公开(公告)号：US20190272876A1

公开(公告)日：2019-09-05

申请号：US16417518

申请日：2019-05-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Anh Ly ,  Thuan Vu ,  Vipin Tiwari ,  Nhan Do

IPC: G11C16/08 ,  G11C16/10 ,  G11C16/24 ,  G11C16/34 ,  G11C16/32 ,  G11C16/28 ,  G11C16/14 ,  G11C16/04 ,  G11C16/26

Abstract: A non-volatile memory device is disclosed. The non-volatile memory device comprises an array of flash memory cells comprising a plurality of flash memory cells organized into rows and columns, wherein the array is further organized into a plurality of sectors, each sector comprising a plurality of rows of flash memory cells, and a row driver selectively coupled to a first row and a second row.

公开(公告)号：US10381330B2

公开(公告)日：2019-08-13

申请号：US15921563

申请日：2018-03-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Justin Hiroki Sato ,  Bomy Chen ,  Walter Lundy

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A method of bonding a first substrate to a second substrate, wherein the first substrate includes first electrical contacts on a top surface of the first substrate, and wherein the second substrate includes second electrical contacts on a bottom surface of the second substrate. The method includes forming a block of polyimide on the top surface of the first substrate, wherein the block of polyimide has a rounded upper corner, and vertically moving the top surface of the first substrate and the bottom surface of the second substrate toward each other until the first electrical contacts abut the second electrical contacts, wherein during the moving, the second substrate makes contact with the rounded upper corner of the polyimide causing the first and second substrates to move laterally relative to each other.

公开(公告)号：US20190237142A1

公开(公告)日：2019-08-01

申请号：US16382034

申请日：2019-04-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C16/04 ,  H01L27/11517 ,  G06N3/04

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region, and second and third gates over the floating gate and over the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the third gates in one of the memory cell rows, fourth lines each electrically connect the source regions in one of the memory cell rows, and fifth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first, second or third lines, and provide a first plurality of outputs as electrical currents on the fifth lines.

公开(公告)号：US20190172942A1

公开(公告)日：2019-06-06

申请号：US16166342

申请日：2018-10-22

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L29/788 ,  H01L29/66 ,  H01L29/423 ,  H01L29/49 ,  H01L27/11521

Abstract: A memory device includes a memory cell, a logic device and a high voltage device formed on the same semiconductor substrate. Portions of the upper surface of the substrate under the memory cell and the high voltage device are recessed relative to the upper surface portion of the substrate under the logic device. The memory cell includes a polysilicon floating gate disposed over a first portion of a channel region of the substrate, a polysilicon word line gate disposed over a second portion of the channel region, a polysilicon erase gate disposed over a source region of the substrate, and a metal control gate disposed over the floating gate and insulated from the floating gate by a composite insulation layer that includes a high-K dielectric. The logic device includes a metal gate disposed over the substrate. The high voltage device includes a polysilicon gate disposed over the substrate.

公开(公告)号：US10312248B2

公开(公告)日：2019-06-04

申请号：US14935201

申请日：2015-11-06

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Hung Quoc Nguyen ,  Nhan Do

IPC: G11C16/04 ,  H01L27/11526 ,  H01L27/11519 ,  H01L27/11521 ,  G11C16/14 ,  G11C16/26 ,  H01L29/423 ,  H01L29/788

Abstract: A memory device with memory cell pairs each having a single continuous channel region, first and second floating gates over first and second portions of the channel region, an erase gate over a third portion of the channel region between the first and second channel region portions, and first and second control gates over the first and second floating gates. For each of the pairs of memory cells, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region.

公开(公告)号：US20190164617A1

公开(公告)日：2019-05-30

申请号：US15826345

申请日：2017-11-29

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Vipin Tiwari ,  Nhan Do ,  Steven Lemke ,  Santosh Hariharan ,  Stanley Hong

IPC: G11C16/34 ,  G11C16/10

Abstract: An artificial neural network device that utilizes analog neuromorphic memory that comprises one or more non-volatile memory arrays. The embodiments comprise improved mechanisms and algorithms for tuning the non-volatile memory arrays such that the floating gates of the memory cells can be quickly and accurately injected with the desired amount of charge to signify an analog value utilized as a weight by the artificial neural network.

公开(公告)号：US20190148529A1

公开(公告)日：2019-05-16

申请号：US16245069

申请日：2019-01-10

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Chieng-Sheng Su ,  Nhan Do ,  Chunming Wang

IPC: H01L29/66 ,  H01L29/423 ,  H01L21/28 ,  H01L49/02 ,  H01L27/07 ,  H01L29/08 ,  H01L29/788

Abstract: A simplified method for forming pairs of non-volatile memory cells using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. A pair of spaced apart insulation blocks are formed on the first polysilicon layer. Exposed portions of the first poly silicon layer are removed while maintaining a pair of polysilicon blocks of the first polysilicon layer each disposed under one of the pair of insulation blocks. A second polysilicon layer is formed over the substrate and the pair of insulation blocks in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed between the pair of insulation blocks), a second polysilicon block (disposed adjacent an outer side of one insulation block), and a third polysilicon block (disposed adjacent an outer side of the other insulation block).

公开(公告)号：US20190103470A1

公开(公告)日：2019-04-04

申请号：US16137399

申请日：2018-09-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Chun-Ming Chen ,  Man-Tang Wu ,  Chen-Chih Fan ,  Nhan Do

IPC: H01L29/423 ,  H01L21/28 ,  H01L27/11546 ,  H01L29/08 ,  H01L29/66 ,  H01L27/11521

Abstract: A method of forming a memory device with memory cells in a memory area, and logic devices in first and second peripheral areas. The memory cells each include a floating gate, a word line gate and an erase gate, and each logic device includes a gate. The oxide under the word line gate is formed separately from a tunnel oxide between the floating and erase gates, and is also the gate oxide in the first peripheral area. The word line gates, erase gates and gates in both peripheral areas are formed from the same polysilicon layer. The oxide between the erase gate and a source region is thicker than the tunnel oxide, which is thicker than the oxide under the word line gate.

公开(公告)号：US10249631B2

公开(公告)日：2019-04-02

申请号：US15945161

申请日：2018-04-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Feng Zhou ,  Jeng-Wei Yang ,  Hieu Van Tran ,  Nhan Do

IPC: H01L29/423 ,  H01L27/11521 ,  H01L21/28 ,  H01L29/66 ,  H01L29/788 ,  H01L27/11524

Abstract: A memory device including a silicon substrate having a planar upper surface in a memory cell area and an upwardly extending silicon fin in a logic device area. The silicon fin includes side surfaces extending up and terminating at a top surface. The logic device includes spaced apart source and drain regions with a channel region extending there between (along the top surface and the side surfaces), and a conductive logic gate disposed over the top surface and laterally adjacent to the side surfaces. The memory cell includes spaced apart source and drain regions with a second channel region extending there between, a conductive floating gate disposed over one portion of the second channel region, a conductive word line gate disposed over another portion of the second channel region, a conductive control gate disposed over the floating gate, and a conductive erase gate disposed over the source region.

公开(公告)号：US20190080753A1

公开(公告)日：2019-03-14

申请号：US15701071

申请日：2017-09-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Anh Ly ,  Thuan Vu ,  Stanley Hong ,  Feng Zhou ,  Xian Liu ,  Nhan Do

IPC: G11C13/00 ,  H01L45/00 ,  H01L27/24

Abstract: Various architectures and layouts for an array of resistive random access memory (RRAM) cells are disclosed. The RRAM cells are organized into rows and columns, with each cell comprising a top electrode, a bottom electrode, and a switching layer. Circuitry is included for improving the reading and writing of the array, including the addition of a plurality of columns of dummy RRAM cells in the array used as a ground source, connecting source lines to multiple pairs of rows of RRAM cells, and the addition of rows of isolation transistors.