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公开(公告)号：US09651627B2
公开(公告)日：2017-05-16
申请号：US13853666
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Calvin Leung
CPC classification number: G01R31/3679 , G01R31/3662 , H02J7/0006 , H02J7/0016 , H02J7/0021 , H02J7/0036
Abstract: A device is provided for monitoring the total current discharged from a battery. The device includes a bridge circuit of resistors in which one of the resistors has a resistance which varies according to the current which has passed through it. Whenever the battery passes a current to a load, a small portion of the current is passed through the bridge circuit.
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公开(公告)号：US09638884B2
公开(公告)日：2017-05-02
申请号：US14322054
申请日：2014-07-02
Applicant: STMicroelectronics Pte Ltd.
Inventor： Tin Tun
IPC: G02B7/02
Abstract: A method of selectively bonding a component to a substrate prevents glue displacement onto neighboring components. The method entails shortening a section of the perimeter of a mount wall so that the foot of the mount wall contacts the glue without causing substantial displacement. A cure step hardens and holds the shortened foot of the mount wall in a stationary position, while providing a partial bond. Meanwhile the rest of the mount wall that is not located near contact pads on the substrate has a tall foot that extends to the surface of the substrate and is bonded in the usual way. By modifying the component, it is not necessary to modify either the chemistry of the epoxy or the epoxy dispense operation.
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公开(公告)号：US09618653B2
公开(公告)日：2017-04-11
申请号：US13853801
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian
Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.
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公开(公告)号：US09608029B2
公开(公告)日：2017-03-28
申请号：US13931313
申请日：2013-06-28
Applicant: STMicroelectronics Pte Ltd.
Inventor： Wing Shenq Wong
IPC: H01L27/14 , H01L31/14 , H01L21/00 , H01L27/146
CPC classification number: H01L27/14683 , H01L27/14618 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/16235 , H01L2924/00014 , H01L2924/00
Abstract: Embodiments of the present invention are directed to optical packages having a cover made of transparent material with a recess formed therein and methods of forming same. The recess may be formed in a periphery portion of the transparent material and may have various shapes and configurations. Adhesive is provided in at least a portion of the recess of the transparent material, which secures the transparent material to an image sensor.
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335.发明授权公开(公告)号：US09596748B2
公开(公告)日：2017-03-14
申请号：US13852373
申请日：2013-03-28
Applicant: STMicroelectronics Pte Ltd.
Inventor： Wee Chin Judy Lim
CPC classification number: H05K1/0215 , H05K9/0024 , H05K9/0039 , H05K2201/2018 , Y10T29/49124
Abstract: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.
Abstract translation: 镜头座安装在电路板上并覆盖电路板上的电气部件。 电绝缘装置位于透镜支架和电路板之间。 电路板包括邻近电绝缘装置的接地垫。 透镜座包括与接地垫和电绝缘装置对准的孔。 将导电胶分配到孔中以将透镜安装座电接地到接地垫。 电绝缘装置将导电胶从电气部件密封。 提供了一种将透镜座连接到电路板的方法。
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Patent Agency Ranking
公开(公告)号：US09543282B2
公开(公告)日：2017-01-10
申请号：US14083102
申请日：2013-11-18
Applicant: STMicroelectronics Pte Ltd.
Inventor： Wing Shenq Wong
CPC classification number: H01L25/167 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/81815 , H01L2924/00014 , H01L2924/12041 , H01L2924/12043 , H01L2924/16151 , H01L2924/181 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.
Abstract translation: 一个或多个实施例涉及用于光学装置的包装系统（SiP），包括接近传感器封装。 一个实施例涉及一种光学封装，其包括具有布置在耦合到第一衬底的图像传感器处理器裸片上的多个光学器件的堆叠布置。 在两个光学器件和图像传感器处理器管芯之间提供至少第二衬底。 在一个实施例中，光学封装是接近传感器封装，并且光学器件包括发光二极管管芯和光接收二极管管芯。 在一个实施例中，发光二极管管芯固定到第二衬底的表面，并且光接收二极管管芯固定到第三衬底的表面。 第二和第三基板可以固定到图像传感器处理器管芯的表面或者封装材料的表面。
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337.发明授权Wafer handling station including cassette members with lateral wafer confining brackets and associated methods 有权晶圆处理站包括具有横向晶片限制支架的盒式构件和相关方法公开(公告)号：US09530675B2
公开(公告)日：2016-12-27
申请号：US13622556
申请日：2012-09-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Romolo Recorba Bactasa
IPC: H01L21/673 , H05K13/00
CPC classification number: H01L21/67309 , H01L21/67303 , H05K13/0084 , Y10T29/49826
Abstract: A wafer handling station includes a housing defining a chamber, and a wafer cassette assembly positionable in the chamber. The wafer cassette assembly includes a vertical support, and cassette members carried by the vertical support in spaced relation. Each cassette member includes a base coupled to the vertical support, wafer contact pads on an upper surface of the base and configured to support a wafer thereon, and a pair of wafer brackets carried by the base and configured to engage respective edges of the wafer to laterally confine the wafer.
Abstract translation: 晶片处理站包括限定腔室的壳体和可定位在腔室中的晶片盒组件。 晶片盒组件包括垂直支撑件和由垂直支撑件以间隔关系承载的盒构件。 每个盒构件包括联接到垂直支撑件的基座，在基座的上表面上的晶片接触垫，并且被配置为在其上支撑晶片，以及一对晶片支架，其由基座承载并且被配置为将晶片的相应边缘接合到 横向限制晶片。
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338.发明授权Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming 有权集成电路（IC）卡具有IC模块和减少的接合线应力和形成方法公开(公告)号：US09449912B1
公开(公告)日：2016-09-20
申请号：US14736353
申请日：2015-06-11
Applicant: STMICROELECTRONICS PTE LTD , STMICROELECTRONICS (MALTA) LTD
Inventor： Xueren Zhang , Kim-Yong Goh , Roseanne Duca
IPC: H01L23/48 , H01L23/498 , H01L23/00
CPC classification number: H01L24/06 , G06K19/07728 , G06K19/07745 , H01L23/13 , H01L23/3121 , H01L23/49855 , H01L23/49888 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/04042 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48228 , H01L2224/73265 , H01L2224/85205 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2224/05599 , H01L2924/0665
Abstract: An integrated circuit (IC) module for an IC card includes a plurality of IC card contacts in side-by-side relation. A dielectric support layer is above the contact layer and has a plurality of openings and a first coefficient of thermal expansion (CTE). An IC die is above the dielectric support layer and includes a plurality of bond pads. A bond wire extends from a respective bond pad to a corresponding contact through an adjacent opening in the dielectric support layer. A respective body of fill material is within each opening and has a second CTE. A mold compound body is above the dielectric support layer, the bodies of fill material, and surrounding the IC die. The mold compound body has a third CTE. The first CTE is closer to the second CTE than to the third CTE.
Abstract translation: 用于IC卡的集成电路（IC）模块包括并排关系的多个IC卡触点。 介电支撑层位于接触层之上，并具有多个开口和第一热膨胀系数（CTE）。 IC芯片在电介质支撑层之上，并且包括多个接合焊盘。 接合线通过介电支撑层中的相邻开口从相应的接合焊盘延伸到相应的接触。 相应的填充材料体在每个开口内并且具有第二CTE。 模具复合体在电介质支撑层上方，填充物体，并围绕IC芯片。 模具复合体具有第三CTE。 第一个CTE比第三个CTE更接近第二个CTE。
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339.发明申请公开(公告)号：US20160197113A1
公开(公告)日：2016-07-07
申请号：US14589210
申请日：2015-01-05
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Wing Shenq WONG
IPC: H01L27/146
CPC classification number: H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/16235 , H01L2924/00014
Abstract: An image sensor device may include an interconnect layer, an image sensor IC carried by the interconnect layer and having an image sensing surface, and encapsulation material laterally surrounding the image sensor IC and covering an upper surface of the image sensor IC up to the image sensing surface. The image sensor device may include an optical plate having a peripheral lower surface carried by an upper surface of the encapsulation material and aligned with the image sensing surface, the optical plate being spaced above the image sensing surface to define an internal cavity, and a lens assembly coupled to the encapsulation material and aligned with the image sensing surface.
Abstract translation: 图像传感器装置可以包括互连层，由互连层承载并具有图像感测表面的图像传感器IC，以及侧向围绕图像传感器IC并且覆盖图像传感器IC的上表面的封装材料，直到图像感测 表面。 图像传感器装置可以包括光学板，其具有由封装材料的上表面承载并与图像感测表面对准的周边下表面，光学板在图像感测表面上方间隔开以限定内部空腔，并且透镜 组件耦合到封装材料并与图像感测表面对齐。
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公开(公告)号：US20160190380A1
公开(公告)日：2016-06-30
申请号：US14668309
申请日：2015-03-25
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En LUAN
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , H01L25/167 , H01L31/02002 , H01L31/02325 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92227 , H01L2224/97 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly.
Abstract translation: 接近传感器包括半导体管芯，发光组件，再分配层和封装层。 半导体管芯的表面包括传感器区域和接触焊盘。 透镜位于半导体管芯的传感器区域上方。 发光组件包括具有发光区域的发光器件，位于发光区域上方的透镜以及面向再分布层的接触焊盘。 再分布层的一侧包括接触垫。 电连接器使得半导体管芯的每个接触焊盘与再分配层的接触焊盘中的相应一个电连通。 封装层位于再分配层上，并且至少部分地封装半导体管芯，半导体管芯的传感器区域上的透镜以及发光组件。
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