Abstract:
An array of nanometric dimensions consisting of two or more arms, positioned side by side, wherein the arms are of such nanometric dimensions that the beams can be moved or deformed towards or away from one another by means of a low voltage applied between the beams, whereby to produce a desired optical, electronic or mechanical effect. At nanometer scale dimensions structures previously treated as rigid become flexible, and this flexibility can be engineered since it is a direct consequence of material and dimensions. Since the electrostatic force between the two arms is inversely proportional to the square of the distance, a very considerable force will be developed with a low voltage of the order of 1-5 volts, which is sufficient to deflect the elements towards or away from one another. As preferred, the bulk of the element may comprise an insulating material, and an upper conductive layer is applied on the upper surface, where the element is formed by a nanolithography method such as nanoimprint lithography (NIL). Alternatively the elements may be formed completely of conductive material, where the elements are formed by a CMOS metalization process.
Abstract:
Described is a device for directing an optical signal from a first optical fiber (101, 102, . . . ) along one of a plurality of selectable switching paths each terminating in a corresponding one of a plurality of second optical fibers (401, 402, . . . ) via an optical element (201, 202, . . . ), the optical element (201, 202, . . . ) being moveable by a controllable actuator (60) from a first to a second position to change the switching path of incident optical signal. The optical element (201, 202, . . . ) is slideably mounted in parallel to a first mounting plate (10) comprising a conduit (11) through which the optical signals from the first optical fiber (101, 102, . . . ) can be directed by the optical element (201, 202, . . . ) along the selected one of the switching paths to one of a plurality of conduits (21) in a second mounting plate (20) parallel to the first mounting plate (10), and further to the corresponding one of second optical fibers (401, 402, . . . ).
Abstract:
A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) is removed through openings (101, 102) as formed through a cover (91) to form a cavity (121) that retains and limits the freedom of movement of the movable member (51). The movable member can support a reflective surface (224) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).
Abstract:
In one embodiment a micro device is formed by depositing a sacrificial layer over a metallic electrode, forming a moveable structure over the sacrificial layer, and then etching the sacrificial layer with a noble gas fluoride. Because the metallic electrode is comprised of a metallic material that also serves as an etch stop in the sacrificial layer etch, charge does not appreciably build up in the metallic electrode. This helps stabilize the driving characteristic of the moveable structure. In one embodiment, the moveable structure is a ribbon in a light modulator.
Abstract:
The mirror device has a mirror 2, and a supporting mechanism which elastically supports the mirror 2 on a substrate 1 in a state in which the mirror floats from the substrate 1, so that the mirror can be inclined in an arbitrary direction. The supporting mechanism has three supporting parts 3A, 3B and 3C that mechanically connect the substrate 1 and mirror 2. Each of the supporting parts 3A, 3B and 3C has one or more plate spring parts 5 that are constructed from a thin film consisting of one or more layers. One end portion of each plate spring part 5 is connected to the substrate 1 via a leg part 9 which has a rising part that rises from the substrate 1. The other end portion of the plate spring part 5 is mechanically connected to the mirror 2 via a connecting part which has a rising part that rises from this other end portion. The mirror 2 is supported on the substrate 1 only via the plate spring part 5 of the respective 3A, 3B and 3C. As a result, compactness and mass production characteristics can be greatly improved while maintaining superior optical characteristics.
Abstract:
A multi-layer vertical comb-drive actuator includes a first comb structure having a plurality of first comb fingers and a second comb structure having a plurality of second comb fingers, wherein the first and second comb fingers are substantially interdigitated. The first and second comb fingers may include two or more stacked conductive layers electrically isolated from each other by an insulating layer or an air gap. Alternatively, either the first or second comb fingers may include only one conductive layer. An application of a voltage between the first and second comb fingers causes the second comb structure to move relative to the first comb structure. The present invention includes a 2D-gimble configuration to rotate a movable element along two axis.
Abstract:
A MEMS device for an optical switch may be fabricated using a single wafer, which alleviates the alignment problem associated with a two-piece prior art design. The device has a movable plate, which may act as a mirror, supported on a stationary substrate. The plate rotates with respect to the substrate in response to a voltage applied to a stationary electrode rigidly connected to the substrate. Additional movable and/or stationary electrodes may be implemented to enable bidirectional rotation of the plate. Electrodes may be arranged with respect to each other and/or the plate to form a fringe-field (FF) actuator, which may alleviate the snap-down problem associated with the prior art design. Multiple MEMS devices of the invention may be arrayed in a single integrated structure to form a linear, radial, or two-dimensional array of mirrors.
Abstract:
A bi-stable micro-actuator is formed from a first and a second silicon-on-insulator wafer fused together at an electrical contact layer. A cover with a V-groove defines an optical axis. A collimated optical signal source in the V-groove couples an optical signal to an optical port in the V-groove. A mirror surface on a transfer member blocks or reflects the optical signal. The transfer member has a point of support at the first and second end. The mirror blocks or reflects the optical axis. An expandable structure applies a compressive force between the first and second point of support of the transfer member along a compressive axis to hold the transfer member in a bowed first state or a bowed second state. A control signal applied to a heating element in the expandable structure reduces the compressive force, switching the transfer member to a second state.
Abstract:
Various embodiments of reinforced mirror microstructures for a surface micromachined optical system are disclosed. Multi-layered and structurally reinforced mirror microstructures are disclosed, including both two and three-layer microstructures. Adjacent structural layers in these multi-layered mirror microstructures may be structurally reinforced and interconnected by a plurality of vertically disposed columns, or by a plurality of at least generally laterally extending rails or ribs, or some combination thereof. Various embodiments of a single layered mirror microstructure with a structural reinforcement assembly that cantilevers from a lower surface thereof is also disclosed.
Abstract:
The present invention is generally directed to a method and assembly for elevating and supporting a microstructure of a MEM system generally by engaging a positioning system of the MEM system with a first elevator lifter. The MEM system generally includes a first microstructure (such as a mirror) disposed in vertically spaced relation to a substrate. The positioning system generally includes an actuator assembly movably interconnected with the substrate, an elevator pivotally interconnected with the substrate and further interconnected with the microstructure, and a tether interconnecting the actuator assembly and the elevator. The first elevator lifter is provided to engage the elevator to lift/elevate the microstructure away from the substrate generally after fabrication of the MEM system and prior to utilizing the microstructure in operation of the MEM system.