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    MAGNETIC WRITER HAVING MULTIPLE GAPS WITH MORE UNIFORM MAGNETIC FIELDS ACROSS THE GAPS
    33.
    发明申请
    MAGNETIC WRITER HAVING MULTIPLE GAPS WITH MORE UNIFORM MAGNETIC FIELDS ACROSS THE GAPS 有权
    具有更多均匀磁场的多个GAPS的磁性写作

    公开(公告)号：US20110102116A1

    公开(公告)日：2011-05-05

    申请号：US12611294

    申请日：2009-11-03

    Applicant: Robert G. Biskeborn ,  Philipp Herget ,  Bucknell C. Webb

    Inventor： Robert G. Biskeborn ,  Philipp Herget ,  Bucknell C. Webb

    IPC: H01F7/02

    CPC classification number: G11B5/3116 ,  G11B5/17 ,  G11B5/23 ,  G11B5/265 ,  G11B5/2652 ,  G11B5/59638

    Abstract: A magnetic device according to one embodiment includes a source of flux; a magnetic pole coupled to the source of flux, the magnetic pole having two or more gaps; and a low reluctance path positioned towards at least one of the gaps and not positioned towards at least one other of the gaps for affecting a magnetic field formed at the at least one of the gaps when the source of flux is generating flux. Other disclosed embodiments include devices having coil turns with a non-uniform placement in the magnetic yoke for altering a magnetic field formed at the at least one of the gaps during writing. In further embodiments, a geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux.

    Abstract translation: 根据一个实施例的磁性装置包括通量源; 耦合到磁通源的磁极，所述磁极具有两个或更多个间隙; 以及朝向所述间隙中的至少一个定位的低磁阻路径，并且朝向所述间隙中的至少另一个定位，以在所述通量源产生磁通时影响形成在所述至少一个间隙处的磁场。 其他公开的实施例包括具有在磁轭中具有不均匀布置的线圈匝的装置，用于在写入期间改变在至少一个间隙处形成的磁场。 在另外的实施例中，靠近或在其中一个间隙处的磁极的几何形状不同于磁极在靠近或另一个间隙处的几何形状，以帮助当磁通源产生磁通时在间隙处形成的场均衡。

    Through-wafer vias
    35.
    发明授权
    Through-wafer vias 有权
    通晶圆通孔

    公开(公告)号：US07741722B2

    公开(公告)日：2010-06-22

    申请号：US11690181

    申请日：2007-03-23

    Applicant: Paul Stephen Andry ,  Edmund Juris Sprogis ,  Kenneth Jay Stein ,  Timothy Dooling Sullivan ,  Cornelia Kang-I Tsang ,  Ping-Chuan Wang ,  Bucknell C. Webb

    Inventor： Paul Stephen Andry ,  Edmund Juris Sprogis ,  Kenneth Jay Stein ,  Timothy Dooling Sullivan ,  Cornelia Kang-I Tsang ,  Ping-Chuan Wang ,  Bucknell C. Webb

    IPC: H01L23/48

    CPC classification number: H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: A through-wafer via structure and method for forming the same. The through-wafer via structure includes a wafer having an opening and a top wafer surface. The top wafer surface defines a first reference direction perpendicular to the top wafer surface. The through-wafer via structure further includes a through-wafer via in the opening. The through-wafer via has a shape of a rectangular plate. A height of the through-wafer via in the first reference direction essentially equals a thickness of the wafer in the first reference direction. A length of the through-wafer via in a second reference direction is at least ten times greater than a width of the through-wafer via in a third reference direction. The first, second, and third reference directions are perpendicular to each other.

    Abstract translation: 一种晶片通孔结构及其形成方法。 贯通晶片通孔结构包括具有开口和顶部晶片表面的晶片。 顶部晶片表面限定垂直于顶部晶片表面的第一参考方向。 贯通晶片通孔结构还包括在开口中的通晶片通孔。 贯通晶片通孔具有矩形板的形状。 贯通晶片通孔在第一参考方向上的高度基本上等于晶片在第一参考方向上的厚度。 贯穿晶片通孔在第二参考方向上的长度比通过晶片通孔在第三参考方向上的宽度大至少十倍。 第一，第二和第三参考方向彼此垂直。

    THROUGH-WAFER VIAS
    36.
    发明申请
    THROUGH-WAFER VIAS 有权
    通过六角形

    公开(公告)号：US20080274583A1

    公开(公告)日：2008-11-06

    申请号：US11690181

    申请日：2007-03-23

    Applicant: Paul Stephen Andry ,  Edmund Juris Sprogis ,  Kenneth Jay Stein ,  Timothy Dooling Sullivan ,  Cornelia Kang-I Tsang ,  Ping-Chuan Wang ,  Bucknell C. Webb

    Inventor： Paul Stephen Andry ,  Edmund Juris Sprogis ,  Kenneth Jay Stein ,  Timothy Dooling Sullivan ,  Cornelia Kang-I Tsang ,  Ping-Chuan Wang ,  Bucknell C. Webb

    IPC: H01L21/00

    CPC classification number: H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: A through-wafer via structure and method for forming the same. The through-wafer via structure includes a wafer having an opening and a top wafer surface. The top wafer surface defines a first reference direction perpendicular to the top wafer surface. The through-wafer via structure further includes a through-wafer via in the opening. The through-wafer via has a shape of a rectangular plate. A height of the through-wafer via in the first reference direction essentially equals a thickness of the wafer in the first reference direction. A length of the through-wafer via in a second reference direction is at least ten times greater than a width of the through-wafer via in a third reference direction. The first, second, and third reference directions are perpendicular to each other.

    Abstract translation: 一种晶片通孔结构及其形成方法。 贯通晶片通孔结构包括具有开口和顶部晶片表面的晶片。 顶部晶片表面限定垂直于顶部晶片表面的第一参考方向。 贯通晶片通孔结构还包括在开口中的通晶片通孔。 贯通晶片通孔具有矩形板的形状。 贯通晶片通孔在第一参考方向上的高度基本上等于晶片在第一参考方向上的厚度。 贯穿晶片通孔在第二参考方向上的长度比通过晶片通孔在第三参考方向上的宽度大至少十倍。 第一，第二和第三参考方向彼此垂直。

    COOLING STRUCTURE USING RIGID MOVABLE ELEMENTS
    37.
    发明申请
    COOLING STRUCTURE USING RIGID MOVABLE ELEMENTS 失效
    使用刚性可移动元件冷却结构

    公开(公告)号：US20080170370A1

    公开(公告)日：2008-07-17

    申请号：US12055263

    申请日：2008-03-25

    Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

    Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

    IPC: H05K7/20

    CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.

    Abstract translation: 一种信息处理系统，包括：处理器; 记忆 输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。 该系统还包括用于冷却处理器的冷却结构。 冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。

    COMPLIANT THERMAL INTERFACE STRUCTURE UTILIZING SPRING ELEMENTS
    38.
    发明申请
    COMPLIANT THERMAL INTERFACE STRUCTURE UTILIZING SPRING ELEMENTS 失效
    使用弹簧元件的合适的热接口结构

    公开(公告)号：US20080144288A1

    公开(公告)日：2008-06-19

    申请号：US12037067

    申请日：2008-02-25

    Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

    Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

    IPC: H05K7/20

    CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

    Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

    Rotating media recording system with adaptive track density
    40.
    发明授权
    Rotating media recording system with adaptive track density 失效
    具有自适应轨道密度的旋转介质记录系统

    公开(公告)号：US06611395B1

    公开(公告)日：2003-08-26

    申请号：US09432950

    申请日：1999-11-03

    Applicant: Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

    Inventor： Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

    IPC: G11B2102

    CPC classification number: G11B5/59633

    Abstract: A method for writing tracks on a rotating disk media data storage device comprising the steps of: receiving a set of component parameters; and adjusting track pitch for each of the tracks to be written in each disk according to the component parameters. According to another embodiment a disk drive includes at least one disk comprising a two or more of tracks in which the track pitch between each pair of adjacent tracks is set based on component parameters such as the recording head widths. According to another embodiment a servowriter is adapted to perform the method discussed above.

    Abstract translation: 一种用于在旋转盘介质数据存储设备上写入轨迹的方法，包括以下步骤：接收一组分量参数; 以及根据组件参数调整要写入每个磁盘的每个磁道的磁道间距。 根据另一实施例，盘驱动器包括至少一个盘，其包括两个或更多个轨道，其中基于诸如记录头宽度的分量参数设置每对相邻轨道之间的轨道间距。 根据另一实施例，伺服驱动器适于执行上述方法。

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