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    Method for cleaning an object soldered with a lead-containing solder
    32.
    发明授权
    Method for cleaning an object soldered with a lead-containing solder 失效
    清洗用含铅焊料焊接的物体的方法

    公开(公告)号：US5863351A

    公开(公告)日：1999-01-26

    申请号：US686274

    申请日：1996-07-25

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: B08B3/08 ,  C11D3/18 ,  C23G5/00 ,  C23G5/024 ,  H01L21/304 ,  H05K3/26 ,  B08B3/04 ,  B01D15/04

    CPC classification number: H05K3/26 ,  C23G5/024 ,  H05K2203/0783

    Abstract: Minute quantities of water in a terpene cleaning solvent cause a reaction with certain metals, particularly lead, tin and copper, which reactions are responsible for corrosion of the metal. Such reactions can be reduced or substantially eliminated by exposing the cleaning solvent to a molecular sieve prior to the cleaning operation. The molecular sieve typically includes a plurality of beads of zeolite to which the cleaning solvent is exposed. The molecular sieve traps the water molecules from the solvent so that, after treatment, the solvent contains substantially no water molecules.

    Abstract translation: 萜烯清洗溶剂中的分钟数量会导致与某些金属，特别是铅，锡和铜的反应，这些反应是导致金属腐蚀的原因。 通过在清洁操作之前将清洁溶剂暴露于分子筛，可以减少或基本消除这些反应。 分子筛通常包括多个清洁溶剂露出的沸石珠。 分子筛从溶剂中捕获水分子，使得在处理后溶剂基本上不含水分子。

    Encapsulant method and apparatus
    33.
    发明授权
    Encapsulant method and apparatus 失效
    封装方法和装置

    公开(公告)号：US5317196A

    公开(公告)日：1994-05-31

    申请号：US936445

    申请日：1992-08-28

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: H01L23/24 ,  H01L23/057 ,  H01L23/22 ,  H01L23/28

    CPC classification number: H01L23/057 ,  H01L23/22 ,  H01L2224/16225 ,  H01L2924/19107 ,  Y10T29/49144 ,  Y10T29/49146

    Abstract: An electronic device (12, 13) is substantially enclosed by a fluid encapsulant (17). The fluid encapsulant consists essentially of a silicone resin and a catalyst selected from the group consisting of platinum and tin. The silicone resin is selected from the group consisting of polydimethylsiloxane, polymethylphenylsiloxane, polydimethyldiphenylsiloxane, and mixtures thereof. Such silicone resins comprise molecules terminating in vinyl components and hydride components. The ratio of vinyl components to hydride components is maintained within the range of five to twenty. As will be explained more fully later, this ratio of vinyl components to hydride components assures that the resin will remain substantially a liquid even after cure, due to limited cross-linking or polymerization during the cure. The electronic device is contained within a container (16) having a sealed cover (18) for containing the liquid encapsulant during the operation of the electronic device.

    Abstract translation: 电子设备（12,13）基本上由流体密封剂（17）封闭。 流体密封剂基本上由硅树脂和选自铂和锡的催化剂组成。 有机硅树脂选自聚二甲基硅氧烷，聚甲基苯基硅氧烷，聚二甲基二苯基硅氧烷及其混合物。 这种有机硅树脂包括终止于乙烯基组分和氢化物组分的分子。 乙烯基组分与氢化物组分的比例保持在5至20的范围内。 如稍后更全面地说明的那样，乙烯基组分与氢化物组分的比例确保了即使在固化之后，由于固化期间交联或聚合的限制，树脂仍将基本上保持液体。 电子设备包含在具有用于在电子设备的操作期间容纳液体密封剂的密封盖（18）的容器（16）内。

    Silicone resin electronic device encapsulant
    34.
    发明授权
    Silicone resin electronic device encapsulant 失效
    硅树脂电子器件密封剂

    公开(公告)号：US5215801A

    公开(公告)日：1993-06-01

    申请号：US726416

    申请日：1991-07-05

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: C23C24/08 ,  C23C26/00 ,  H01L21/56 ,  H01L23/29

    CPC classification number: C23C26/00 ,  C23C24/08 ,  H01L21/56 ,  H01L23/296 ,  H01L2224/16225 ,  Y10T428/239

    Abstract: An electronic device (12) is encapsulated by a curable material (15) which, prior to cure, comprises sixteen to twenty-three weight percent of a silicone resin, forty-six to seventy-three weight percent of silicon dioxide, four to fifteen weight percent of silicon hydride, and six to twenty-five weight percent of xylene. The silicone resin is selected from the group consisting of polydimethylsiloxane, polymethylphenylsiloxane, and a mixture of polydimethylsiloxane and polymethylphenylsiloxane. The silicone resin contains a platinum catalyst and has vinyl and/or hydride functional components.

    Abstract translation: 电子设备（12）被可固化材料（15）封装，固化材料在固化之前包含16至23重量％的有机硅树脂，四十六至七十三重量百分比的二氧化硅，四至十五 重量百分比的硅氢化物和6至25重量％的二甲苯。 有机硅树脂选自聚二甲基硅氧烷，聚甲基苯基硅氧烷以及聚二甲基硅氧烷和聚甲基苯基硅氧烷的混合物。 硅树脂含有铂催化剂并具有乙烯基和/或氢化物官能组分。

    Method of encapsulating an electronic device with a silicone encapsulant
    35.
    发明授权
    Method of encapsulating an electronic device with a silicone encapsulant 失效
    用硅酮密封剂封装电子设备的方法

    公开(公告)号：US5165956A

    公开(公告)日：1992-11-24

    申请号：US766304

    申请日：1991-09-27

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: H01L23/29 ,  H01L23/31

    CPC classification number: H01L23/3142 ,  H01L23/296 ,  H01L23/3135 ,  H01L2924/0002

    Abstract: A silicone rubber potting compound contains an alkoxysilane (.gamma.-glycidoxypropyltrimethoxysilane) as an adhesion promoter. Harmful effects caused by the adhesion promoter are alleviated by using as an additive a titanate having the form Ti(OR).sub.4, where R is an isopropyl, butyl, octyl, or acetylacetonate.

    Abstract translation: 硅橡胶封装化合物含有作为粘合促进剂的烷氧基硅烷（γ-环氧丙氧基丙基三甲氧基硅烷）。 通过使用具有形式Ti（OR）4的钛酸盐作为添加剂，其中R是异丙基，丁基，辛基或乙酰丙酮化物，可以减轻由粘合促进剂引起的有害影响。

    Stabilized silicone gels
    36.
    发明授权
    Stabilized silicone gels 失效
    稳定的硅胶

    公开(公告)号：US4665148A

    公开(公告)日：1987-05-12

    申请号：US805599

    申请日：1985-12-10

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: A61L27/18 ,  C08G77/32 ,  C08J3/24 ,  G06F3/033 ,  G06F3/042 ,  C08G77/06

    CPC classification number: A61L27/18 ,  C08G77/32 ,  C08J3/24 ,  G06F3/0421

    Abstract: A method for preventing unwanted continued polymerization with aging of a polymer, e.g., a silicone gel, which was catalytically cured comprises treating the cured polymer with a catalytic deactivating agent or stabilization of cured resin.

    Abstract translation: 通过催化固化的聚合物例如硅凝胶的老化来防止不期望的持续聚合的方法包括用催化失活剂处理固化的聚合物或固化树脂的稳定化。

    Encapsulated electronic devices and encapsulating compositions
    38.
    发明授权
    Encapsulated electronic devices and encapsulating compositions 失效
    封装的电子器件和封装组合物

    公开(公告)号：US4330637A

    公开(公告)日：1982-05-18

    申请号：US222443

    申请日：1981-01-05

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: C08K5/00 ,  C08K5/34 ,  C08K5/3412 ,  H01B3/30 ,  H01B3/46 ,  H01C1/02 ,  H01L23/29 ,  H01L23/31

    CPC classification number: C08K5/0091

    Abstract: An electronic device such as an integrated circuit is encapsulated within a silicone resin formulation having a metallo-porphyrin compound contained therein. The compound is cleaved by HCl to form a porphyrin diacid chloride and a free metal having the capability of chelating chloride ions and hydroxyl groups thereby preventing corrosion and anionic attack of metallic circuit elements and development of unwanted conductive pathways.

    Abstract translation: 诸如集成电路的电子器件封装在其中包含金属卟啉化合物的硅树脂制剂中。 化合物被HCl裂解形成卟啉二酰氯和具有螯合氯离子和羟基的能力的游离金属，从而防止金属电路元件的腐蚀和阴离子侵袭以及不期望的导电通路的发展。

    Stabilized catalyzed organopolysiloxanes
    39.
    发明授权
    Stabilized catalyzed organopolysiloxanes 失效
    稳定催化的有机聚硅氧烷

    公开(公告)号：US4318939A

    公开(公告)日：1982-03-09

    申请号：US180202

    申请日：1980-08-21

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: C08K5/05 ,  B05D5/12

    CPC classification number: C08K5/05 ,  C08K5/54 ,  Y10S528/901

    Abstract: A method of stabilizing a mixture of an organopolysiloxane and an organo-metallic curing catalyst against gelation comprises adding a sufficient amount of methanol to the catalyst to deactivate the catalyst prior to adding the catalyst to the polysiloxane.

    Abstract translation: 稳定有机聚硅氧烷和有机金属固化催化剂的混合物以防凝胶化的方法包括在催化剂加入到聚硅氧烷中之前，向催化剂中加入足够量的甲醇以使催化剂失活。

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