Abstract:
Processes are disclosed for preparing silicone vesicle compositions and emulsions containing silicone vesicles, the compositions prepared therefrom, and formulated personal and healthcare products containing the silicone vesicles and emulsions compositions.
Abstract:
A method of wafer repairing comprises identifying locations and patterns of defective regions in a semiconductor wafer; communicating the locations and patterns of defective regions to a direct-writing tool; forming a photoresist layer on the semiconductor wafer; locally exposing the photoresist layer within the defective regions using an energy beam; developing the photoresist layer on the semiconductor wafer; and wafer-processing the semiconductor wafer under the photoresist layer after exposing and developing.
Abstract:
Water-continuous emulsion of elastomeric polymers are disclosed having a solids content of greater than 75%, an average particle size less than 5 μm, and having sufficient stability to produce a stable lower solids emulsion upon dilution with water comprising; an elastomeric polymer, surfactant, water, optional plasticizer, optional low molecular weight acid, and is essentially free of organic solvents. The water-continuous emulsions of elastomeric polymers can be prepared by; (I) forming a premix that is essentially free of organic solvents comprising an elastomeric polymer and surfactant, and optionally a plasticizer and low molecular weight acid, and (II) adding water to the premix with mixing to form a water continuous emulsion of the elastomeric polymer having a solids content of greater than 75%, an average particle size less than 5 μm, and having sufficient stability to produce a stable lower solids emulsion upon dilution with water.
Abstract:
Gel compositions are disclosed comprising a silicone elastomer from the reaction of an SiH containing organopolysiloxane resin and an organic compound having at least two aliphatic unsaturated groups in its molecule.
Abstract:
Personal care or healthcare compositions are disclosed comprising a hydrophobic silicone organic elastomer gel blend having viscosity of at least 50 Pa-s. The hydrophobic silicone organic elastomer gel blend contains a silicone organic elastomer and a carrier fluid. The gel blend may be prepared by shearing a silicone organic elastomer or silicone organic elastomer gel with the carrier fluid.
Abstract:
Siloxane resins containing both polyoxyalkylene M siloxy units and alkyl functional M and T siloxy units and aqueous compositions thereof are disclosed. The aqueous compositions contain dispersed particles stabilized by the siloxane resin, and are useful for the entrapment and delivery of various personal, household, and medical care actives.
Abstract:
Siloxane resins containing both polyoxyalkylene M siloxy units and alkyl functional M and T siloxy units and aqueous compositions thereof are disclosed. The aqueous compositions contain dispersed particles stabilized by the siloxane resin, and are useful for the entrapment and delivery of various personal, household, and medical care actives.
Abstract:
A method for forming a semiconductor device includes forming a photoresist layer over a substrate and patterning the photoresist layer to form photoresist portions. A second layer is formed over the substrate in areas not covered by the photoresist portions and the photoresist portions are removed. After removing the photoresist portions, the second layer is used to modify the substrate to create at least a portion of the semiconductor device.
Abstract:
An immersion lithography system is disclosed to comprise a fluid containing feature for providing an immersion fluid for performing immersion lithography on a wafer, and a seal ring covering a predetermined portion of a wafer edge for preventing the immersion fluid from leaking through the covered portion of the wafer edge while the fluid is used for the immersion lithography.
Abstract:
A method and an apparatus for repairing resist latent image on a wafer are disclosed. In the method, an image scanner equipped with a first and a second wafer carrier, and a primary imaging column and a secondary imaging column is utilized to conduct the processes of imaging a resist latent image on a first wafer and repairing a defect in a resist latent image on a second wafer positioned on a second wafer carrier simultaneously. The primary imaging column and the secondary imaging column may be situated in the same vacuum chamber to facilitate operation.