is displayed on the display screen.
Abstract:
The present invention, known as The Collaboration Portal (COPO), relates generally to the field of automated entity, data processing, system control, and data communications, and more specifically to an integrated method, system, and apparatus for providing computer-accessible benefits for communities of users. It provides a framework for provisioning computer-accessible benefits for communities of users, and can efficiently and robustly distribute the processing in behalf of those users over a decentralized network of computers. The field of the invention generally encompasses enabling appropriate and desired communication among communities of users and organizations, and providing information, goods, services, a works, opportunities, and connections among users and organizations.
Abstract:
Cyclic voltammetry (CV) may be used with novel sensors for identifying the presence of target sequences complementary to probe sequences. The sensor may include an electrode layer (which is used as a working electrode in a CV system), a conductive polymer layer, and probes immobilized (e.g., via sulfur) on the conductive polymer layer. The conductive polymer layer may be polyaniline, or the like. The probes may be immobilized on the polymer layer using an electro-chemical immobilization technique in the presence of nucleophiles, such as thiol groups for example. The probes may be oligionucleotides. Thus, the sensors may be used for identifying genomic sequence variations and detecting mismatch base pairs, such as single nucleotide polymorphisms (SNPs) for example.
Abstract:
A method of doping fins of a semiconductor device that includes a substrate includes forming multiple fin structures on the substrate, each of the fin structures including a cap formed on a fin. The method further includes performing a first tilt angle implant process to dope a first pair of the multiple fin structures with n-type impurities and performing a second tilt angle implant process to dope a second pair of the multiple fin structures with p-type impurities.
Abstract:
The present invention is directed to compositions and methods related to the synthesis and modification of uridine-5′-diphospho-sulfoquinovose (UDP-SQ). In particular, the methods of the present invention comprise the utilization of recombinant enzymes from Arabidopsis thaliana, UDP-glucose, and a sulfur donor to synthesize UDP-SQ, and the subsequent modification of UDP-SQ to form compounds including, but not limited to, 6-sulfo-α-D-quinovosyl diaclyglycerol (SQDG) and alkyl sulfoquinovoside. The compositions and methods of the invention provide a more simple, rapid means of synthesizing UDP-SQ, and the subsequent modification of UDP-SQ to compounds including, but not limited to, SQDG.
Abstract:
Methods are provided for forming contacts for a semiconductor device. The methods may include depositing various materials, such as polysilicon, nitride, oxide, and/or carbon materials, over the semiconductor device. The methods may also include forming a contact hole and filling the contact hole to form the contact for the semiconductor device.
Abstract:
A method of forming a semiconductor device includes forming a fin on an insulating layer, where the fin includes a number of side surfaces, a top surface and a bottom surface. The method also includes forming a gate on the insulating layer, where the gate has a substantially U-shaped cross-section at a channel region of the semiconductor device.
Abstract:
A semiconductor device may include a substrate and an insulating layer formed on the substrate. A first device may be formed on the insulating layer, including a first fin. The first fin may be formed on the insulating layer and may have a first fin aspect ratio. A second device may be formed on the insulating layer, including a second fin. The second fin may be formed on the insulating layer and may have a second fin aspect ratio different from the first fin aspect ratio.