ELECTRICAL OVERSTRESS DETECTION DEVICE
    351.
    发明申请

    公开(公告)号:US20180088155A1

    公开(公告)日:2018-03-29

    申请号:US15708958

    申请日:2017-09-19

    Abstract: The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, a device configured to monitor electrical overstress (EOS) events includes a pair of spaced conductive structures configured to electrically arc in response to an EOS event, wherein the spaced conductive structures are formed of a material and have a shape such that arcing causes a detectable change in shape of the spaced conductive structures, and wherein the device is configured such that the change in shape of the spaced conductive structures is detectable to serve as an EOS monitor.

    Windowless H-bridge buck-boost switching converter

    公开(公告)号:US09893623B2

    公开(公告)日:2018-02-13

    申请号:US14719945

    申请日:2015-05-22

    Inventor: Hirohisa Tanabe

    CPC classification number: H02M3/1582

    Abstract: A “windowless” H-bridge buck-boost switching converter includes a regulation circuit with an error amplifier which produces a ‘comp’ signal, a comparison circuit which compares ‘comp’ with a ‘ramp’ signal, and logic circuitry which receives the comparison circuit output and a mode control signal indicating whether the converter is to operate in buck mode or boost mode and operates the primary or secondary switching elements to produce the desired output voltage in buck or boost mode, respectively. A ‘ramp’ signal generation circuit operates to shift the ‘ramp’ signal up by a voltage Vslp(p−p)+Vhys when transitioning from buck to boost mode, and to shift ‘ramp’ back down by Vslp(p−p)+Vhys when transitioning from boost to buck mode, thereby enabling the converter to operate in buck mode or boost mode only, with no need for an intermediate buck-boost region.

    Temperature compensated reference voltage circuit

    公开(公告)号:US09864389B1

    公开(公告)日:2018-01-09

    申请号:US15348420

    申请日:2016-11-10

    CPC classification number: G05F1/575

    Abstract: A delta-Vbe based bandgap reference voltage circuit generates a temperature stable reference voltage. First and second paths of the circuit each include a respective transistor coupled in series with a resistance. The collector current density of the transistor in first path is lower than the collector current density of transistor in the other path. A control path is used to generate a 2Vbe voltage that is coupled to the base nodes of the resistors in each path. A resistance that is coupled between a common node of a first end of the two paths and a circuit ground node. The circuit current is controlled by this resistance and a voltage drop of 2ΔVbe is across the resistance. The output reference voltage of the circuit is 2(Vbe+ΔVbe) when stack resistors in each path are used.

    Current Sensor and a Method of Manufacturing a Current Sensor

    公开(公告)号:US20170356934A1

    公开(公告)日:2017-12-14

    申请号:US15179249

    申请日:2016-06-10

    CPC classification number: G01R15/181 G01R19/0092

    Abstract: The present disclosure provides an improved Rogowski-type current sensor. In order to allow the sensing coil and the compensation wire to overlap, the sensor is produced using two boards. The current sensing coil is provided on one board, and the compensation wire is provided on another board. The coil and the wire are arranged such that they at least partially overlap, and ideally the compensation wire is formed entirely within the area defined by the coil, albeit in a different plane. This arrangement makes the current sensor far better at rejecting interference than prior art PCB arrangements. In addition, the coil may be formed on a two-sided board. The board has upper radial elements formed on an upper surface, and lower radial elements formed on lower surface. The radial elements are connected using vias formed in the board. The upper radial elements are arranged in a first plane, and the lower radial elements are formed in a second parallel plane. The upper radial elements are arranged so that they are aligned with the lower radial elements, such that a pair of radial elements form a radial plane that is perpendicular to the board surface. This symmetry ensures excellent sensitivity to currents in a conductor.

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