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    BACKLIGHTING LED POWER DEVICES
    31.
    发明申请
    BACKLIGHTING LED POWER DEVICES 审中-公开
    背光LED电源设备

    公开(公告)号：US20090147513A1

    公开(公告)日：2009-06-11

    申请号：US11950955

    申请日：2007-12-05

    Applicant: Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Matthew L. Sommers ,  Mark J. Mayer ,  Christopher L. Bohler

    Inventor： Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Matthew L. Sommers ,  Mark J. Mayer ,  Christopher L. Bohler

    IPC: F21V7/00 ,  F21V5/00 ,  F21V9/16

    CPC classification number: G02F1/133603 ,  G02B6/0021 ,  G02B6/0031 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133614

    Abstract: A generally planar illumination, display, or backlighting device is disclosed, including a generally planar arrangement of side emitting light emitting diode (LED) devices generating side emitted illumination, and a generally planar arrangement of wavelength conversion elements arranged coplanar with the generally planar arrangement of side emitting light emitting diode (LED) devices. The wavelength conversion elements are interspersed amongst the side emitting LED devices and configured to wavelength convert the side emitted illumination generated by the side emitting LED devices. A display device using such a generally planar illumination device is also disclosed, in which a liquid crystal display (LCD) panel is backlit by the generally planar illumination device.

    Abstract translation: 公开了一种大体上平面的照明，显示器或背光装置，包括产生侧发射照明的侧发射发光二极管（LED）器件的大致平面布置，以及布置为与平面布置共面的波长转换元件 侧发光二极管（LED）装置。 波长转换元件分散在侧面发射LED器件中并且被配置为波长转换由侧向发射LED器件产生的侧发射照明。 还公开了一种使用这种大致平面的照明装置的显示装置，其中液晶显示器（LCD）面板由大体上平面的照明装置背光。

    LED-BASED CHANGEABLE COLOR LIGHT LAMP
    32.
    发明申请
    LED-BASED CHANGEABLE COLOR LIGHT LAMP 失效
    基于LED的可更换颜色光灯

    公开(公告)号：US20090141474A1

    公开(公告)日：2009-06-04

    申请号：US11949143

    申请日：2007-12-03

    Applicant: Boris Kolodin

    Inventor： Boris Kolodin

    IPC: F21V9/16

    CPC classification number: F21V3/04 ,  F21K9/232 ,  F21K9/64 ,  F21V3/12 ,  F21V9/30 ,  F21Y2115/10

    Abstract: Systems and methods are described that facilitate providing a user with interchangeable phosphor-coated shells, or envelopes, for generate different shades and intensities of white light from a single UV light source. The interchangeability of the low-cost phosphor-coated envelopes permits the use of a single light engine, which is the more expensive component of a solid state lamp. In this manner, consumers are provided with a greater number of lighting choices at low cost than can be achieved using conventional single-envelope lamps.

    Abstract translation: 描述了系统和方法，其便于向用户提供可互换的磷光体涂层的外壳或信封，用于从单个UV光源产生不同的阴影和强度的白光。 低成本荧光粉涂覆的信封的互换性允许使用单个光引擎，其是固态灯的更昂贵的部件。 以这种方式，消费者以比使用常规单包络灯可以实现的低成本提供更多数量的照明选择。

    Super thin LED package for the backlighting applications and fabrication method
    34.
    发明申请
    Super thin LED package for the backlighting applications and fabrication method 审中-公开
    超薄LED封装，用于背光应用和制造方法

    公开(公告)号：US20080145960A1

    公开(公告)日：2008-06-19

    申请号：US11639759

    申请日：2006-12-15

    Applicant: Boris Kolodin ,  Ivan Eliashevich ,  Chen-Lun Hsing Chen ,  Stanton E. Weaver

    Inventor： Boris Kolodin ,  Ivan Eliashevich ,  Chen-Lun Hsing Chen ,  Stanton E. Weaver

    IPC: H01L21/00

    CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: First and second light emitting diode (LED) arrays, which each includes a corresponding number of LED dies, are disposed on a substrate proximately and substantially parallel to one another. Each pair of substantially paralleled LED dies of the first and second arrays is covered by substantially transparent optical encapsulant. The optical encapsulant is one of covered by a reflective layer for a UV to visible spectral region and shaped for total internal light reflection. The substrate is diced along an axis extending in parallel and between the first and second LED arrays.

    Abstract translation: 每个包括相应数量的LED管芯的第一和第二发光二极管（LED）阵列被布置在基板上并且基本上彼此平行。 第一和第二阵列的每对基本上平行的LED管芯被基本上透明的光学密封剂覆盖。 光学密封剂是用于UV到可见光谱区域的反射层覆盖的并且被形成用于完全内部光反射的光学密封剂。 衬底沿着平行延伸并且在第一和第二LED阵列之间的轴线切割。

    Support for flip-chip bonding a light emitting chip
    35.
    发明申请
    Support for flip-chip bonding a light emitting chip 失效
    支持倒装芯片连接发光芯片

    公开(公告)号：US20080067537A1

    公开(公告)日：2008-03-20

    申请号：US11520905

    申请日：2006-09-14

    Applicant: Boris Kolodin ,  Michael Hsing ,  Stanton Earl Weaver ,  Ivan Eliashevich ,  Srinath K. Aanegola

    Inventor： Boris Kolodin ,  Michael Hsing ,  Stanton Earl Weaver ,  Ivan Eliashevich ,  Srinath K. Aanegola

    IPC: H01L33/00 ,  H01L21/00

    CPC classification number: H01L33/483 ,  H01L33/62 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

    Abstract: In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

    Abstract translation: 在发光器件中，发光芯片（12,112）包括堆叠的半导体层（14）和设置在半导体层堆叠上的电极（24,141,142）。 支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。 导电芯片附接材料（40,41,141,142）凹入到支撑件的大致平坦的表面中，使得附接材料基本不突出在支撑体的大致平坦的表面上方。 附着材料提供发光芯片的电极与支撑体的导电路径（36,36'）之间的电连通。 可选地，至少半导体层的叠层和发光芯片的电极也凹入到支撑体的大致平坦的表面中。

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