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    HOLE TRANSPORT MATERIALS
    35.
    发明申请
    HOLE TRANSPORT MATERIALS 有权
    孔输送材料

    公开(公告)号：US20080303427A1

    公开(公告)日：2008-12-11

    申请号：US12129729

    申请日：2008-05-30

    申请人： Gary A. Johansson ,  Eric Maurice Smith ,  Daniel David Lecloux

    发明人： Gary A. Johansson ,  Eric Maurice Smith ,  Daniel David Lecloux

    IPC分类号： H01L51/52 ,  C07C211/57 ,  C07C211/54

    CPC分类号： C07C211/58 ,  C07C211/54 ,  H01L51/001 ,  H01L51/0035 ,  H01L51/0059 ,  H01L51/006

    摘要： There is provided a hole transport compound having Formula I or Formula II: Ar1 is the same or different at each occurrence and can be phenylene, naphthylene, or binaphthylene. Ar2 is the same or different at each occurrence and can be phenyl, biphenyl, terphenyl, naphthyl, or binaphthyl. m and n are the same or different and are an integer greater than 0. T is the same or different at each occurrence and is a conjugated moiety including at least one triarylamino group. The T moiety is connected in a non-planar configuration.

    摘要翻译： 提供具有式I或式II的空穴传输化合物：Ar1在每次出现时相同或不同，可以是亚苯基，亚萘基或亚萘基。 Ar2在每次出现时相同或不同，可以是苯基，联苯基，三联苯基，萘基或联萘。 m和n相同或不同，为大于0的整数.T在每次出现时相同或不同，为包含至少一个三芳基氨基的共轭部分。 T部分以非平面构型连接。

    Structure for preventing adhesive bleed onto surfaces
    37.
    发明授权
    Structure for preventing adhesive bleed onto surfaces 失效
    用于防止粘合剂渗透到表面上的结构

    公开(公告)号：US06252307B1

    公开(公告)日：2001-06-26

    申请号：US09537959

    申请日：2000-03-28

    申请人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    发明人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    IPC分类号： H01L2100

    CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/4864 ,  H01L23/49894 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

    摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.

    摘要翻译： 提供了一种方法和结构，用于当将I / C芯片附着到基板上时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属线接合焊盘上的润湿或渗出。 该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。 化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。 这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。 与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。 烃段在贵金属上呈现具有低分子表面张力的分子的特征的表面，并且因此防止了环氧粘合剂组分对贵金属的润湿。一旦它们提供 防止裸片的泄漏附着粘合剂，在引线接合或焊接温度期间自身解吸。